Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 LMS8117A 1-A Low-Dropout Linear Regulator 1 Features 3 Description * * * * * * * The LMS8117A device is a series of low-dropout voltage regulators with a dropout of 1.2 V at 1 A of load current. The device has the same pinout as the LM317. 1 Available in 1.8-V, 3.3-V, and Adjustable Versions Space-Saving SOT-223 and TO-252 Packages Current Limiting and Thermal Protection Output Current: 1 A Temperature Range: 0C to 125C Line Regulation: 0.2% (Maximum) Load Regulation: 0.4% (Maximum) The LMS8117A is available in an adjustable version, which can set the output voltage from 1.27 V to 13.8 V with only two external resistors. In addition, the device is also available in two fixed voltages, 1.8 V and 3.3 V. 2 Applications * * * * The LMS8117A offers current limiting and thermal shutdown. The device circuit includes a Zener trimmed band-gap reference to assure output voltage accuracy to within 1%. Post Regulator for Switching DC-DC Converters High Efficiency Linear Regulators Battery Chargers Battery-Powered Instrumentation The LMS8117A is available in SOT-223 and TO-252 D-PAK packages. A 10-F (minimum) tantalum capacitor is required at the output to improve the transient response and stability. Device Information(1) PART NUMBER LMS8117A PACKAGE BODY SIZE (NOM) SOT-223 (4) 3.50 mm x 6.50 mm TO-252 (3) 6.10 mm x 6.58 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram LMS8117A INPUT 10 mF(1) Tantalum OUTPUT GND 10 mF Tantalum Copyright (c) 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 4 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 7 7 7 8 8 Application and Implementation .......................... 9 8.1 Application Information.............................................. 9 8.2 Typical Applications .................................................. 9 9 Power Supply Recommendations...................... 13 10 Layout................................................................... 14 10.1 Layout Guidelines ................................................. 14 10.2 Layout Example .................................................... 14 10.3 Thermal Considerations ........................................ 15 11 Device and Documentation Support ................. 19 11.1 11.2 11.3 11.4 11.5 11.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 19 12 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (April 2005) to Revision F Page * Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Recommended Operating Conditions table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 * Deleted Ordering Information table; see Package Option Addendum at the end of the data sheet ...................................... 1 * Deleted Soldering information from Absolute Maximum Ratings table .................................................................................. 3 * Added Thermal Information table ........................................................................................................................................... 4 * Changed Junction-to-ambient, RJA, values in Thermal Information table From: 136C/W To: 61.4C/W (SOT-223) and From: 92C/W To: 56.1C/W(TO-252) ............................................................................................................................ 4 * Changed Junction-to-case, RJC(top), values in Thermal Information table From: 15C/W To: 43C/W (SOT-223) and From: 10C/W To: 42.8C/W (TO-252) .................................................................................................................................. 4 * Deleted duplicate paragraph from Output Voltage section................................................................................................... 10 2 Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 5 Pin Configuration and Functions DCY Package 3-Pin SOT-223 Top View INPUT 3 OUTPUT 4 OUTPUT 1 Not to scale 3 2 INPUT OUTPUT 2 1 OUTPUT ADJUST or GND NDP Package 3-Pin TO-252 Top View ADJUST or GND Not to scale Pin Functions PIN NAME ADJUST or GND INPUT OUTPUT I/O DESCRIPTION SOT-223 TO-252 1 1 -- 3 3 I Input voltage (VI) pin for the regulator. 2, Tab (4) 2, Tab O Output voltage (VO) pin for the regulator. Adjust pin for adjustable output version. Ground pin for fixed output versions. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN Maximum input voltage (all versions), VIN Power dissipation (3) Storage temperature, Tstg (2) (3) UNIT 20 V Internally limited Junction temperature, TJ(MAX) (1) MAX -65 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum power disspation is a function of TJ(MAX), RJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA) / RJA. All numbers apply for packages soldered directly onto a PCB. 6.2 ESD Ratings V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) VALUE UNIT 2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. For testing purposes, ESD was applied using human body model, 1.5-k resistor in series iwth 100-pF capacitor. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 3 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX 15 V 0 125 C Input voltage (all versions) Junction temperature, TJ UNIT 6.4 Thermal Information LMS8117A THERMAL METRIC (1) DCY (SOT-223) NDP (TO-252) 4 PINS 3 PINS UNIT RJA Junction-to-ambient thermal resistance 61.4 56.1 C/W RJC(top) Junction-to-case (top) thermal resistance 43 42.8 C/W RJB Junction-to-board thermal resistance 10 29.4 C/W JT Junction-to-top characterization parameter 2.4 5.4 C/W JB Junction-to-board characterization parameter 9.9 28.9 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- 4.1 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics Typical values apply for TJ = 25C and Minimum and Maximum limits apply for TJ = 0C to 125C (unless otherwise noted). Typical values represent the most likely parametric norm. All limits are guaranteed using by testing or statistical analysis. PARAMETER VREF Reference voltage TEST CONDITIONS Adjustable version 1.8-V version VOUT Output voltage 3.3-V version MIN TYP MAX IOUT = 10 mA, VIN - VOUT = 2 V, TJ = 25C 1.238 1.25 1.262 IOUT = 10 mA to 1 A, VIN - VOUT = 1.4 V to 10 V 1.225 IOUT = 10 mA, VIN = 3.8 V, TJ = 25C 1.782 IOUT = 0 A to 1 A, VIN = 3.2 V to 10 V 1.746 IOUT = 10 mA, VIN = 5 V, TJ = 25C 3.267 IOUT = 0 A to 1 A, VIN = 4.75 V to 10 V 3.235 Adjustable version, IOUT = 10 mA, VIN - VOUT = 1.5 V to 13.75 V Line regulation (1) VOUT VIN - VOUT Dropout voltage (2) 6 3.3-V version, IOUT = 0 mA , VIN = 4.75 V to 15 V 1 6 4 mV 0.2% 0.4% 1.8-V version, IOUT = 0 mA to 1 A, VIN = 3.2 V 1 10 3.3-V version, IOUT = 0 mA to 1 A, VIN = 4.75 V 1 10 IOUT = 100 mA 1.1 1.15 IOUT = 500 mA 1.15 1.2 1.1 1.25 1.4 1.9 1.7 5 mA 5 10 mA 0.01% 0.1% VIN - VOUT = 5 V, TJ = 25C Minimum load current (3) Adjustable version, VIN = 15 V Quiescent current 1.8-V and 3.3-V versions, VIN 15 V Thermal regulation 30-ms pulse, TA = 25C Ripple regulation fRIPPLE = 120 Hz, VIN - VOUT = 3 V, VRIPPLE = 1 VPP IOUT = 10 mA to 1 A, VIN - VOUT = 1.4 V to 10 V Temperature stability (3) V 3.365 0.2% ADJUST pin current (1) (2) 3.333 1 Current limit ADJUST pin current change 1.854 3.3 V 1.818 1.8-V version, IOUT = 0 mA, VIN = 3.2 V to 10 V IOUT = 1 A ILIMIT 1.8 0.035% Adjustable version, IOUT = 10 mA to 1 A, VIN - VOUT = 3 V Load regulation (1) 1.27 UNIT 1 60 75 mV V A W dB 60 120 A 0.2 5 A 0.5% Long term stability 1000 hrs, TA = 125C RMS output noise Percentage of VOUT, f = 10 Hz to 10 kHz 0.3% 0.003% Line and load regulation are measured at constant junction room temperature. The dropout voltage is the input and output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage drops 100 mV from the nominal value obtained by VIN = VOUT + 1.5 V. The minimum output current required to maintain regulation. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 6.6 Typical Characteristics Figure 1. Dropout Voltage Figure 2. Short-Circuit Current Adjustable version Figure 3. Load Regulation Figure 4. Ripple Regulation vs Current Adjustable version Figure 5. Ripple Rejection Figure 6. Temperature Stability Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 5 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com Typical Characteristics (continued) 1.8 V version Figure 7. ADJUST Pin Current Figure 8. Load Transient Response 1.8 V version 3.3 V version Figure 10. Line Transient Response Figure 9. Load Transient Response 3.3 V version Figure 11. Line Transient Response 6 Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 7 Detailed Description 7.1 Overview The LMS8117A device is a positive-voltage regulator available in 1.8-V, 3.3-V, and adjustable versions. For the adjustable version, the output voltage ranges from 1.25 V to 13.8 V and is set with only two external resistors. This device is capable of supplying up to 1-A output current for an input voltage up to 15 V. Because this device has a low-dropout voltage of 1.25 V over a junction temperature from 0C to 125C, the