1. General description
The NX1117C/NX1117CE are two series of low-dr opout positive voltage regulator s with an
output current capability of 1 A. The two series consist of 18 fixed output voltage versions
and two adjustable output voltage versions. NX1117C series offers an output voltage
accuracy of 1 % and NX1117CE series of 1.25 %.
The regulators feature output current limiting, Safe Operating Area (SOA) control, and
thermal shutdown.
The NX1117C/NX1117CE series are housed in a medium power SOT223 (SC-73)
Surface-Mounted Device (SMD) plastic package.
2. Features and benefits
NX1117C; NX1117CE series
Low-dropout linear regulators
Rev. 1 — 18 July 2011 Product data sheet
SOT223
Table 1. Product overview
Output voltage Vout (V) Output voltage accuracy
of 1% Output voltage accuracy
of 1.25 %
1.25 adjustable NX1117CADJZ NX1117CEADJZ
1.2 NX1117C12Z NX1117CE12Z
1.5 NX1117C15Z NX1117CE15Z
1.8 NX1117C18Z NX1117CE18Z
1.9 NX1117C19Z NX1117CE19Z
2.0 NX1117C20Z NX1117CE20Z
2.5 NX1117C25Z NX1117CE25Z
2.85 NX1117C285Z NX1117CE285Z
3.3 NX1117C33Z NX1117CE33Z
5.0 NX1117C50Z NX1117CE50Z
Maximum output current of 1 A SOA control
Wide operation range to 20 V input Thermal shutdown
Output voltage accuracy of
1%or1.25 %
No minimum load requirement s for fixed
output voltage versions
Output current limiting Temperature range 40 C to 125 C
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 2 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
3. Applications
Post regulator for switching DC-to-DC converter
High-efficiency linear regulators
Battery charger
USB devices
Hard drive controllers
Consumer and industrial equipment point of load
4. Ordering information
5. Marking
Table 2. Orderin g information
Type number Package
Name Description Version
NX1117C/NX1117CE
series - plastic surface-mounted package with increased
heat sink; 4 leads SOT223
Table 3. Marking codes
Type number Marking code Type number Marking code
NX1117CADJZ NCADJZ NX1117CEADJZ 7CEADJ
NX1117C12Z N7C12Z NX1117CE12Z 7CE12Z
NX1117C15Z N7C15Z NX1117CE15Z 7CE15Z
NX1117C18Z N7C18Z NX1117CE18Z 7CE18Z
NX1117C19Z N7C19Z NX1117CE19Z 7CE19Z
NX1117C20Z N7C20Z NX1117CE20Z 7CE20Z
NX1117C25Z N7C25Z NX1117CE25Z 7CE25Z
NX1117C285Z NC285Z NX1117CE285Z 7CE285
NX1117C33Z N7C33Z NX1117CE33Z 7CE33Z
NX1117C50Z N7C50Z NX1117CE50Z 7CE50Z
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 3 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
6. Functional diagram
7. Pinning information
[1] ADJ for NX1117CADJZ and NX1117CEADJZ; GND for all other devices.
8. Limiting values
[1] The maximum package power dissipation is .
