BACKSIDE VIEW
PAD 1
ASSEMBLY DIAGRAM
CONTROLLED DOCUMENT
Printed : 14-MAY-2001 08:56:04 EST
Speciļ¬cation No : ADD-51928XXXEPN Issue : 0
Effective : 27-SEP-2000 14:46:03 Status : RELEASED
Package : EPN
40 LEAD PDIP
Metal ID : Scale : 20X
X
Y
.200 .200
Die Area: 18375 sq mils (11.855 sq mm)
Die size: X = 147 mils (3734 microns) Y = 125 mils (3175 microns) Thickness = 20 mils
Die Attach
Bond Wire
Mold Compound
Frame
Special Note : 1) OFFSET DIE FROM CENTER LINE TO RIGHT, SEE ABOVE.
84-1LMISR4
1.2 MIL GOLD
S6300H
R004-0041
PLASTIC_PKG Data as of 14-MAY-2001 08:56:27 by sherpa at farview
These Drawings & Specifications are the Property of Intersil Corp. & shall not be used, reproduced or copied without Written Permission.
Cavity size