input voltage can be as low as 2.5 V for proper regulation over the entire temperature range. The LMS8117A also features current limiting and thermal overload protection to help protect the device and is available in the space-saving SOT-223 and TO-252 packages. The LMS8117A device is versatile in its applications, including uses in programmable output regulation and local on-card regulation. Or, by connecting a fixed resistor between the ADJUST and OUTPUT pins, the device can function as a precision current regulator. An optional output capacitor can be added to improve transient response. The ADJUST pin can be bypassed to achieve very high ripple-rejection ratios, which are difficult to achieve with standard regulators. 7.2 Functional Block Diagram VIN Thermal Limit Current Limit VOUT Substrate GND (FIXED OUTPUT) ADJUST (ADJUSTABLE OUTPUT) Copyright (c) 2016, Texas Instruments Incorporated 7.3 Feature Description 7.3.1 Protection This device provides current limiting and thermal protection to protect the device against overload or damage from operating in excessive heat. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 7 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com Feature Description (continued) 7.3.2 Programmable Feedback The ADJUST pin for adjustable versions provide easy output voltage or current (not both) programming. For current regulation applications, a single resistor whose resistance value is 1.25 V/IO and power rating is greater than (1.25 V)2/R must be used. For voltage regulation applications, two resistors set the output voltage. 7.4 Device Functional Modes 7.4.1 Normal Operation For the adjustable version, the OUTPUT pin sources current as necessary to make VOUT 1.25 V greater than VREF to provide output regulation. For the fixed version, the OUTPUT pin sources current as necessary to make VOUT greater than the GND pin voltage by the specific fixed voltage (version dependent) to provide output regulation. 7.4.2 Operation With Low Input Voltage The device requires up to 1.25-V headroom (VIN - VOUT) to operate in regulation. With less headroom, the device may dropout and OUTPUT voltage is equal to INPUT voltage minus the dropout voltage. 7.4.3 Operation at Light Loads The device passes its bias current to the OUTPUT pin. The load or feeedback must consume this minimum current for regulation or the output may be too high. 7.4.4 Operation in Self Protection When an overload occurs the device will shut down or reduce the output current to prevent device damage. The device will automatically reset from the overload. The output may be reduced or alternate between ON and OFF states until the overload is removed. 8 Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LMS8117A is a versatile and high-performance linear regulator with a wide temperature range and tight line and load regulation operation. An output capacitor is required to further improve transient response and stability. For the adjustable version, the ADJUST pin can also be bypassed to achieve very high ripple-rejection ratios. The LMS8117A is versatile in its applications, including uses as a post regulator for DC-DC converters, batter chargers, and microprocessor supplies. 8.2 Typical Applications 8.2.1 Output Regulator LMS8117A INPUT (1) 10 mF Tantalum OUTPUT GND 10 mF Tantalum Copyright (c) 2016, Texas Instruments Incorporated (1) Required if the regulator is placed far from the power supply filter. Figure 12. Fixed Output Regulator 8.2.1.1 Design Requirements The device component count is very minimal, employing two resistors as part of a voltage divider circuit for the adjustable version and an output capacitor for load regulation. A 10-F tantalum capacitor on the input is suitable for almost all applications and is required if the regulator is located far from the power-supply filter. An optional bypass capacitor across R2 can also be used to improve PSRR. 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 External Capacitors and Stability 8.2.1.2.1.1 Input Bypass Capacitor TI recommends an input capacitor. A 10-F tantalum on the input is a suitable input bypassing for almost all applications. 8.2.1.2.1.2 ADJUST Pin Bypass Capacitor The ADJUST pin can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency, the impedance of the CADJ must be less than R1 to prevent the ripple from being amplified in Equation 1. 