3365/37100SF - 3M - Datasheet.Online

Document Number: 320032-001

Mobile Intel® Atom™ Processor

N270 Single Core

Datasheet

May 2008

2 Datasheet

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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifica tions. Current characterized errata are available on request.

Contact your local Intel sales offic e or your distributor to obtain the latest specifications and before placing your product order

Enhanced Intel SpeedStep® Technology for specified units of this processor available Q2/06. See the Processor Spec Finder at

http://processorfinder.intel.com or contact your Intel representative for more information.

Enabling Execute Disable Bit functionality requires a PC with a proc essor with Execute Disable Bit capability and a supporting

operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Intel, Atom, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U. S. and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1 Introduction.....................................................................................................6

1.1 Major Features.......................................................................................6

1.2 Terminology ..........................................................................................7

1.3 References ............................................................................................9

2 Low Power Features ........................................................................................10

2.1 Clock Control and Low-power States .......................................................10

2.1.1 Thread Low-power State Descriptions.........................................12

2.1.2 Package Low-power State Descriptions.......................................13

2.2 Dynamic Cache Sizing...........................................................................16

2.3 Enhanced Intel SpeedStep® Technology...................................................17

2.4 Enhanced Low-Power States ..................................................................18

2.5 FSB Low Power Enhancements ...............................................................19

2.5.1 Front Side Bus........................................................................19

3 Electrical Specifications....................................................................................20

3.1 Power and Ground Pins .........................................................................20

3.2 FSB Clock (BCLK [1:0]) and Processor Clocking ........................................20

3.3 Voltage Identification............................................................................20

3.4 Catastrophic Thermal Protection.............................................................23

3.5 Reserved and Unused Pins.....................................................................23

3.6 FSB Frequency Select Signals (BSEL [2:0])..............................................23

3.7 FSB Signal Groups................................................................................24

3.8 CMOS Asynchronous Signals..................................................................25

3.9 Maximum Ratings.................................................................................25

3.10 Processor DC Specifications ...................................................................26

4 Package Mechanical Specifications and Pin Information.........................................33

4.1 Package Mechanical Specifications ..........................................................33

4.1.1 Package Mechanical Drawings ...................................................34

4.2 Processor Pin-out Assignment ................................................................34

4.3 Signal Description ................................................................................41

5 Thermal Specifications and Design Considerations ...............................................50

5.1 Thermal Diode.....................................................................................51

5.2 Intel® Thermal Monitor.........................................................................53

5.3 Digital Thermal Sensor..........................................................................55

5.3.1 Out of Specification Detection ...................................................56

5.3.2 PROCHOT# Signal Pin..............................................................56

4 Datasheet

Figures

Figure 1. Thread Low-power States ...................................................................11

Figure 2. Package Low-power States..................................................................11

Figure 3. Active VCC and ICC Processor Loadline .................................................28

Figure 4. Deeper Sleep VCC and ICC Processor Loadline .......................................29

Tables

Table 1. References...........................................................................................9

Table 2. Coordination of Thread Low-power States at the Package Level .................12

Table 3. Voltage Identification Definition ............................................................20

Table 4. BSEL [2:0] Encoding for BCLK Frequency ...............................................23

Table 5. FSB Pin Groups...................................................................................24

Table 6. Processor Absolute Maximum Ratings ....................................................26

Table 7. Voltage and Current Specifications for the Processors...............................27

Table 8. FSB Differential BCLK Specifications ......................................................29

Table 9. AGTL+ Signal Group DC Specifications...................................................30

Table 10. Legacy CMOS Signal Group DC Specifications........................................31

Table 11. Open Drain Signal Group DC Specifications...........................................32

Table 12. Pin-out Arranged by Signal Name........................................................36

Table 13. Signal Description .............................................................................41

Table 14. Power Specifications for the Processor..................................................50

Table 15. Thermal Diode Interface.....................................................................52

Table 16. Thermal Diode Parameters using Transistor Model .................................52

Datasheet 5

Revision History

Document

Number Revision

Number Description Revision Date

320032 001

Initial release. May 2008

Introduction

6 Datasheet

1 Introduction

The Intel® Atom™ Processor N270 (code named Mobile Diamondville) is built on 45-

nanometer process technology — the first generation of low-power IA-32 micro-

architecture specially designed for Netbook’08 Platform. In this platform, the

processor supports Intel® 945GSE chipset with the I/O Controller Hub - Intel

82801GBM.

Note: Throughout this document, the Intel® Atom™ Processor N270 is referred as processor.

1.1 Major Features

The following list provides some of the key features on this processor:

• New single-core processor for mobile devices

• On-die, primary 32-kB instructions cache and 24-kB write-back data cache

• 533-MHz source-synchronous front side bus (FSB)

• 2-Threads support

• On-die 512-kB, 8-way L2 cache

• Support for IA 32-bit architecture

• Intel® Streaming SIMD Extensions-2 and -3 (Intel® SSE2 and Intel® SSE3)

support and Supplemental Streaming SIMD Extension 3 (SSSE3) support

• Micro-FCBGA8 packaging technologies

• Thermal management support via Intel® Thermal Monitor 1 and Intel Thermal

Monitor 2

• FSB Lane Reversal for flexible routing

• Supports C0/C1(e)/C2(e)/C4(e)

• L2 Dynamic Cache Sizing

• Advanced power management features including Enhanced Intel SpeedStep®

Technology

• Execute Disable Bit support for enhanced security

Introduction

Datasheet 7

1.2 Terminology

Term Definition

A “#” symbol after a signal name refers to an active low signal, indicating

a signal is in the active state when driven to a low level. For example,

when RESET# is low, a reset has been requested. Conversely, when NMI

is high, a non-maskable interrupt has occurred. In the case of signals

where the name does not imply an active state but describes part of a

binary sequence (such as address or data), the “#” symbol implies that

the signal is inverted. For example, D [3:0] = “HLHL” refers to a hex ‘A’,

and D [3:0]# = “LHLH” also refers to a hex “A” (H= High logic level, L=

Low logic level).

