To our custo mers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corpor ation took over all the business of both
companies. Therefore, althoug h the old com pany name remains in this docum ent, it is a valid
Renesas Electronics document. W e appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Ren esas E lectronics assumes no liability whatsoever for any da mages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified acco rding to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, et c.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electro nic app liances; machine tool s; p ersonal electron ic equipment; and indu strial robots .
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equ i pment; submersible repeaters; nu clear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
interven tion (e.g. excision, et c.), and any oth er applications or purposes that pose a direct th reat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific chara cterist ics such as the o ccurren ce of failure at a certai n rate an d malfunct ion s under certai n u se cond ition s. Further,
Renesas Electronics pr oducts are not subject to radiation resi stance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for det ai ls as to enviro nmental matters such as the en vi ronmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as us ed in this document means Renesas Electronics Corporation and also includes its majo ri ty-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
Rev.3.00, Jul.13.2005, page 1 of 5
HD74LS04 / HD74LS05
Hex Inverters / Hex Inverters (with Open Collector Outputs)
REJ03D0391–0300
Rev.3.00
Jul.13.2005
Features
• Ordering Information
• HD74LS04
Part Name Package Type Package Code
(Previous Code) Package
Abbreviation Taping Abbreviation
(Quantity)
HD74LS04P DILP-14 pin PRDP0014AB-B
(DP-14AV) P —
HD74LS04FPEL SOP-14 pin (JEITA) PRSP0014DF-B
(FP-14DAV) FP EL (2,000 pcs/reel)
HD74LS04RPEL SOP-14 pin (JEDEC) PRSP0014DE-A
(FP-14DNV) RP EL (2,500 pcs/reel)
• HD74LS05
Part Name Package Type Package Code
(Previous Code) Package
Abbreviation Taping Abbreviation
(Quantity)
HD74LS05P DILP-14 pin PRDP0014AB-B
(DP-14AV) P —
HD74LS05FPEL SOP-14 pin (JEITA) PRSP0014DF-B
(FP-14DAV) FP EL (2,000 pcs/reel)
HD74LS05RPEL SOP-14 pin (JEDEC) PRSP0014DE-A
(FP-14DNV) RP EL (2,500 pcs/reel)
Note: Please consult the sales office for the above packa ge availability.
Pin Arrangement
(Top view)
V
CC
6A
6Y
5A
4A
5Y
1A
GND
1Y
2A
2Y
3A
3Y
4Y
1
2
3
4
5
6
7
14
8
9
10
11
12
13
HD74LS04 / HD74LS05
Rev.3.00, Jul.13.2005, page 2 of 5
Circuit Schematic (1/6)
HD74LS04 HD74LS05
A
8k
20k
4.5k
VCC
GND
Y
Output
Input
75
3k1.5k
A
8k
20k
4.5k
VCC
GND
Y
Output
Input
Absolute Maximum Ratings
Item Symbol Ratings Unit
Supply voltage VCC Note 7 V
Input voltage VIN 7 V
Power dissipation PT 400 mW
Storage temperature Tstg –65 to +150 °C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
• HD74LS04
Item Symbol Min Typ Max Unit
Supply voltage VCC 4.75 5.00 5.25 V
IOH — — –400 µA
Output current IOL — — 8 mA
Operating temperature Topr –20 25 75 °C
• HD74LS05
Item Symbol Min Typ Max Unit
Supply voltage VCC 4.75 5.00 5.25 V
Output voltage VOH — — 5.5 V
Output current IOL — — 8 mA
