TLP293
1
Photocouplers Infrared LED & Photo Transistor
TLP293
TLP293
TLP293
TLP293
Start of commercial production
2013-09
1.
1.
1.
1. Applications
Applications
Applications
Applications
• Switching Power Supplies
• Programmable Logic Controllers (PLCs)
• I/O Interface Boards
2.
2.
2.
2. General
General
General
General
TLP293 is a low input and high isolation type photocoupler that consists of a phototransistor optically coupled
to an infrared LED in a SO4 package.
Since TLP293 is guaranteed high isolation voltage (3750 Vrms) and wide operating temperature (Ta = -55 to 125
), it is suitable for high density surface mounting applications such as programmable controllers.
3.
3.
3.
3. Features
Features
Features
Features
(1) Collector-emitter voltage: 80 V (min)
(2) Current transfer ratio: 50 % (min) (@IF = 0.5 mA, VCE = 5 V)
GB Rank: 100 % (min) (@IF = 0.5 mA, VCE = 5 V)
(3) Isolation voltage: 3750 Vrms (min)
(4) Operating temperature: -55 to 125
(5) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
(Note 1)
(Note 1)
(Note 1)
CQC-approved: GB4943.1, GB8898 Thailand Factory
Note 1: When a VDE approved type is needed, please designate the Option (V4)
Option (V4)
Option (V4)
Option (V4).
4.
4.
4.
4. Packaging and Pin Assignment
Packaging and Pin Assignment
Packaging and Pin Assignment
Packaging and Pin Assignment
11-3C1
1: Anode
2: Cathode
3: Emitter
4: Collector
2019-11-29
Rev.6.0
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Toshiba Electronic Devices & Storage Corporation
TLP293
2
5.
5.
5.
5. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Creepage distances
Clearance
Internal isolation thickness
Min
5.0
5.0
0.4
Unit
mm
6.
6.
6.
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Common
Characteristics
Input forward current
Input forward current derating
Input forward current (pulsed)
Input reverse voltage
Input power dissipation
Input power dissipation
derating
Junction temperature
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Collector power dissipation
derating
Junction temperature
Operating temperature
Storage temperature
Lead soldering temperature
Total power dissipation
Total power dissipation
derating
Isolation voltage
(Ta ≥ 90 )
(Ta ≥ 90 )
(Ta ≥ 25 )
(10 s)
(Ta ≥ 25 )
AC, 60 s, R.H. ≤ 60 %
Symbol
IF
∆IF/∆Ta
IFP
VR
PD
∆PD/∆Ta
Tj
VCEO
VECO
IC
PC
∆PC/∆Ta
Tj
Topr
Tstg
Tsol
PT
∆PT/∆Ta
BVS
Note
(Note 1)
(Note 2)
Rating
50
-1.11
1
5
100
-2.22
135
80
7
50
150
-1.36
135
-55 to 125
-55 to 125
260
200
-1.82
3750
Unit
mA
mA/
A
V
mW
mW/
V
V
mA
mW
mW/
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 0.1 ms, f = 100 Hz
Note 2: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
2019-11-29
Rev.6.0
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Toshiba Electronic Devices & Storage Corporation
TLP293
3
7.
7.
7.
7. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Characteristics
Input forward voltage
Input reverse current
Input capacitance
Collector-emitter breakdown
voltage
Emitter-collector breakdown
voltage
Dark Current
Collector-emitter capacitance
Symbol
VF
IR
Ct
V(BR)CEO
V(BR)ECO
IDARK
CCE
Note Test Condition
IF = 10 mA
VR = 5 V
V = 0 V, f = 1 MHz
IC = 0.5 mA
IE = 0.1 mA
VCE = 48 V
VCE = 48 V, Ta = 85
V = 0 V, f = 1 MHz
Min
1.1
80
7
Typ.
1.25
30
0.01
2
10
Max
1.4
5
0.08
50
Unit
V
µA
pF
V
V
µA
pF
8.
8.
8.
8. Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Current transfer ratio
Saturated current transfer ratio
Collector-emitter saturation voltage
OFF-state collector current
Symbol
IC/IF
IC/IF(sat)
VCE(sat)
IC(off)
Note
(Note 1)
Test Condition
IF = 5 mA, VCE = 5 V
IF = 5 mA, VCE = 5 V, GB Rank
IF = 0.5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V, GB Rank
IF = 1 mA, VCE = 0.4 V
IF = 1 mA, VCE = 0.4 V, GB Rank
IC = 2.4 mA, IF = 8 mA
IC = 0.2 mA, IF = 1 mA
IC = 0.2 mA, IF = 1 mA, GB Rank
VF = 0.7 V, VCE = 48 V
Min
50
100
50
100
30
Typ.