Front Side Bus

(FSB) Refers to the interface between the processor and system core logic (also

known as the GMCH chipset components).

AGTL+ Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+

signaling technology on some Intel processors.

CMOS Complementary metal-Oxide semiconductor.

Storage

Conditions

Refers to a non-operational state. The pro cessor may be installed in a

platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor landings should not

be connected to any supply voltages, have any I/Os biased, or receive any

clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device

removed from packaging material) the processor must be handled in

accordance with moisture sensitivity labeling (MSL) as indicated on the

packaging material.

Enhanced Intel

SpeedStep®

Technology

Technology that provides power management capabilities to low po wer

devices.

Processor Core Processor core die with integrated L1 and L2 cache. All AC timing and

signal integrity specifications are at the pads of the processor core.

TDP Thermal Design Power

VCC The processor core power supply

VR Voltage Regulator

VSS The processor ground

VCCHFM VCC at Highest Frequency Mode (HFM).

VCCLFM VCC at Lowest Frequency Mode (LFM).

Introduction

8 Datasheet

Term Definition

VCC,BOOT Default VCC Voltage for Initial Power Up.

VCCP AGTL+ Termination Voltage.

VCCA PLL Supply voltage.

VCCDPRSLP V

CC at Deeper Sleep (C4).

VCCF Fuse Power Supply.

ICCDES ICC for Mobile Intel® Atom™ Processor N270 Recommended Design Target

(Estimated).

ICC ICC for Mobile Intel® Atom™ Processor N270 is the number that can be use

as a reflection on a battery life estimates.

IAH, I

CC Auto-Halt

ISGNT I

CC Stop-Grant.

IDSLP I

CC Deep Sleep.

dICC/dt V

CC Power Supply Current Slew Rate at Processor Package Pin (Estimated).

ICCA I

CC for VCCA Supply.

PAH Auto Halt Power.

PSGNT Stop Grant Power.

PDPRSLP Deeper Sleep Power.

TJ Junction Temperature.

Introduction

Datasheet 9

1.3 References

Material and concepts available in the following documents may be beneficial when

reading this document.

Table 1. References

Document Document

No./Location

Intel® 64 and IA-32 Architectures Software Developer's Manuals

• Intel® 64 and IA-32 Architectures Software Developer's Manual

Volume 1: Basic Architecture

• Intel® 64 and IA-32 Architectures Software Developer's Manual

Volume 2A: Instruction Set Reference, A-M

• Intel® 64 and IA-32 Architectures Software Developer's Manual

Volume 2B: Instruction Set Reference, N-Z

• Intel® 64 and IA-32 Architectures Software Developer's Manual

Volume 3A: System Programming Guide

• Intel® 64 and IA-32 Architectures Software Developer's Manual

Volume 3B: System Programming Guide

http://www.intel.com/p

roducts/processor/man

uals/

Mobile Intel® 945 Express Chipset Family Datasheet 309219

Mobile Intel® 945 Express Chipset Family Specification Update 309220

Intel® I/O Controller Hub 7 (ICH7) Family Datasheet 307013

Intel® I/O Controller Hub 7 (ICH7) Family Specification Update 307014

AP-485, Intel® Processor Identification and CPUID Instruction

Application Note 241618

Low Power Features

10 Datasheet

2 Low Power Features

2.1 Clock Control and Low-power States

The processor supports low power states at the thread level and the package level. A

thread may independently enter the C1/AutoHALT, C1/MWAIT, C2, C3, and C4 low

power states. Package low power states include Normal, Stop Grant, Stop Grant

Snoop, Sleep and Deep Sleep. When both threads are in a common low-power state

the central power management logic ensures the entire processor enters the

respective package low power state by initiating a P_LVLx (P_LVL2 and P_LVL3) I/O

read to the chipset.

The processor implements two software interfaces for requesting low power states,

MWAIT instruction extensions with sub-state hints and P_LVLx reads to the ACPI

P_BLK register block mapped in the processor’s I/O address space. The P_LVLx I/O

reads are converted to equivalent MWAIT C-state requests inside the processor and do

not directly result in I/O reads on the processor FSB. The monitor address does not

need to be setup before using the P_LVLx I/O read interface. The sub-state hints used

for each P_LVLx read can be configured in a software programmable MSR. If a thread

encounters a chipset break event while STPCLK# is asserted, then it asserts the PBE#

output signal. Assertion of PBE# when STPCLK# is asserted i n dicates to system logic

that individual threads should return to the C0 state and the processor should return

to the Normal state.

Figure 1 shows the thread low-power states. Figure 2 shows the package low-power

states. Table 2 provides a mapping of thread low-power states to package low power

states.