Fig 1. Adjustable output voltage versions:
functional diagram Fig 2. Fixed output voltage versions:
functional diagram
006aac638
VOUT
VIN
OUTPUT CURRENT LIMITING
SOA CONTROL
THERMAL SHUTDOWN
Vref
ADJ
006aac639
GND
VOUT
VIN
OUTPUT CURRENT LIMITING
SOA CONTROL
THERMAL SHUTDOWN
Vref
Table 4. Pinning
Pin Symbol Description Simplified outline
1 ADJ or GND adjust or ground [1]
2V
OUT output
3V
IN input
4V
OUT output
132
4
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Vin input voltage - 20 V
Ptot total power dissipation [1] interna lly li mi te d
Tjjunction temperature - 150 C
Tamb ambient temperature 40 +125 C
Tstg storage temperature 65 +150 C
Ptot TjTamb
–
Rth j a–
-----------------------
=
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 4 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
9. Recommended operating conditions
10. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for output 6 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
(1) Ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint
(2) FR4 PCB, mounting pad for output 6 cm2
(3) FR4 PCB, standard footprint
Fig 3. Power derating curves
Tamb (°C)
–75 17512525 75–25
006aac644
1.0
1.5
0.5
2.0
2.5
Ptot
(W)
0.0
(2)
(1)
(3)
Table 6. Recommended operation conditions
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
Vin input voltage - 20 V
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] --150K/W
[2] --72K/W
[3] --45K/W
Rth(j-sp) thermal resistance from
junction to solder point --20K/W
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 5 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
FR4 PCB, standard footprint
Fig 4. Transi en t the rmal impe da n ce from junc tio n to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for output 6 cm2
Fig 5. Transi en t the rmal impe da n ce from junc tio n to ambient as a function of pulse duration; typical values
006aac645
10
1
102
103
Zth(j-a)
(K/W)
10–1
10–5 1010–2
10–4 102
10–1
tp (s)
10–3 103
1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33
0.5
0.75
006aac646
10
1
102
103
Zth(j-a)
(K/W)
10–1
10–5 1010–2
10–4 102
10–1
tp (s)
10–3 103
1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33 0.5
0.75
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 6 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
11. Characteristics
Ceramic PCB, Al2O3, standard footprint
Fig 6. Transi en t the rmal impe da n ce from junc tio n to ambient as a function of pulse duration; typical values
006aac647
10–5 1010–2
10–4 102
10–1
tp (s)
10–3 103
1
10
1
102
Zth(j-a)
(K/W)
10–1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33
0.5
0.75
Table 8. Characteristics
Cin = 680 nF in series with 1
,andC
out = 680 nF in series with 1
. For typical value Tamb =25
C; for minimum and
maximum values Tamb is the operating temperature range
40
C to 125
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Vref reference voltage
NX1117CADJZ Iout =10mA; V
in Vref =2V; T
amb =25C 1.238 1.250 1.262 V
10 mA Iout 800mA; 1.5VVin Vref 15 V [1] 1.225 - 1.275 V
NX1117CEADJZ Iout =10mA; V
in Vref =2V; T
amb =25C 1.234 1.250 1.266 V
10 mA Iout 800mA; 1.5VVin Vref 15 V [1] 1.219 - 1.281 V
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 7 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Vout output voltage