60
0.2
Max
600
600
600
600
0.3
0.3
10
Unit
%
V
µA
Note 1: See Table 8.1 for current transfer ratio.
Table
Table
Table
Table 8.1
8.1
8.1
8.1 Current Transfer Ratio (CTR) Rank (Note) (Unless otherwise specified, T
Current Transfer Ratio (CTR) Rank (Note) (Unless otherwise specified, T
Current Transfer Ratio (CTR) Rank (Note) (Unless otherwise specified, T
Current Transfer Ratio (CTR) Rank (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Rank
Blank
Y
GR
GB
BL
YH
GRL
GRH
BLL
Rank
short
code
GL
GH
B
Note
(Note 1)
(Note 1)
(Note 1)
Test Condition
IF = 5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
IF = 0.5 mA, VCE = 5 V
Current transfer ratio
IC/IF
(min)
50
50
100
100
200
75
100
150
200
Current transfer ratio
IC/IF
(max)
600
150
300
600
600
150
200
300
400
Marking of
classification
Blank, YE, GR, GB,
BL, Y+, G, G+, B
YE
GR
GB, GR, BL
BL
Y+
G
G+
B
Unit
%
Note: Specify both the part number and a rank in this format when ordering.
Example: TLP293(GB,E
For safety standard certification, however, specify the part number alone.
Example: TLP293(GB,E → TLP293
Note 1: A rank in the order name is sometimes omitted like above "Rank short code".
2019-11-29
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Toshiba Electronic Devices & Storage Corporation
TLP293
4
9.
9.
9.
9. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note
(Note 1)
(Note 1)
(Note 1)
Test Condition
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60 %
AC, 60 s
Min
1012
3750
Typ.
0.8
1014
Max
Unit
pF
Ω
Vrms
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
10.
10.
10.
10. Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Rise time
Fall time
Turn-on time
Turn-off time
Turn-on time
Storage time
Turn-off time
Turn-on time
Storage time
Turn-off time
Symbol
tr
tf
ton
toff
ton
ts
toff
ton
ts
toff
Note Test Condition
VCC = 10 V, IC = 2 mA,
RL = 100 Ω
See Fig. 10.1
RL = 1.9 kΩ, VCC = 5 V,
IF = 16 mA
See Fig. 10.1
RL = 4.7 kΩ, VCC = 5 V,
IF = 1.6 mA
Min
Typ.
2
3
3
3
1.3
20
35
10
9
47
Max
Unit
µs
Fig.
Fig.
Fig.
Fig. 10.1
10.1
10.1
10.1 Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
2019-11-29
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TLP293
5
11.
11.
11.
11. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 11.1
11.1
11.1
11.1 I
I
I
IF
F
F
F - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 11.2
11.2
11.2
11.2 P
P
P
PC
C
C
C - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 11.3
11.3
11.3
11.3 I
I
I
IFP
FP
FP
FP - D
- D
- D
- DR
R
R
RFig.
Fig.
Fig.
Fig. 11.4
11.4
11.4
11.4 I
I
I
IF
F
F
F - V
- V
- V
- VF
F
F
F
Fig.
Fig.
Fig.
Fig. 11.5
11.5
11.5
11.5 ∆
∆
∆
∆V
V
V
VF
F
F
F/
/
/
/∆
∆
∆
∆T
T
T
Ta
a
a
a - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 11.6
11.6
11.6
11.6 I
I
I
IFP
FP
FP
FP - V
- V
- V
- VFP
FP
FP
FP
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TLP293
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Fig.
Fig.
Fig.
Fig. 11.7
11.7
11.7
11.7 I
I
I
IC
C
C
C - V
- V
- V
- VCE
CE
CE
CE Fig.
Fig.
Fig.
Fig. 11.8
11.8
11.8
11.8 I
I
I
IC
C
C
C - V
- V
- V
- VCE
CE
CE
CE
Fig.
Fig.
Fig.