Low Power Features

Datasheet 11

Figure 1. Thread Low-power States

Figure 2. Package Low-power States

Low Power Features

12 Datasheet

Table 2. Coordination of Thread Low-power States at the Package Level

Package State2

Thread State C0 C11 C2 C4

C0 Normal Normal Normal Normal

C11 Normal AutoHalt AutoHalt AutoHalt

C2 Normal AutoHalt Stop-Grant Stop-Grant

C4 Normal AutoHalt Stop-Grant

Deeper Sleep

/Intel® Enhanced

Deeper Sleep

NOTES:

1. AutoHALT or MWAIT/C1.

2. To enter a package state, both threads must be in a common low power state. If the

threads are not in a common low power state, the pack age state will resolve to the

highest power C state.

2.1.1 Thread Low-power State Descriptions

2.1.1.1 Thread C0 State

This is the normal operating state for threads in the processor.

2.1.1.2 Thread C1/AutoHALT Power-down State

C1/AutoHALT is a low-power state entered when a thread executes the HALT

instruction. The processor thread will transition to the C0 state upon occurrence of

SMI#, INIT#, LINT [1:0] (NMI, INTR), or FSB interrupt messages. RESET# will cause

the processor to immediately initialize itself.

A System Management Interrupt (SMI) handler will return execution to either Normal

state or the AutoHALT Power-down state. See the Intel® 64 and IA-32 Architectures

Software Developer's Manuals, Volume 3A/3B: System Programmer's Guide for more

information.

The system can generate a STPCLK# while the processor is in the AutoHALT Power-

down state. When the system de-asserts the STPCLK# interrupt, the processor will

return execution to the HALT state.

While in AutoHALT Power-down state, the processor threads will process bus snoops

and snoops from the other thread. The processor will enter a snoopable sub-state (not

shown in Figure 1) to process the snoop and then return to the AutoHALT Power-down

state.

Low Power Features

Datasheet 13

2.1.1.3 Thread C1/MWAIT Power-down State

C1/MWAIT is a low-power state entered when the processor thread executes the

MWAIT(C1) instruction. Processor behavior in the MWAIT state is identical to the

AutoHALT state except that Monitor events can cause the processor to return to the

C0 state. See the Intel® 64 and IA-32 Architectures Software Developer's Manuals,

Volume 2A: Instruction Set Reference, A-M and Volume 2B: Instruction Set Reference,

N-Z, for more information.

2.1.1.4 Thread C2 State

Individual threads of the dual-threaded processor can enter the C2 state by initiating a

P_LVL2 I/O read to the P_BLK or an MWAIT(C2) instruction, but the processor will not

issue a Stop-Grant Acknowledge special bus cycl e unless the STPCLK# pin is also

asserted.

While in the C2 state, the processor will process bus snoops and snoops from the

other thread. The processor thread will enter a snoopable sub-state (not shown in

Figure 1) to process the snoop and then return to the C2 state.

2.1.1.5 Thread C4 State

Individual threads of the processor can enter the C4 state by initiating a P_LVL4 I/O

read to the P_BLK or an MWAIT(C4) instruction. If both processor threads are in C4,

the central power management logic will request that the entire processor enter the

Deeper Sleep package low-power state (see Section 2.1.2.6).

To enable the package level Intel Enhanced Deeper S leep state, Dynamic Cache Si zing

and Intel Enhanced Deeper Sleep state fields must be configured in the software

programmable MSR bit.

2.1.2 Package Low-power State Descriptions

The following state descriptions assume that both threads are in a common low power

state. For cases when only one thread is in a low power state (see Section 2.1.1).

2.1.2.1 Normal State

This is the normal operating state for the processor. The processor remains in the

Normal state when the threads are in the C0, C1/AutoHALT, or C1/MWAIT state.

2.1.2.2 Stop-Grant State

When the STPCLK# pin is asserted, each thread of the processors enters the Stop-

Grant state within 1384 bus clocks after the response phase of the processor-issued

Stop-Grant Acknowledge special bus cycle. When the STPCLK# pin is de-asserted, the

core returns to its previous low-power state.

Since the AGTL+ signal pins receive power from the FSB, these pins shoul d not be

driven (allowing the level to return to VCCP) for minimum power drawn by the

Low Power Features

14 Datasheet

termination resistors in this state. In addition, all other input pins on the FSB should

be driven to the inactive state.

RESET# causes the processor to immediately initialize itself, but the processor will

stay in Stop-Grant state. When RESET# is asserted by the system, the STPCLK#,

SLP#, DPSLP#, and DPRSTP# pins must be de-asserted prior to RESET# de-assertion.

When re-entering the Stop-Grant state from the Sleep state, S TPCLK# should be de-

asserted after the de-assertion of SLP#.

While in Stop-Grant state, the processor will service snoops and latch interrupts

delivered on the FSB. The processor will latch SMI#, INIT# and LINT [1:0] interrupts

and will service only one of each upon return to the Normal state.

The PBE# signal may be driven when the processor is in Stop-Grant state. PBE# will

be asserted if there is any pending in terrupt or Monitor event latched within the

processor. Pending interrupts that are blocked by the EFLAGS.IF bit being clear will

still cause assertion of PBE#. Assertion of PBE# indicates to system logic that the

entire processor should return to the Normal state.

A transition to the Stop-Grant Snoop state occurs when the processor detects a snoop

on the FSB (see Section 2.1.2.3). A transition to the Sleep state (see Section 2.1.2.4)

occurs with the assertion of the SLP# signal.