1 / (2 x x fRIPPLE x CADJ) < R1 (1) The R1 is the resistor between the OUTPUT and the ADJUST pins. Its value is normally from 100 to 200 . For example, with R1 = 124 and fRIPPLE = 120 Hz, the CADJ must be > 11 F. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 9 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com Typical Applications (continued) 8.2.1.2.1.3 Output Capacitor The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both minimum amount of capacitance and ESR (Equivalent Series Resistance). The minimum output capacitance required by the LMS8117A is 10 F, if a tantalum capacitor is used. Any increase of the output capacitance merely improves the loop stability and transient response. The ESR of the output capacitor must be greater than 0.5 and less than 5 . In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22-F tantalum) is required. 8.2.1.2.2 Output Voltage The LMS8117A adjustable version develops a 1.25-V reference voltage (VREF) between the OUTPUT and the ADJUST pins. As shown in Figure 13, this voltage is applied across resistor R1 to generate a constant current I1. The current IADJ from the ADJUST pin could introduce error to the output. Because it is very small (60 A) compared with the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. For fixed voltage devices, R1 and R2 are integrated inside the devices. LMS8117A VIN OUTPUT INPUT VOUT I1 ADJUST VREF 10 mF R1 100 mF IADJ R2 Copyright (c) 2016, Texas Instruments Incorporated Figure 13. Basic Adjustable Regulator VOUT is calculated using Equation 2. IADJ is typically 60 F and negligible in most applications. VOUT = VREF x (1 + R2 / R1) + (IADJ x R2) (2) 8.2.1.2.3 Load Regulation The LMS8117A regulates the voltage that appears between its OUTPUT and GROUND pins, or between its OUTPUT and ADJUST pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are required. Figure 14 shows a typical application using a fixed output regulator. The RT1 and RT2 are the line resistances. It is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances (as seen in Equation 3). In this case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load must be tied directly to the OUTPUT pin on the positive side and directly tied to the GROUND pin on the negative side. LMS8117A VIN INPUT Rt1 IL OUTPUT GND VOUT VLOAD RLOAD Rt2 Copyright (c) 2016, Texas Instruments Incorporated Figure 14. Basic Fixed Output Regulator 10 VLOAD = VOUT - IL x (RT1 + RT2) (3) Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 Typical Applications (continued) When the adjustable regulator is used (Figure 15), the best performance is obtained with the positive side of the resistor R1 tied directly to the OUTPUT pin of the regulator rather than near the load (as seen in Equation 4). This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5-V regulator with 0.05- resistance between the regulator and load has a load regulation due to line resistance of 0.05 x IL. If R1 (125 ) is connected near the load, the effective line resistance is 0.05 (1 + R2 / R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. LMS8117A INPUT VIN Rt1 OUTPUT VOUT ADJUST VREF R1 VREF R2 RLOAD IL Rt2 Copyright (c) 2016, Texas Instruments Incorporated Figure 15. Best Load Regulation Using Adjustable Output Regulator VLOAD = VREF x (R1 + R2) / R1 - (IL x RT1) (4) 8.2.1.2.4 Protection Diodes Under normal operation, the LMS8117A regulators do not require any protection diode. With the adjustable device, the internal resistance between the ADJUST and OUTPUT pins limit the current. No diode is required to divert the current around the regulator even with capacitor on the ADJUST pin. The ADJUST pin can take a transient signal of 25 V with respect to the output voltage without damaging the device. When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor discharges into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LMS8117A regulators, the internal diode between the OUTPUT and INPUT pins can withstand microsecond surge currents of 10 A to 20 A. With an extremely large output capacitor (1000 F), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, TI recommends an external diode between the OUTPUT and INPUT pins to protect the regulator, as shown in Figure 16. 