NX1117C12Z Iout =10mA; V
in =3.2V; T
amb =25C 1.188 1.200 1.212 V
0mAIout 800 mA; 2.6 V Vin 11.2 V [1] 1.176 - 1.224 V
NX1117CE12Z Iout =10mA; V
in =3.2V; T
amb =25C 1.185 1.200 1.215 V
0mAIout 800 mA; 2.6 V Vin 11.2 V [1] 1.170 - 1.230 V
NX1117C15Z Iout =10mA; V
in =3.5V; T
amb =25C 1.485 1.500 1.515 V
0mAIout 800 mA; 2.9 V Vin 11.5 V [1] 1.470 - 1.530 V
NX1117CE15Z Iout =10mA; V
in =3.5V; T
amb =25C 1.481 1.500 1.519 V
0mAIout 800 mA; 2.9 V Vin 11.5 V [1] 1.462 - 1.538 V
NX1117C18Z Iout =10mA; V
in =3.8V; T
amb =25C 1.782 1.800 1.818 V
0mAIout 800 mA; 3.2 V Vin 11.8 V [1] 1.764 - 1.836 V
NX1117CE18Z Iout =10mA; V
in =3.8V; T
amb =25C 1.777 1.800 1.823 V
0mAIout 800 mA; 3.2 V Vin 11.8 V [1] 1.755 - 1.845 V
NX1117C19Z Iout =10mA; V
in =3.9V; T
amb =25C 1.881 1.900 1.919 V
0mAIout 800 mA; 3.3 V Vin 11.9 V [1] 1.862 - 1.938 V
NX1117CE19Z Iout =10mA; V
in =3.9V; T
amb =25C 1.876 1.900 1.924 V
0mAIout 800 mA; 3.3 V Vin 11.9 V [1] 1.852 - 1.948 V
NX1117C20Z Iout =10mA; V
in =4.0V; T
amb =25C 1.980 2.000 2.020 V
0mAIout 800 mA; 3.4 V Vin 12 V [1] 1.960 - 2.040 V
NX1117CE20Z Iout =10mA; V
in =4.0V; T
amb =25C 1.975 2.000 2.025 V
0mAIout 800 mA; 3.4 V Vin 12 V [1] 1.950 - 2.050 V
NX1117C25Z Iout =10mA; V
in =4.5V; T
amb =25C 2.475 2.500 2.525 V
0mAIout 800 mA; 3.9 V Vin 12 V [1] 2.450 - 2.550 V
NX1117CE25Z Iout =10mA; V
in =4.5V; T
amb =25C 2.469 2.500 2.531 V
0mAIout 800 mA; 3.9 V Vin 12 V [1] 2.437 - 2.563 V
NX1117C285Z Iout =10mA; V
in =4.85V; T
amb =25C 2.820 2.850 2.880 V
0mAIout 800 mA; 4.25 V Vin 10 V [1] 2.790 - 2.910 V
NX1117CE285Z Iout =10mA; V
in =4.85V; T
amb =25C 2.814 2.850 2.886 V
0mAIout 800 mA; 4.25 V Vin 10 V [1] 2.779 - 2.921 V
NX1117C33Z Iout =10mA; V
in =5.3V; T
amb =25C 3.267 3.300 3.333 V
0mAIout 800 mA; 4.75 V Vin 10 V [1] 3.235 - 3.365 V
NX1117CE33Z Iout =10mA; V
in =5.3V; T
amb =25C 3.259 3.300 3.341 V
0mAIout 800 mA; 4.75 V Vin 10 V [1] 3.217 - 3.383 V
NX1117C50Z Iout =10mA; V
in =7.0V; T
amb =25C 4.950 5.000 5.050 V
0mAIout 800 mA; 6.5 V Vin 12 V [1] 4.900 - 5.100 V
NX1117CE50Z Iout =10mA; V
in =7.0V; T
amb =25C 4.937 5.000 5.063 V
0mAIout 800 mA; 6.5 V Vin 12 V [1] 4.875 - 5.125 V
Table 8. Characteristics …continued
Cin = 680 nF in series with 1
,andC
out = 680 nF in series with 1
. For typical value Tamb =25
C; for minimum and
maximum values Tamb is the operating temperature range
40
C to 125
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 8 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Vdo dropout voltage measured at Vout 100 mV
Iout = 100 mA - 0.95 1.1 V
Iout = 500 mA - 1.01 1.15 V
Iout = 800 mA - 1.07 1.2 V
Iout(lim) output current limit Vin Vout =5.0V; T
amb =25C 1000 1200 1500 mA
Iqquiescent cu rre nt
NX1117C12Z;
NX1117CE12Z Vin =11.2V - 56mA
NX1117C15Z;
NX1117CE15Z Vin =11.5V - 56mA
NX1117C18Z;
NX1117CE18Z Vin =11.8V - 56mA
NX1117C19Z;
NX1117CE19Z Vin =11.9V - 56mA
NX1117C20Z;
NX1117CE20Z Vin =12V - 56mA
NX1117C25Z;
NX1117CE25Z Vin =10V - 56mA
NX1117C285Z;
NX1117CE285Z Vin =10V - 56mA
NX1117C33Z;
NX1117CE33Z Vin =15V - 56mA
NX1117C50Z;
NX1117CE50Z Vin =15V - 56mA
Iadj adjust current
NX1117CADJZ;
NX1117CEADJZ Vin = 11.25 V; Iout = 800 mA - 52 120 A
Iadj adjust current variation
NX1117CADJZ;