2.1.2.3 Stop-Grant Snoop State

The processor responds to snoop or interrupt transactions on the FSB while i n Stop-

Grant state by entering the Stop-Grant Snoop state. The processor will stay in this

state until the snoop on the FSB has been serviced (whether by the processor or

another agent on the FSB) or the interrupt has been latched. The processor returns to

the Stop-Grant state once the snoop has been serviced or the interrupt has been

latched.

2.1.2.4 Sleep State

The Sleep state is a low-power state in which the processor maintains its context,

maintains the phase-locked loop (PLL), and stops all internal clocks. The Sleep state is

entered through assertion of the SLP# signal while in the Stop-Grant state. The SLP#

pin should only be asserted when the processor is in the Stop-Grant state. SLP#

assertion while the processor is not in the Stop-Grant state is out of specification and

may result in unapproved operation.

In the Sleep state, the processor is incapable of responding to snoop transactions or

latching interrupt signals. No transitions or assertions of signals (with the exception of

SLP#, DPSLP#, or RESET#) are allowed on the FSB while the processor is in Sleep

state. Snoop events that occur while in Sleep state or duri ng a transition into or out of

Sleep state will cause unpredictable behavior. Any transition on an input signal before

the processor has returned to the Stop-Grant state will result in unpredictable

behavior.

If RESET# is driven active while the processor is in the Sleep state, and held active as

specified in the RESET# pin specification, then the processor will reset itself, ignoring

the transition through Stop-Grant state. If RESET# is driven active while the processor

is in the Sleep state, the SLP# and STPCLK# signals should be de-asserted

immediately after RESET# is asserted to ensure the processor correctly executes the

Reset sequence.

Low Power Features

Datasheet 15

While in the Sleep state, the processor is capable of entering an even lower power

state, the Deep Sleep state, by asserting the DPSLP# pin (see Section 2.1.2.5). While

the processor is in the Sleep state, the SLP# pin must be de-asserted if another

asynchronous FSB event needs to occur.

2.1.2.5 Deep Sleep State

The Deep Sleep state is entered through assertion of the DPSLP# pin while in the

Sleep state. BCLK may be stopped during the Deep S leep state for additional platform

level power savings. BCLK stop/restart timi ngs on appropriate chipset-based platforms

with the CK505 clock chip are as follows:

• Deep Sleep entry: the system clock chip may stop/tri-state BCLK withi n 2 BCLKs

of DPSLP# assertion. It is permissibl e to leave BCLK running during Deep Sleep.

• Deep Sleep exit: the system clock chip must start toggling BCLK within 10 BCLK

periods within DPSLP# de-assertion.

To re-enter the Sleep state, the DPSLP# pin must be de-asserted. BCLK can be re-

started after DPSLP# de-assertion as described above. A period of 15 microseconds

(to allow for PLL stabilization) must occur before the processor can be considered to

be in the Sleep state. Once in the Sleep state, the SLP# pin must be de-asserted to

re-enter the Stop-Grant state.

While in Deep Sleep state, the processor is incapable of responding to snoop

transactions or latching interrupt signals. No transitions of signals are allowed on the

FSB while the processor is in Deep Sleep state. When the processor is in Deep Sleep

state, it will not respond to interrupts or snoop transactions. Any transition on an

input signal before the processor has returned to Stop-Grant state will result in

unpredictable behavior.

2.1.2.6 Deeper Sleep State

The Deeper Sleep state is si milar to the Deep Sleep state but further reduces core

voltage levels. One of the potential lower core voltage levels is achieved by entering

the base Deeper Sleep state. The Deeper Sleep state is entered through assertion of

the DPRSTP# pin while in the D eep Sleep state. The followi ng lower core voltage level

is achieved by entering the Intel Enhanced Deeper Sleep state which is a sub-state of

Deeper Sleep state. Intel Enhanced D eeper Sleep state is entered through assertion of

the DPRSTP# pin while i n the Deep Sleep only when the L2 cache has been completel y

shut down. Refer to Section 2.1.2.6. 1 for further details on reducing the L2 cache and

entering Intel Enhanced Deeper Sleep state.

In response to entering Deeper Sleep, the processor drives the VID code

corresponding to the Deeper Sleep core vol tage on the VID [6:0] pins.

Exit from Deeper Sleep or Intel Enhanced D eeper Sleep state is initiated by DPRSTP#

de-assertion when the core requests a package state other than C4 or the core

requests a processor performance state other than the lowest operating point.

2.1.2.6.1 Intel Enhanced Deeper Sleep State

Intel Enhanced Deeper Sleep state is a sub-state of Deeper Sleep that extends power

saving capabilities by allowing the processor to further reduce core voltage once the

Low Power Features

16 Datasheet

L2 cache has been reduced to zero ways and completely shut down. The following

events occur when the processor enters Intel Enhanced Deeper Sleep state:

• The processor issues a P_LVL4 I/O read or an MWAIT(C4) instruction and then

progressively reduces the L2 cache to zero.

• The processor drives the VID code corresponding to the Intel Enhanced Deeper

Sleep state core voltage on the VID [6:0] pins.

2.2 Dynamic Cache Sizing

Dynamic Cache Sizi ng allows the processor to flush and disable a programmable

number of L2 cache ways upon each Deeper Sleep entry under the following

conditions:

• The C0 timer that tracks continuous residency in the Normal package state, has

not expired. This timer i s cleared during the first entry into Deeper S leep to allow

consecutive Deeper Sleep entri es to shrink the L2 cache as needed.

• The FSB speed to processor core speed ratio is below the predefi n ed L2 shrink

threshold.