1N4002 (Optional) LMS8117A VIN INPUT VOUT OUTPUT ADJUST R1 CADJ 10 mF COUT 100 mF R2 Copyright (c) 2016, Texas Instruments Incorporated Figure 16. Regulator With Protection Diode Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 11 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com Typical Applications (continued) 8.2.1.3 Application Curves TO-252 package SOT-223 package Figure 18. RJA vs 2-oz Copper Area Figure 17. RJA vs 1-oz Copper Area SOT-223 package TO-252 package Figure 19. Maximum Allowable Power Dissipation vs Ambient Temperature Figure 20. Maximum Allowable Power Dissipation vs Ambient Temperature TO-252 package SOT-223 package Figure 21. Maximum Allowable Power Dissipation vs 1-oz Copper Area 12 Figure 22. Maximum Allowable Power Dissipation vs 2-oz Copper Area Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 Typical Applications (continued) 8.2.2 Other Application Circuits Figure 23 and Figure 24 show application circuit examples using the LMS8117A devices. Customers must fully validate and test any circuit before implementing a design based on an example in this section. Unless otherwise noted, the design procedures in Output Regulator are applicable. LMS8117A VIN INPUT ADJUST 10 mF VOUT OUTPUT R1 121 W 100 mF CADJ (1) R2 1k Copyright (c) 2016, Texas Instruments Incorporated (1) CADJ is optional, however it will improve ripple rejection. Figure 23. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection VOUT = 1.25 x (1 + R2 / R1) (5) LMS8117A VIN INPUT VOUT 5V OUTPUT ADJUST R1 240 100 mF 10 mF Tantalum R2 720 2N2219 TTL 1k Copyright (c) 2016, Texas Instruments Incorporated (1) Minimum output is approximately 1.25 V. Figure 24. 5-V Logic Regulator With Electronic Shutdown 9 Power Supply Recommendations The input supply to the LMS8117A must be kept at a voltage level such that its maximum rating is not exceeded. The minimum dropout voltage must also be met, with extra headroom when possible, to keep the device in regulation. TI recommends an input capacitor; see External Capacitors and Stability for more information on capacitor selection. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 13 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com 10 Layout 10.1 Layout Guidelines * * * TI recommends bypassing the input pin to ground with a bypass capacitor. The optimum placement of the bypass capacitor is as close as possible to the input pin and the system ground. Take care to minimize the loop area formed by the bypass capacitor connection, the input pin, and the system GND. TI recommends using wide trace lengths to eliminate I x R drop and heat dissipation. 10.2 Layout Example OUTPUT Ground COUT R2 Power INPUT OUTPUT R1 ADJ/GND Cadj High Frequency Bypass Capacitor 0.1F 10F High Input Bypass Capacitor Ground Figure 25. SOT-223 Layout Example for LMS8117A Adjustable Version (Schematic View) Figure 26. TO-252 Layout Example for LMS8117A Adjustable Version (PCB View) 14 Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 10.3 Thermal Considerations 10.3.1 Heat Sink Requirements When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is demonstrated in Figure 27. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment. There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which include the following. Component variables (RJC) * Leadframe size and material * Number of conduction pins * Die size * Die attach material * Molding compound size and material Application variables (RCA) * Mounting pad size, material, and location * Placement of mounting pad * PCB size and material * Traces length and width * Adjacent heat sources * Volume of air * Ambient temperature * Shape of mounting pad RCA RJC The case temperature is measured at the point where the leads contact the mounted pad surface. Figure 27. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board The LMS8117A regulator has internal thermal shutdown to protect the device from overheating. Under all possible operating conditions, the junction temperature of the LMS8117A must be within 0C to 125C. A heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heat sink is required, the power dissipated by the regulator (PD) is calculated using Equation 6. IIN = IL + IG PD = (VIN - VOUT) x IL + (VIN x IG) (6) (7) Figure 28 shows the voltages and currents which are present in the circuit. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 15 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com Thermal Considerations (continued) IN VIN LMS8117A INPUT OUTPUT VOUT IL LOAD GND IG Copyright (c) 2016, Texas Instruments Incorporated Figure 28. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise (TR(MAX)) in Equation 8. TR(MAX) = TJ(MAX) - TA(MAX) where * * TJ(MAX) is the maximum allowable junction temperature (125C) TA(MAX) is the maximum ambient temperature encountered in the application (8) Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (RJA) can be calculated with Equation 9. RJA = TR(MAX) / PD (9) If the maximum allowable value for RJA is found to be 61.4C/W for SOT-223 package or 56.1C/W for TO-252 package, no heat sink is required because the package alone dissipates enough heat to satisfy these requirements. If the calculated value for RJA falls below these limits, a heat sink is required. As a design aid, Table 1 shows the value of the RJA of SOT-223 and TO-252 for different heat sink area. The copper patterns that we used to measure these RJA are shown Figure 29 and Figure 30. Figure 17 and Figure 18 reflect the same test results as what are in the Table 1. Figure 19 and Figure 20 show the maximum allowable power dissipation versus ambient temperature for the SOT-223 and TO-252 device packages. Figure 21 and Figure 22 show the maximum allowable power dissipation versus copper area (in.2) for the SOT-223 and TO-252 device packages. For power enhancement techniques to be used with SOT-223 and TO-252 packages, see AN-1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036). Table 1. RJA Different Heat Sink Area LAYOUT (1) 16 COPPER AREA (in2) THERMAL RESISTANCE: RJA (C/W) TOP SIDE (1) BOTTOM SIDE SOT-223 T0-252 1 0.0123 0 136 103 2 0.066 0 123 87 3 0.3 0 84 60 4 0.53 0 75 54 5 0.76 0 96 52 6 1 0 66 47 7 0 0.2 115 64 8 0 0.4 98 70 9 0 0.6 89 63 10 0 0.8 82 57 11 0 1 79 57 12 0.066 0.066 125 89 13 0.175 0.175 93 72 Tab of device is attached to top-side copper. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 Thermal Considerations (continued) Table 1. RJA Different Heat Sink Area (continued) LAYOUT COPPER AREA (in2) THERMAL RESISTANCE: RJA (C/W) TOP SIDE (1) BOTTOM SIDE SOT-223 T0-252 14 0.284 0.284 83 61 15 0.392 0.392 75 55 16 0.5 0.5 70 53 Figure 29. Top View of the Thermal Test Pattern in Actual Scale Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 17 LMS8117A SNOS487F - MAY 2004 - REVISED DECEMBER 2016 www.ti.com Figure 30. Bottom View of the Thermal Test Pattern in Actual Scale 18 Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A LMS8117A www.ti.com SNOS487F - MAY 2004 - REVISED DECEMBER 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: AN-1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036) 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2004-2016, Texas Instruments Incorporated Product Folder Links: LMS8117A 19 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LMS8117ADT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LMS8117 ADT-3.3 LMS8117ADT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LMS8117 ADT-ADJ LMS8117ADTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LMS8117 ADT-3.3 LMS8117ADTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LMS8117 ADT-ADJ LMS8117AMP-1.8/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LS00 LMS8117AMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LS01 LMS8117AMP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LS0A LMS8117AMPX-1.8/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LS00 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS094A - APRIL 2001 - REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0-10 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OUTLINE NDP0003B TO-252 - 2.55 mm max height SCALE 1.500 TRANSISTOR OUTLINE 10.42 9.40 6.22 5.97 B 1.27 0.88 A 5.46 4.96 6.73 6.35 (2.345) 1 (2.5) 2.285 2 4.57 3 0.88 3X 0.64 0.25 C A B 1.02 0.64 PKG OPTIONAL 8 TOP & BOTTOM 8 1.14 0.89 C 2.55 MAX SEATING PLANE 0.17 0.88 0.46 0.60 0.46 0.51 MIN 4.32 MIN 3 2 4 1 4219870/A 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-252. www.ti.com EXAMPLE BOARD LAYOUT NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE SEE SOLDER MASK DETAIL 2X (2.15) (5.7) 2X (1.3) 1 4 (4.57) SYMM (5.5) 3 (R0.05) TYP (4.38) (2.285) PKG LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 8X 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND METAL EDGE METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAIL 4219870/A 03/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004). 5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE (1.35) TYP 2X (2.15) 2X (1.3) (0.26) (R0.05) TYP (1.32) TYP (4.57) 16X (1.12) 16X (1.15) (4.38) PKG SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 8X 4219870/A 03/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. 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