SSRAM Austin Semiconductor, Inc. 256K x 18 SSRAM PIN ASSIGNMENT (Top View) Synchronous Burst SRAM, Flow-Through 100-pin TQFP A6 A7 CE\ CE2 NC NC WEH\ WEL\ CE2\ VCC VSS CLK GW\ BWE\ OE\ ADSC\ ADSP\ ADV\ A8 A9 FEATURES MARKING -8 -9 -10 A10 NC NC VCCQ VSSQ NC DQP1 DQ8 DQ7 VSSQ VCCQ DQ6 DQ5 VSS NC VCC ZZ DQ4 DQ3 VCCQ VSSQ DQ2 DQ1 NC NC VSSQ VCCQ NC NC NC and CE2), burst control inputs (ADSC\, ADSP\, and ADV\), write enables (WEL\, WEH\, and BWE\), and global write (GW\). Asynchronous inputs include the output enable (OE\), burst mode control (MODE), and sleep mode control (ZZ). The data outputs (DQ), enabled by OE\, are also asynchronous. Addresses and chip enables are registered with either address status processor (ADSP\) or address status controller (ADSC\) input pins. Subsequent burst addresses can be internally generated as controlled by the burst advance pin (ADV\). Address, data inputs, and write controls are registered on-chip to initiate self-timed WRITE cycle. WRITE cycles can be one or two bytes wide as controlled by the write control inputs. Individual byte enables allow individual bytes to be written. WEL\ controls DQ1DQ8 and DQP1. WEH\ controls DQ9-DQ16 and DQP2. WEL\ and WEH\ can be active only with BWE\ being LOW. GW\ being LOW causes all bytes to be written. The AS5SS256K18 operates from a +3.3V core power supply and all outputs operate on a +2.5V supply. All inputs and outputs are JEDEC standard JESD8-5 compatible. The device is ideally suited for 486, PentiumTM , 680x0, and PowerPCTM systems and for systems that are benefited from a wide synchronous data bus. DQ No. 1001 For more products and information please visit our web site at www.austinsemiconductor.com GENERAL DESCRIPTION The ASI Synchronous Burst SRAM family employs high-speed, low power CMOS designs using advanced triple-layer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high valued resistors. The AS5SS256K18 SRAM integrates 262,144x18 SRAM cells with advanced synchronous peripheral circuitry and a 2-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining chip enable (CE\), depth-expansion chip enables (CE2\ AS5SS256K18 Rev. 2.0 7/99 1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 10 71 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 MODE A5 A4 A3 A2 A1 A0 NC NC VSS VCC NC NC * Timing 8ns/10ns 8.5ns/11ns 10ns/20ns * Packages 100-pin TQFP NC NC NC VCCQ VSSQ NC NC DQ9 DQ10 VSSQ VCCQ DQ11 DQ12 NC VCC NC VSS DQ13 DQ14 VCCQ VSSQ DQ15 DQ16 DQP2 NC VSSQ VCCQ NC NC NC A15 A14 A13 A12 A11 A16 A17 * Fast access times: 8, 8.5, and 10ns * Fast clock speed: 100, 90, and 50 MHz * Provide high performance 2-1-1-1 access rate * Fast OE\ access time: 5 ns * 3.3V -5% and +10% power supply * 2.5V or 3.3V I/O Supply * Clamp diodes to VSSQ at all inputs and outputs * Common data inputs and data outputs * BYTE WRITE ENABLE and GLOBAL WRITE control * Three chip enables for depth expansion and address pipeline * Address, data and control registers * Internally self-timed WRITE CYCLE * Burst control pins (interleaved or linear burst sequence) * Automatic power-down for portable applications * Low profile 100 pin TQFP package * Operating Temperature Ranges: - Military -55oC to +125oC - Industrial -45oC to +85oC OPTIONS AS5SS256K18 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 1 SSRAM Austin Semiconductor, Inc. AS5SS256K18 PIN DESCRIPTIONS TQFP PIN NUMBERS SYMBOL TYPE DESCRIPTION 37, 36, 35, 34, 33, 32, 100, 99, 82, 81, 80, 48, 47, 46, 45, A0-A17 93, 94 WEH\, WEL\ 87 BWE\ InputWrite Enable: This active LOW input gates byte write operations and must Synchronous meet the setup and hold times around the rising edge of CLK. 88 GW\ 89 CLK InputGlobal Write: This active LOW input allows a full 18-bit WRITE to occur Synchronous independent of the BWE\ and WEn\ lines and must meet the setup and hold times around the rising edge of CLK. InputClock: This signal registers the addresses, data, chip enables, write control Synchronous and burst control inputs on its rising edge. All synchronous inputs must meet setup and hold times around the clock's rising edge. 98 CE\ InputChip Enable: This active LOW input is used to enable the device and to Synchronous gate ADSP\. 