If the FSB speed to processor core speed ratio is above the predefined L2 shrink

threshold, then L2 cache expansion will be requested. If the ratio is zero, then the

ratio will not be taken into account for Dynamic Cache Sizing decisions.

Upon STPCLK# de-assertion, the core exiting Intel Enhanced Deeper Sleep state will

expand the L2 cache to two ways and invalidate previousl y disabled cache ways. If the

L2 cache reduction conditions stated above still exist when the core returns to C4 then

package enters Intel Enhanced Deeper Sleep state, then the L2 will be shrunk to zero

again. If the core requests a processor performance state resulting in a higher ratio

than the predefined L2 shrink threshold, the C0 timer expires, then the whole L2 will

be expanded upon the next interrupt event.

L2 cache shrink prevention may be enabled as needed on occasion through an

MWAIT(C4) sub-state field. If shrink prevention is enabled, the processor does not

enter Intel Enhanced Deeper Sleep state since the L2 cache remains valid and in full

size.

Low Power Features

Datasheet 17

2.3 Enhanced Intel SpeedStep® Technology

The processor features Enhanced Intel SpeedStep Technology. Fol lowing are the key

features of Enhanced Intel SpeedStep Technology:

• Multiple voltage and frequency operating points provide optimal performance at

the lowest power.

• Voltage and frequency selection is software controlled by writing to processor

MSRs:

⎯ If the target frequency is higher than the current frequency, VCC is ramped up

in steps by placing new values on the VID pins and the PLL then locks to the

new frequency.

⎯ If the target frequency is lower than the current frequency, the PLL locks to

the new frequency and the VCC is changed through the VID pin mechanism.

⎯ Software transitions are accepted at any time. If a previous transition is in

progress, the new transition is deferred until the previous transition

completes.

• The processor controls voltage ramp rates internally to ensure glitch free

transitions.

• Low transition latency and large number of transitions possible per second:

⎯ Processor core (including L2 cache) is unavailable for up to 10 μs during the

frequency transition.

— The bus protocol (BNR# mechanism) is used to block snoopi ng.

• Improved Intel® Thermal Monitor mode:

⎯ When the on-die thermal sensor indicates that the di e temperature is too high,

the processor can automatically perform a transition to a lower frequency and

voltage specified in a software programmable MSR.

⎯ The processor waits for a fixed time period. If the die temperature is down to

acceptable levels, an up transition to the previous frequency and voltage point

occurs.

⎯ An interrupt is generated for the up and down Intel Thermal Monitor

transitions enabling better system level thermal management.

• Enhanced thermal management features:

⎯ Digital Thermal Sensor and Out of Specification detection

⎯ Intel Thermal Monitor-1 in addition to Intel Thermal Monitor-2 in case of

unsuccessful Intel Thermal Monitor-2 transition.

Low Power Features

18 Datasheet

2.4 Enhanced Low-Power States

Enhanced low-power states (C1E, C2E, C4E) optimize for power by forcibly reducing

the performance state of the processor when it enters a package low-power state.

Instead of directly transitioning into the package low-power state, the enhanced

package low-power state first reduces the performance state of the processor by

performing an Enhanced Intel SpeedStep Technology transition down to the lowest

operating point. Upon receiving a break event from the package low-power state,

control will be returned to software while an Enhanced Intel SpeedStep Technology

transition up to the initial operating point occurs. The advantage of this feature is that

it significantly reduces leakage while in the Stop-Grant and Deeper Sleep states.

Note: Long-term reliability cannot be assured unless all the Enhanced Low-Power States are

enabled.

The processor implements two software interfaces for requesting enhanced package

low-power states: MWAIT instruction extensions with sub-state hints and via BIOS by

configuring a software programmable MSR bit to automatically promote package low-

power states to enhanced package low-power states.

Enhanced Intel SpeedStep Technology transitions are multi-step processes that

require clocked control. These transi tions cannot occur when the processor is in the

Sleep or Deep Sleep package low-power states since processor clocks are not active in

these states. Enhanced Deeper Sleep is an exception to this rule when the Hard C4E

configuration is enabled in a software programmable MSR bit. This Enhanced Deeper

Sleep state configuration will lower core voltage to the Deeper Sleep level while in

Deeper Sleep and, upon exit, will automatically transition to the lowest operating

voltage and frequency to reduce snoop service latency. The transition to the lowest

operating point or back to the original software requested point may not be

instantaneous. Furthermore, upon very frequent transitions between active and idle

states, the transitions may lag behi nd the idle state entry resulting in the processor

either executing for a longer time at the lowest operating point or running idle at a

high operating point. Observations and analyses show this behavior should not

significantly impact total power savings or performance score while providing power

benefits in most other cases.

Low Power Features

Datasheet 19

2.5 FSB Low Power Enhancements

The processor incorporates FSB low power enhancements:

• BPRI# control for address and control input buffers

• Dynamic Bus Parking

• Dynamic On Die Termination disabling

• Low VCCP (I/O termination voltage)

The processor incorporates the DPWR# signal that controls the data bus input buffers

on the processor. The DPWR# signal disabl es the buffers when not used and activates

them only when data bus activity occurs, resulting in signifi cant power savings with no

performance impact. BPRI# control also allows the processor address and control

input buffers to be turned off when the BPRI# signal is inactive. Dynamic Bus Parking

allows a reciprocal power reduction in chipset address and control input buffers when

the processor de-asserts its BR0# pin. The on-die terminati on on the processor FSB

buffers is disabled when the signals are driven low, resulting in additional power

savings. The low I/O termination voltage is on a dedicated voltage plane independent

of the core voltage, enabling low I/O switching power at all times.