Operating temperature Topr –20 25 75 °C
HD74LS04 / HD74LS05
Rev.3.00, Jul.13.2005, page 3 of 5
Electrical Characteristics
• HD74LS04
(Ta = –20 to +75 °C)
Item Symbol min. typ.* max. Unit Condition
VIH 2.0 — — V
Input voltage VIL — — 0.8 V
VOH 2.7 — — V VCC = 4.75 V, VIL = 0.8 V, IOH = –400 µA
— — 0.5 IOL = 8 mA
Output voltage VOL — — 0.4 V IOL = 4 mA VCC = 4.75 V, VIH = 2 V
IIH — — 20 µA VCC = 5.25 V, VI = 2.7 V
IIL — — –0.4 mA VCC = 5.25 V, VI = 0.4 V
Input current II — — 0.1 mA VCC = 5.25 V, VI = 7 V
Short-circuit output
current IOS –20 — –100 mA VCC = 5.25 V
ICCH — 1.2 2.4 mA VCC = 5.25 V
Supply current ICCL — 3.6 6.6 mA VCC = 5.25 V
Input clamp voltage VIK — — –1.5 V VCC = 4.75 V, IIN = –18 mA
Note: * VCC = 5 V, Ta = 25°C
• HD74LS05
(Ta = –20 to +75 °C)
Item Symbol min. typ.* max. Unit Condition
VIH 2.0 — — V
Input voltage VIL — — 0.8 V
— — 0.5 IOL = 8 mA
Output voltage VOL — — 0.4 V IOL = 4 mA VCC = 4.75 V, VIH = 2 V
Output current IOH — — 100 µA VCC = 4.75 V, VIL = 0.8 V, VOA = 5.5 V
IIH — — 20 µA VCC = 5.25 V, VI = 2.7 V
IIL — — –0.4 mA VCC = 5.25 V, VI = 0.4 V
Input current II — — 0.1 mA VCC = 5.25 V, VI = 7 V
ICCH — 1.2 2.4 mA VCC = 5.25 V
Supply current ICCL — 3.6 6.6 mA VCC = 5.25 V
Input clamp voltage VIK — — –1.5 V VCC = 4.75 V, IIN = –18 mA
Note: * VCC = 5 V, Ta = 25°C
Switching Characteristics
• HD74LS04
(VCC = 5 V, Ta = 25°C)
Item Symbol min. typ. max. Unit Condition
tPLH — 9 15 ns
Propagation delay time tPHL — 10 15 ns
CL = 15 pF, RL = 2 kΩ
• HD74LS05
(VCC = 5 V, Ta = 25°C)
Item Symbol min. typ. max. Unit Condition
tPLH — 17 32 ns
Propagation delay time tPHL — 15 28 ns
CL = 15 pF, RL = 2 kΩ
Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005-
0100)".
HD74LS04 / HD74LS05
Rev.3.00, Jul.13.2005, page 4 of 5
Package Dimensions
( Ni/Pd/Au plating )
7.62
DP-14AV
RENESAS CodeJEITA Package Code Previous Code
MaxNomMin
Dimension in Millimeters
Symbol
Reference
19.2
6.3
5.06
MASS[Typ.]
A
Z
b
D
E
A
b
c
θ
e
L
1
1
p
3
e
0.51
0.56
1.30
0.19 0.25 0.31
2.29 2.54 2.79
0
°
15
°
PRDP0014AB-BP-DIP14-6.3x19.2-2.54
20.32
7.4
0.40 0.48
2.39
2.54
0.97g
814
7
1
p
3
1
1
b
D
E
e
Z
b
LA
A
c
e
θ
1.42
0.15
1.27
7.50 8.00
0.400.34
p
A
1
10.5
FP-14DAV
RENESAS CodeJEITA Package Code Previous Code
MaxNomMin
Dimension in Millimeters
Symbol
Reference
2.20
0.900.700.50
5.50
0.200.100.00
0.46
0.250.200.15
7.80
8
°
0
°
0.12
1.15
10.06
0.23g
MASS[Typ.]
1
E
1
1
2
L
Z
H
y
x
θ
c
b
A
E
D
b
c
e
L
A
P-SOP14-5.5x10.06-1.27 PRSP0014DF-B
Index mark
E
1
*2
*1
7
14 8
F
*3
p
Mx
y
D
E
H
Zb
A
p
Terminal cross section
( Ni/Pd/Au plating )
b
c
Detail F
1
1
L
L
A
θ
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
e
HD74LS04 / HD74LS05
Rev.3.00, Jul.13.2005, page 5 of 5
14 8
7
F
*1
*2
*3
p
Mx
y
1
E
Index mark
b
A
Z
H
E
D
Terminal cross section
( Ni/Pd/Au plating )
p
b
c
1
1
Detail F
L
L
A
θ
PRSP0014DE-AP-SOP14-3.95x8.65-1.27
A
L
e
e
c
b
D
E
A
b
c
θ
x
y
H
Z
L
2
1
1
E
1
MASS[Typ.]
0.13g
8.65
1.08
0.25
0
°
8
°
6.10
0.15 0.20 0.25
0.46
0.10 0.14 0.25
3.95
0.40 0.60 1.27
1.75
Reference
Symbol
Dimension in Millimeters
Min Nom Max
Previous CodeJEITA Package Code RENESAS Code
FP-14DNV
9.05
1
A
p
0.34 0.40
6.205.80
1.27
0.15
0.635
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0