NX1117CEADJZ 1.4 V Vin Vout 10 V ; 10 mA Iout 800 mA - 0.4 5 A
VESD electrostatic discharge
voltage MIL-STD-883 (human body model) 2 - - kV
machine mode l 400 - - V
Table 8. Characteristics …continued
Cin = 680 nF in series with 1
,andC
out = 680 nF in series with 1
. For typical value Tamb =25
C; for minimum and
maximum values Tamb is the operating temperature range
40
C to 125
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 9 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Regulation characteristics
Iout(min) minimum output current required for regulation
NX1117CADJZ;
NX1117CEADJZ Vin =15V - 0.8 5 mA
PSRR power supply ripple rejection Vin Vout =2.4V; I
out =40mA;
2V
(p-p) 120Hzsinewave
NX1117CADJZ;
NX1117CEADJZ -69-dB
NX1117C12Z;
NX1117CE12Z -72-dB
NX1117C15Z;
NX1117CE15Z -69-dB
NX1117C18Z;
NX1117CE18Z -68-dB
NX1117C19Z;
NX1117CE19Z -67-dB
NX1117C20Z;
NX1117CE20Z -67-dB
NX1117C25Z;
NX1117CE25Z -65-dB
NX1117C285Z;
NX1117CE285Z -63-dB
NX1117C33Z;
NX1117CE33Z -62-dB
NX1117C50Z;
NX1117CE50Z -59-dB
Vn(out)RMS RMS output noise voltage 10 Hz f10 kHz - 0.003 - %
Table 8. Characteristics …continued
Cin = 680 nF in series with 1
,andC
out = 680 nF in series with 1
. For typical value Tamb =25
C; for minimum and
maximum values Tamb is the operating temperature range
40
C to 125
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 10 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Line regulation
Vout output voltage variation [2]
NX1117CADJZ;
NX1117CEADJZ Iout = 10 mA; 2.75 V Vin 16.25 V - 0.1 0.3 %
NX1117C12Z;
NX1117CE12Z Iout =0mA; 2.6VVin 11.2 V - 1.2 3.0 mV
NX1117C15Z;
NX1117CE15Z Iout =0mA; 2.9VVin 11.5 V - 1.5 3.5 mV
NX1117C18Z;
NX1117CE18Z Iout =0mA; 3.2VVin 11.8 V - 1.8 4.0 mV
NX1117C19Z;
NX1117CE19Z Iout =0mA; 3.3VVin 11.9 V - 1.9 4.0 mV
NX1117C20Z;
NX1117CE20Z Iout =0mA; 3.4VVin 12 V - 2.0 4.5 mV
NX1117C25Z;
NX1117CE25Z Iout =0mA; 3.9VVin 12 V - 2.5 4.5 mV
NX1117C285Z;
NX1117CE285Z Iout = 0 mA; 4.25 V Vin 10 V - 2.5 4.5 mV
NX1117C33Z;
NX1117CE33Z Iout = 0 mA; 4.75 V Vin 10 V - 2.5 4.5 mV
NX1117C50Z;
NX1117CE50Z Iout =0mA; 6.5VVin 12 V - 6.0 10 mV
Load regul at i on
Vout output voltage variation [2]
NX1117CADJZ;
NX1117CEADJZ Vin Vout =1.4V; 10mAIout 800 mA - 0.2 0.4 %
NX1117C12Z;
NX1117CE12Z Vin =2.6V; 0mAIout 800 mA - 1 4 mV
NX1117C15Z;
NX1117CE15Z Vin =2.9V; 0mAIout 800 mA - 1 5 mV
NX1117C18Z;
NX1117CE18Z Vin =3.2V; 0mAIout 800 mA - 1 5 mV
NX1117C19Z;
NX1117CE19Z Vin =3.3V; 0mAIout 800 mA - 1 6 mV
NX1117C20Z;
NX1117CE20Z Vin =3.4V; 0mAIout 800 mA - 1 6 mV
NX1117C25Z;
NX1117CE25Z Vin =3.9V; 0mAIout 800 mA - 1 6 mV
NX1117C285Z;
NX1117CE285Z Vin = 4.25 V; 0 mA Iout 800mA - 17mV
NX1117C33Z;
NX1117CE33Z Vin = 4.75 V; 0 mA Iout 800mA - 17mV
NX1117C50Z;
NX1117CE50Z Vin =6.5V; 0mAIout 800 mA - 1 10 mV
Table 8. Characteristics …continued
Cin = 680 nF in series with 1
,andC
out = 680 nF in series with 1
. For typical value Tamb =25
C; for minimum and
maximum values Tamb is the operating temperature range
40
C to 125
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 11 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
[1] The SOA control limits the output current at high voltage differences Vin Vout in order to keep the device in the safe operating area.