2.5.1 Front Side Bus

The processor has only one signaling mode, where the data and address buses and

the strobe signals are operating in GTL mode. The reason to use GTL is to improve

signal integrity.

Electrical Specifications

20 Datasheet

3 Electrical Specifications

3.1 Power and Ground Pins

For clean, on-chip power distribution, the processor will have a large number of VCC

(power) and VSS (ground) inputs. All power pins must be connected to VCC power

planes while all VSS pins must be connected to system ground planes. Use of multiple

power and ground planes is recommended to reduce I*R drop. The processor VCC pins

must be supplied the voltage determin ed by the VID (Voltage ID) pins.

3.2 FSB Clock (BCLK [1:0]) and Processor Clocking

BCLK [1:0] directly controls the FSB interface speed as well as the core frequency of

the processor. As in previous generation processors, the processor core frequency is a

multiple of the BCLK [1:0] frequency. The processor uses a differential clocking

implementation.

3.3 Voltage Identification

The processor uses seven voltage identificati on pins (VID [6:0]) to support automatic

selection of power supply voltages. The VID pi ns for the processor are CMOS outputs

driven by the processor VID circuitry. Table 3 specifies the voltage level corresponding

to the state of VID [6:0]. A “1” in this refers to a high-voltage level and a “0” refers to

low-voltage level.

Table 3. Voltage Identification Definition

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

0 0 1 1 0 0 0 1.2000

0 0 1 1 0 0 1 1.1875

0 0 1 1 0 1 0 1.1750

0 0 1 1 0 1 1 1.1625

0 0 1 1 1 0 0 1.1500

0 0 1 1 1 0 1 1.1375

0 0 1 1 1 1 0 1.1250

0 0 1 1 1 1 1 1.1125

0 1 0 0 0 0 0 1.1000

0 1 0 0 0 0 1 1.0875

0 1 0 0 0 1 0 1.0750

Electrical Specifications

Datasheet 21

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

0 1 0 0 0 1 1 1.0625

0 1 0 0 1 0 0 1.0500

0 1 0 0 1 0 1 1.0375

0 1 0 0 1 1 0 1.0250

0 1 0 0 1 1 1 1.0125

0 1 0 1 0 0 0 1.0000

0 1 0 1 0 0 1 0.9875

0 1 0 1 0 1 0 0.9750

0 1 0 1 0 1 1 0.9625

0 1 0 1 1 0 0 0.9500

0 1 0 1 1 0 1 0.9375

0 1 0 1 1 1 0 0.9250

0 1 0 1 1 1 1 0.9125

0 1 1 0 0 0 0 0.9000

0 1 1 0 0 0 1 0.8875

0 1 1 0 0 1 0 0.8750

0 1 1 0 0 1 1 0.8625

0 1 1 0 1 0 0 0.8500

0 1 1 0 1 0 1 0.8375

0 1 1 0 1 1 0 0.8250

0 1 1 0 1 1 1 0.8125

0 1 1 1 0 0 0 0.8000

0 1 1 1 0 0 1 0.7875

0 1 1 1 0 1 0 0.7750

0 1 1 1 0 1 1 0.7625

0 1 1 1 1 0 0 0.7500

0 1 1 1 1 0 1 0.7375

0 1 1 1 1 1 0 0.7250

0 1 1 1 1 1 1 0.7125

1 0 0 0 0 0 0 0.7000

1 0 0 0 0 0 1 0.6875

1 0 0 0 0 1 0 0.6750

1 0 0 0 0 1 1 0.6625

1 0 0 0 1 0 0 0.6500

1 0 0 0 1 0 1 0.6375

Electrical Specifications

22 Datasheet

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

1 0 0 0 1 1 0 0.6250

1 0 0 0 1 1 1 0.6125

1 0 0 1 0 0 0 0.6000

1 0 0 1 0 0 1 0.5875

1 0 0 1 0 1 0 0.5750

1 0 0 1 0 1 1 0.5625

1 0 0 1 1 0 0 0.5500

1 0 0 1 1 0 1 0.5375

1 0 0 1 1 1 0 0.5250

1 0 0 1 1 1 1 0.5125

1 0 1 0 0 0 0 0.5000

1 0 1 0 0 0 1 0.4875

1 0 1 0 0 1 0 0.4750

1 0 1 0 0 1 1 0.4625

1 0 1 0 1 0 0 0.4500

1 0 1 0 1 0 1 0.4375

1 0 1 0 1 1 0 0.4250

1 0 1 0 1 1 1 0.4125

1 0 1 1 0 0 0 0.4000

1 0 1 1 0 0 1 0.3875

1 0 1 1 0 1 0 0.3750

1 0 1 1 0 1 1 0.3625

1 0 1 1 1 0 0 0.3500

1 0 1 1 1 0 1 0.3375

1 0 1 1 1 1 0 0.3250

1 0 1 1 1 1 1 0.3125

1 1 0 0 0 0 0 0.3000

Electrical Specifications

Datasheet 23

3.4 Catastrophic Thermal Protection

The processor supports the THERMTRIP# signal for catastrophic thermal protection.