92 CE2\ InputChip Enable: This active LOW input is used to enable the device. Synchronous 97 CE2 86 OE\ InputChip enable: This active HIGH input is used to enable the device. Synchronous InputOutput Enable: This active LOW asynchronous input enables the data Synchronous output drivers. 83 ADV\ 84 ADSP\ 85 ADSC\ 31 MODE 64 ZZ InputAddresses: These inputs are registered and must meet the setup and hold Synchronous times around the rising edge of CLK. The burst counter generates internal addresses associated with A0 and A1, during burst cycle and wait cycle. InputByte Write Enables: A byte write enable is LOW for a WRITE cycle and Synchronous HIGH for a READ cycle. WEL\ controls DQ1-DQ8 and DQP1. WEH\ controls DQ9-DQ16 and DQP2. Data I/O are high impedance if either of these inputs are LOW, conditioned by BWE\ being LOW. InputSynchronous InputSynchronous Address Advance: This active LOW input is used to control the internal burst counter. A HIGH on this pin generates wait cycle (no address Address Status Processor: This active LOW input, along with CE# being LOW, causes a new external address to be registered and a READ cycle is initiated using the new address. InputAddress Status Controller: This active LOW input causes device to be deSynchronous selected or selected along with new external address to be registered. A READ or WRITE cycle is initiated depending upon write control inputs. InputMode: This input selects the burst sequence. A LOW on this pin selects Static LINEAR BURST. A NC or HIGH on this pin selects INTERLEAVED BURST This active HIGH input puts the device in low power InputSnooze: Asynchronous consumption standby mode. For normal operation, this input has to be either LOW or NC (No Connect). 58, 59, 62, 63, DQ1-DQ16 68,69, 72, 73, 8, 9, 12,13, 18, 19, 22, 23 74, 24 DQP1,DQP2 15, 41,65, 91 VCC Input/ Output Data Inputs/Outputs: Low Byte is DQ1-DQ8. HIgh Byte is DQ9-DQ16. Input data must meet setup and hold times around the rising edge of CLK. Input/ Output Supply Parity Inputs/Outputs: DQP1 is parity bit for DQ1-DQ8 and DQP2 is parity bit for DQ9-DQ16. Power Supply: +3.3V -5% and +10% of CLK. 17, 40, 67, 90 VSS Ground 4, 11, 20, 27, 54,61, 70, 77 VCCQ I/O Supply Output Buffer Supply: +3.3V -5% and +10% 5, 10, 21, 26, 55, 60, 71, 76 VSSQ I/O Ground Output Buffer Ground: GND 1-3, 6, 7, 14, 16,25, 28-30, 38, 39,42, 43, 51-53, 56,57, 66, 75, 78, 79, 95, 96 NC ----- AS5SS256K18 Rev. 2.0 7/99 Ground: GND. No Connect: These signals are not internally connected. Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 2 SSRAM AS5SS256K18 Austin Semiconductor, Inc. BURST ADDRESS TABLE (MODE=NC/VCC) First Address (external) A...A00 A...A01 A...A10 A...A11 Second Address Third Address Fourth Address (internal) (internal) (internal) A...A01 A...A10 A...A11 A...A00 A...A11 A...A10 A...A11 A...A00 A...A01 A...A10 A...A01 A...A00 BURST ADDRESS TABLE (MODE=GND) First Address (external) A...A00 A...A01 A...A10 A...A11 Second Address Third Address Fourth Address (internal) (internal) (internal) A...A01 A...A10 A...A11 A...A10 A...A11 A...A00 A...A11 A...A00 A...A01 A...A00 A...A01 A...A10 FUNCTIONAL BLOCK DIAGRAM UPPER BYTE WRITE WEH\ BWE\ D Q CLK LOWER BYTE WRITE D Q CE\ CE2 CE2\ ENABLE D Q Power Down