[2] During testing low duty cycle pulse techniques are used to maintain the junction temperature as close to ambient as possible.
Temperature stability
Vout output voltage variation 40 CTamb 125 C-0.7-%
Long-term stability
Vout output voltage variation 1000 h end-point measurement; Tamb =25C-0.3-%
Table 8. Characteristics …continued
Cin = 680 nF in series with 1
,andC
out = 680 nF in series with 1
. For typical value Tamb =25
C; for minimum and
maximum values Tamb is the operating temperature range
40
C to 125
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Vin =V
out +2V
Iout =10mA Load pulsed at 1 % duty cycle
(1) Tamb =40 C
(2) Tamb =25C
(3) Tamb = 125 C
Fig 7. Output voltage variation as a function of
ambient temperature ; typi cal values Fig 8. Dropout voltage as a function of output
current; typical values
Tamb (°C)
–50 150100050
006aac659
0
–1
1
2
∆Vout
(%)
–2
Iout (mA)
0 800600200 400
006aac660
0.8
1.0
0.6
0.4
0.2
1.2
1.4
Vdo
(V)
0.0
(1)
(2)
(3)
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 12 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Tamb =25C
Load pulsed at 1 % duty cycle Vin =5V
Load pulsed at 1 % duty cycle
Fig 9. Output cur ren t limit as a function of voltage
difference Vin Vout
Fig 10. Output current limit as a function of ambient
temperature
Vin =3.25V
Iout =10mA
Fig 11. Adjustable output voltage versions:
Adjust current as a functio n o f am bient
temperature; typical values
Fig 12. Fixed output voltage versions:
Quiescent current variatio n as a fun ction of
ambient temperature; typical values
Vin – Vout (V)
020168124
006aac661
0.5
1.0
1.5
Iout(lim)
(A)
0.0
Tamb (°C)
–50 150100050
006aac662
1.1
0.9
1.3
1.5
Iout(lim)
(A)
0.7
Tamb (°C)
–50 150100050
006aac663
40
60
20
80
100
Iadj
(μA)
0
Tamb (°C)
–50 150100050
006aac664
–10
0
10
∆Iq
(%)
–20
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Product data sheet Rev. 1 — 18 July 2011 13 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Vout =1.25V;
Vin Vout =2.4V;
Cout = 680 nF;
Tamb =25C;
2V
(p-p); 120 Hz sine wave
Vin Vout =2.4V;
Iout =40mA;
Cout =10F;
Tamb =25C;
2V
(p-p)
Fig 13. Adjustable output voltage versions:
Power supply ripple rejection as a function of
output current; typical values
Fig 14. Power supply ripple rejection as a function of
frequency; typical values
Iout (mA)
0 1000800400 600200
006aac665
40
60
20
80
100
PSRR
(dB)
0
006aac666
40
60
20
80
100
PSRR
(dB)
0
f (Hz)
10 105
104
102103
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 14 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Cout =10F;
Iout = 100 mA;
Tamb =25C
Cout =10F;
Iout = 100 mA;
Tamb =25C
Fig 15. NX1117C285Z and NX1117CE285Z:
Line transient response as a function of time;
typical valu e s
Fig 16. NX1117C50Z and NX1117CE50Z:
Line transient re sponse as a function of time;
typical values
Cin =10F;
Cout =10F;
Vin =4.5V
Tamb =25C;
Preload = 100 mA
Cin =10F;
Cout =10F;
Vin =6.5V
Tamb =25C;
Preload = 100 mA
Fig 17. NX1117C285Z and NX1117CE285Z:
Load transient response as a function of tim e;
typical valu e s
Fig 18. NX1117C50Z and NX1117CE50Z:
Load transient response as a function of time;
typical values
t (μs)
0 20016080 12040
006aac667
20
4.25
6.25
Vin
(V)
–20
∆Vout
(mV)
t (μs)
0 20016080 12040
006aac668