An external thermal sensor should also be used to protect the processor and the

system against excessive temperatures. Even with the activation of THERMTRIP#,

which halts all processor internal clocks and activity, leakage current can be high

enough such that the processor cannot be protected in all conditions without the

removal of power to the processor. If the external thermal sensor detects a

catastrophic processor temperature of 125°C (maximum), or if the THERMTRIP#

signal is asserted, the VCC supply to the processor must be turned off within 500 ms

to prevent permanent silicon damage due to thermal runaway of the processor.

THERMTRIP# functionality is not ensured if the PWRGOOD signal is not asserted.

3.5 Reserved and Unused Pins

All other RSVD signals can be left as No Connect. Connection of these pins to VCC, VSS,

or to any other signal (including each other) can result in component malfunction or

incompatibility with future processors. See Section 4.2 for a pin listing of the

processor and the location of all RSVD pins.

For reliable operation, always connect unused inputs or bidirectional signals to an

appropriate signal level. Unused active low AGTL+ inputs may be left as no connects if

AGTL+ termination is provided on the processor silicon. Unused active high inputs

should be connected through a resistor to ground (VSS). Unused outputs can be left

unconnected.

3.6 FSB Frequency Select Signals (BSEL [2:0])

The BSEL [2:0] signals are used to select the frequency of the processor input clock

(BCLK [1:0]). These signals should be connected to the clock chi p and the appropriate

chipset on the platform. The BSEL encoding for BCLK [1:0] is shown in Table 4.

Table 4. BSEL [2:0] Encoding for BCLK Frequency

BSEL [2] BSEL [1] BSEL [0] BCLK Frequency

L L H 133 MHz

Electrical Specifications

24 Datasheet

3.7 FSB Signal Groups

To simplify the following discussion, the FSB signals have been combined into groups

by buffer type. AGTL+ input signals have differential input buffers, which use GTLREF

as a reference level. In this document, the term “AGTL+ Input” refers to the AGTL+

input group as well as the AGTL+ I/O group when recei v ing. Simil arly, “AGTL+

Output” refers to the AGTL+ output group as well as the AGTL+ I/O group when

driving.

With the implementation of a source synchronous data bus comes the need to specify

two sets of timing parameters. One set is for common clock si gnals which are

dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second

set is for the source synchronous signals which are relative to their respective strobe

lines (data and address) as well as the rising edge of BCLK0. Asynchronous signals are

still present (A20M#, IGNNE#, etc.) and can become active at any time during the

clock cycle. Table 5 identifies which signals are common clock, source synchronous,

and asynchronous.

Table 5. FSB Pin Groups

Signal Group Type Signals1

AGTL+ Common

Clock Input Synchronous

to BCLK [1:0] BPRI#, DEFER#, PREQ#4, RESET#, RS [2:0]#,

TRDY#, DPWR#

AGTL+ Common

Clock I/O Synchronous

to BCLK [1:0] ADS#, BNR#, BPM [3:0]#, BR0#, DBSY#, DRDY#,

HIT#, HITM#, LOCK#, PRDY#

AGTL+ Source

Synchronous I/O

Synchronous

to assoc.

strobe

Signals Associated Strobe

REQ [4:0]#, A

[16:3]# ADSTB0#

A [31:17]# ADSTB1#

D [15:0]# DSTBP0#, DSTBN0#

D [31:16]# DSTBP1#, DSTBN1#

D [47:32]# DSTBP2#, DSTBN2#

D [63:48]# DSTBP3#, DSTBN3#

AGTL+ Strobes Synchronous

to BCLK [1:0] ADSTB [1:0]#, DSTBP [3:0]#, DSTBN [3:0]#

CMOS Input Asynchronous DPRSTP#, DPSLP#, IGNNE#, INIT#, LINT0/INTR,

LINT1/ NMI, PWRGOOD, SMI#, SLP#, STPCLK#

Open Drain Output Asynchronous FERR#, THERMTRIP#, IERR#

Open Drain I/O Asynchronous PROCHOT#3

CMOS Output Asynchronous VID [6:0], BSEL [2:0 ]

CMOS Input Synchronous

to TCK TCK, TDI, TMS, TRST#

Electrical Specifications

Datasheet 25

Signal Group Type Signals1

Open Drain Output Synchronous

to TCK TDO

FSB Clock Clock BCLK [1:0]

Power/Other COMP [3:0], HFPLL (old name is DBR#2), CMREF,

GTLREF, TEST2/Dclk, TEST1/Aclk, THERMDA,

THERMDC, VCC, VCCA, VCCP, VCC_SENSE, VSS,

VSS_SENSE, VCCQ [1:0], VCCPC6

NOTES:

1. Refer to Chapter 4 for signal descriptions and termination requirements.

2. In processor systems where there is no debug port implemented on the system board,

these signals are used to support a debug port interposer. In systems with the debug

port implemented on the system board, these signals are no connects.

3. PROCHOT# signal type is open drain output and CMOS input.

3.8 CMOS Asynchronous Signals

CMOS input signals are shown in Table 5. Legacy output FERR#, IERR# and other

non- AGTL+ signals (THERMTRIP# and PROCHOT#) use Open Drain output buffers.

These signals do not have setup or hold time specifications in relation to BCLK [1:0].

However, all of the CMOS signals are required to be asserted for more than 5 BCLKs

for the processor to recognize them. See Section 3.10 for the DC specificati ons for the

CMOS signal groups.

3.9 Maximum Ratings

Table 6 specifies absolute maximum and minimum ratings. Within functional operation

limits, functionality and long-term reliability can be expected.