Logic ASDP\ A17-A2 Address Register ADSC\ CLR Binary Counter & Logic ADV A1-A0 MODE Output Buffers Input Register 256K x 9 x 2 SRAM Array ZZ OE\ lo byte write GW\ hi byte write WEL\ DQ1 - DQ16 DQP1 DQP2 NOTE: The Functional Block Diagram illustrates simplified device operation. See Truth Table, pin descriptions and timing diagrams for detailed information. AS5SS256K18 Rev. 2.0 7/99 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 3 SSRAM AS5SS256K18 Austin Semiconductor, Inc. TRUTH TABLE ADDRESS USED CE\ CE2\ CE2 Deselected Cycle, Power Down None H X X X Deselected Cycle, Power Down None L X L Deselected Cycle, Power Down None L H Deselected Cycle, Power Down None L Deselected Cycle, Power Down None READ Cycle, Begin Burst ADV\ WRITE\ OE\ CLK DQ L X X X L-H High-Z L X X X X L-H High-Z X L X X X X L-H High-Z X L H L X X X L-H High-Z L H X H L X X X L-H High-Z External L L H L X X X L L-H Q READ Cycle, Begin Burst External L L H L X X X H L-H High-Z WRITE Cycle, Begin Burst External L L H H L X L X L-H D READ Cycle, Begin Burst External L L H H L X H L L-H Q READ Cycle, Begin Burst External L L H H L X H H L-H High-Z READ Cycle, Continue Burst Next X X X H H L H L L-H Q READ Cycle, Continue Burst Next X X X H H H H L-H High-Z READ Cycle, Continue Burst Next H X X X H H L READ Cycle, Continue Burst Next H X X X H H H WRITE Cycle, Continue Burst Next X X X H H L X WRITE Cycle, Continue Burst Next H X X X H L X OPERATION ADSP\ ADSC\ L L L L L READ Cycle, Suspend Burst Current X X X H H H H L READ Cycle, Suspend Burst Current X X X H H H H H READ Cycle, Suspend Burst Current H X X X H H H L READ Cycle, Suspend Burst Current H X X X H H H H WRITE Cycle, Suspend Burst Current X X X H H H L X WRITE Cycle, Suspend Burst Current H X X X H H L X L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H Q High-Z D D Q High-Z Q High-Z D D NOTES: 1. X means "don't care." H means logic HIGH. L means logic LOW. WRITE\ = L means [BWE\ + WEL\*WEH\]*GW\ equals LOW. WRITE\ = H means [BWE\ + WEL\*WEH\]*GW\ equals HIGH. 2. WEL\ enables write to DQ1-DQ8 and DQP1. WEH\ enables write to DQ9-DQ16 and DQP2. 3. All inputs except OE\ must meet setup and hold times around the rising edge (LOW to HIGH) of CLK. 4. Suspending burst generates wait cycle. 5. For a write operation following a read operation, OE\ must be HIGH before the input data required setup time plus High-Z time for OE\ and staying HIGH throughout the input data hold time. 6. This device contains circuitry that will ensure the outputs will be in High-Z during power-up. 7. ADSP\ LOW along with chip being selected always initiates an READ cycle at the L-H edge of CLK. A WRITE cycle can be performed by setting WRITE\ LOW for the CLK L-H edge of the subsequent wait cycle. Refer to WRITE timing diagram for clarification. AS5SS256K18 Rev. 2.0 7/99 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 4 SSRAM AS5SS256K18 Austin Semiconductor, Inc. PARTIAL TRUTH TABLE FOR READ/WRITE FUNCTION READ READ WRITE one byte WRITE all bytes WRITE all bytes GW\ H H H H H BWE\ H L L L X WEH\ X H L L X WEL\ X H H L X ABSOLUTE MAXIMUM RATINGS* *Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Voltage on VCC Supply Relative to VSS................-0.5V to +4.6V VIN .....................................................................-0.5V to VCC + 0.5V Storage Temperature (plastic) .............................-55C to +125C Max Junction Temperature...................................................+125C Power Dissipation ..................................................................1.4 W Short Circuit Output Current (per I/O)..............................100mA DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS (-55oC < TA < +125oC and -40oC