20
6.5
8.5
Vin
(V)
–20
∆Vout
(mV)
t (μs)
0 20016080 12040
006aac669
1
–0.1
0.1
Iout
(A)
0
∆Vout
(V)
t (μs)
0 20016080 12040
006aac670
1
–0.1
0.1
Iout
(A)
0
∆Vout
(V)
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 15 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
12. Application information
Fig 19. NX1117C33Z and NX1117CE33Z: Typical application for fixed output voltage
versions
Fig 20. NX1117CADJZ and NX1117CEADJZ: Typical application for adjustable output
voltage versions
NX1117C33Z
NX1117CE33Z
V
OUT
V
IN
approx. 5 V 3.3 V
10 μF10 μF
006aac640
NX1117CADJZ
NX1117CEADJZ VOUT
VIN
10 μF
R1
R2
006aac641
10 μF
VOUT Vref 1R2R1+Iadj R2+=
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 16 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
13. Package outline
14. Packing information
[1] For further information and the availability of packing methods, see Section 18.
Fig 21. Package outline SOT223 (SC-73)
04-11-10Dimensions in mm
6.7
6.3
3.1
2.9
1.8
1.5
7.3
6.7 3.7
3.3
1.1
0.7
132
4
4.6
2.3 0.8
0.6 0.32
0.22
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
1000 4000
NX1117C/NX1117CE
series SOT223 8 mm pitch, 12 mm tape and reel -115 -135
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 17 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
15. Soldering
Fig 22. Reflow soldering footprint SOT223 (SC-73)
Fig 23. Wave soldering footprint SOT223 (SC-73)
sot223_fw
1.9
6.7
8.9
8.7
1.9
(3×)
1.9
(2×)
1.1
6.2
2.7 2.7
2
4
31
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 18 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
16. Revision history
Table 10. Revision history
Document ID Release date Dat a sh e et status Change notice Supersedes
NX1117C_NX1117CE_SER v.1 20110718 Product data sheet - -
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 19 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
17. Legal information
17.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ion — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
17.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulat ive liability t owards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by cust omer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
NX1117C_NX1117CE_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 18 July 2011 20 of 21
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omotive use. It i s neither qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
17.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors NX1117C; NX1117CE series
Low-dropout linear regulators
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 July 2011
Document identifier: NX1117C_NX1117C E _SE R
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
19. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
9 Recommended operating conditions. . . . . . . . 4
10 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Application information. . . . . . . . . . . . . . . . . . 15
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
14 Packing information . . . . . . . . . . . . . . . . . . . . 16
15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
18 Contact information. . . . . . . . . . . . . . . . . . . . . 20
19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21