Fig. 11.9
11.9
11.9
11.9 I
I
I
IDARK
DARK
DARK
DARK - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 11.10
11.10
11.10
11.10 V
V
V
VCE(sat)
CE(sat)
CE(sat)
CE(sat) - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 11.11
11.11
11.11
11.11 I
I
I
IC
C
C
C - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 11.12
11.12
11.12
11.12 I
I
I
IC
C
C
C/I
/I
/I
/IF
F
F
F - I
- I
- I
- IF
F
F
F
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Fig.
Fig.
Fig.
Fig. 11.13
11.13
11.13
11.13 I
I
I
IC
C
C
C - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 11.14
11.14
11.14
11.14 Switching Time - R
Switching Time - R
Switching Time - R
Switching Time - RL
L
L
L
Fig.
Fig.
Fig.
Fig. 11.15
11.15
11.15
11.15 Switching Time - T
Switching Time - T
Switching Time - T
Switching Time - Ta
a
a
aFig.
Fig.
Fig.
Fig. 11.16
11.16
11.16
11.16 Switching Time - R
Switching Time - R
Switching Time - R
Switching Time - RL
L
L
L
Fig.
Fig.
Fig.
Fig. 11.17
11.17
11.17
11.17 Switching Time - T
Switching Time - T
Switching Time - T
Switching Time - Ta
a
a
a
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2019-11-29
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Toshiba Electronic Devices & Storage Corporation
TLP293
8
12.
12.
12.
12. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
12.1.
12.1.
12.1.
12.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 12.1.1
12.1.1
12.1.1
12.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
• When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
12.2.
12.2.
12.2.
12.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2019-11-29
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TLP293
9
13.
13.
13.
13. Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
14.
14.
14.
14. Marking
Marking
Marking
Marking
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15.
15.
15.
15. EN 60747-5-5 Option (V4) Specification
EN 60747-5-5 Option (V4) Specification
EN 60747-5-5 Option (V4) Specification
EN 60747-5-5 Option (V4) Specification
• Part number: TLP293 (Note 1)
(Note 1)
(Note 1)
(Note 1)
• The following part naming conventions are used for the devices that have been qualified according to
option (V4) of EN 60747.
Example: TLP293(V4GR-TL,E
V4: EN 60747 option
GR: CTR rank
TL: Tape type (L direction: TPL)
E: [[G]]/RoHS COMPATIBLE (Note 2)
(Note 2)
(Note 2)
(Note 2)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP293(V4GR-TL,E → TLP293
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Fig.
Fig.
Fig.
Fig. 15.1
15.1
15.1
15.1 EN 60747 Insulation Characteristics
EN 60747 Insulation Characteristics
EN 60747 Insulation Characteristics
EN 60747 Insulation Characteristics
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Table
Table
Table
Table 15.1
15.1
15.1
15.1 Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Parameters
Minimum creepage distance
Minimum clearance
Minimum insulation thickness
Comparative tracking index
Symbol
Cr
Cl
ti
CTI
TLP293
5.0 mm
5.0 mm
0.4 mm
175
Note: This photocoupler is suitable for safe electrical isolation
safe electrical isolation
safe electrical isolation
safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig.
Fig.
Fig.
Fig. 15.2
15.2
15.2
15.2 Marking on packing for EN 60747
Marking on packing for EN 60747
Marking on packing for EN 60747
Marking on packing for EN 60747
Fig.
Fig.
Fig.
Fig. 15.3
15.3
15.3
15.3 Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN 60747.
2019-11-29
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Fig.
Fig.
Fig.
Fig. 15.4
15.4
15.4
15.4 Measurement Procedure
Measurement Procedure
Measurement Procedure
Measurement Procedure
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16.
16.
16.
16. Ordering Information
Ordering Information
Ordering Information
Ordering Information
When placing an order, please specify the part number, CTR rank, tape type and quantity as shown in the
following example.
Example) TLP293(GR-TPL,E 5000 pcs
Part number: TLP293
CTR rank: GR
Tape type: TPL (L direction)
[[G]]/RoHS COMPATIBLE: E (Note 1)
(Note 1)
(Note 1)
(Note 1)
Quantity (must be a multiple of 2500): 5000 pcs
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
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Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
Weight: 0.05 g (typ.)
Package Name(s)
TOSHIBA: 11-3C1
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RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2019-11-29
Rev.6.0
©2016-2019
Toshiba Electronic Devices & Storage Corporation