At conditions outside functional operation condition limits, but within absolute

maximum and minimum ratings, neither functionality nor long term reliability can be

expected. If a device is returned to conditions within functional operation limits after

having been subjected to conditions outside these l imits, but within the absol ute

maximum and minimum ratings, the device may be functional, but with its lifetime

degraded depending on exposure to conditions exceeding the functional operation

condition limits.

At conditions exceeding absolute maximum and minimum ratings, neither functionali ty

nor long term reliability can be expected. Moreover, if a device is subjected to these

conditions for any length of time then, when returned to conditions within the

functional operating condition limits, it will either not function or its reliability will be

severely degraded.

Although the processor contains protective circuitry to resist damage from static

electric discharge, precautions shoul d always be taken to avoid high static voltages or

electric fiel ds.

Electrical Specifications

26 Datasheet

Table 6. Processor Absolute Maximum Ratings

Symbol Parameter Min Max Unit Notes1,5

TSTORAGE Processor Storage Temperature -40 85 °C 2

VCC, VCCP Any Processor Supply Voltage with

Respect to VSS -0.3 1.10 V 1

VinAGTL+ AGTL+ Buffer DC Input Voltage

with Respect to VSS -0.1 1.10 V 1, 2

VinAsynch_CMOS CMOS Buffer DC Input Voltage with

Respect to VSS -0.1 1.10 V 1, 2

NOTES:

1. This rating applies to the processor and does not include any tray or packaging.

2. Contact Intel for storage requirements in excess of one year.

3.10 Processor DC Specifications

The processor DC specifications in this section are defined at the processor core

(pads) unless noted otherwise. See Chapter 4 for the pin signal definitions and signal

pin assignments. Most of the signals on the FSB are in the AGTL+ signal group. The

DC specifications for these signals are listed in Table 9. DC specifications for the CMOS

group are listed in Table 10.

Table 9 through Table 11 list the DC specificati ons for the processor and are valid only

while meeting specifications for junction temperature, clock frequency, and input

voltages. The Highest Frequency Mode (HFM) and Lowest Frequency Mode (LFM) refer

to the highest and lowest core operating frequencies supported on the processor.

Active mode load line specifications apply in all states except in the Deep Sleep and

Deeper Sleep states. VCC,BOOT is the default voltage driven by the voltage regulator at

power up in order to set the VID values. Unless specified otherwise, all specifications

for the processor are at TJ = 90°C.

Note: Care should be taken to read all notes associated with each parameter.

Electrical Specifications

Datasheet 27

Table 7. Voltage and Current Specifications for the Processors

Symbol Parameter Min Typ Max Unit Notes13

FSB

Frequency BCLK Frequency 132.63 133.33 133.37 MHz

VCCHFM VCC at Highest Frequency Mode (HFM) AVID - 1.10 V 1, 2, 11

VCCLFM VCC at Lowest Frequency Mode (LFM) 0.75 — AVID V 1, 2

VCC,BOOT Default VCC Voltage for Initial Power

Up — 1.20 — V 2, 6

VCCP AGTL+ Termination Voltage 1.00 1.05 1.10 V

VCCA PLL Supply voltage 1.425 1.5 1.575 V

VCCDPRSLP V

CC at Deeper Sleep (C4) 0.75 — 1.0 V 1, 2

VCCF Fuse Power Supply 1.00 1.05 1.10 V

ICCDES ICC for Processors Recommended

Design Target (Estimated) — — 4.0 A

ICC for Processors — — — — —

Processor

Number Core Frequency/Voltage — — — — —

ICC

N270 1.6GHz / 1.10V — — 3 A 3, 4

IAH,

ISGNT

ICC Auto-Halt & Stop-Grant

HFM: 1.6 GHz @ 1.10 Volts

LFM: 0.8 – 1.2 GHz @ 0.75 – 1.00

Volts

—

2.2

1.5

A 3, 4

IDSLP

ICC Deep Sleep

HFM: 1.6 GHz @ 1.10 Volts

LFM: 0.8 GHz @ 0.75 – 1.00 Volts

—

1.4

0.6

A At 50°C 3, 4

IDPRSLP I

CC Deeper Sleep (C4) — — 0.2 A At 50°C 3, 4

dICC/dt VCC Power Supply Current Slew Rate

at Processor Package Pin (Estimated) — — 2.5 A/µs 5, 7

ICCA I

CC for VCCA Supply — — 130 mA

ICCP ICCP before VCC Stable — — 2.5 A 8

ICCP I

CCP after VCC Stable — — 1.5 A 9

NOTES:

1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at

manufacturing and can not be altered. Individual maximum VID values are calibrated during

manufacturing such that two processors at the same frequency may have different settings within the VID

range. Note that this differs from the VID employed by the processor during a power management event

(Thermal Monitor 2, Enhanced Intel SpeedStep technology, or Enhanced Halt State). Typical AVID range is

0.8 V to 0.85 V.

2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket

with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-MΩ minimum

Electrical Specifications

28 Datasheet

impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external

noise from the system is not coupled in the scope probe.

3. Specified at 90°C TJ.

4. Specified at the nominal VCC.

5. Measured at the bulk capacitors on the motherboard.

6. VCC,BOOT tolerance is shown in Figure 3 and Figure 4.

7. Based on simulations and averaged over the duration of any change in current. Specified by

design/characterization at nominal VCC. Not 100% tested.

8. This is a power-up peak current specification, which is applicable when VCCP is high and VCC_CORE is low.

9. This is a steady-state ICC current specification, which is applicable when both VCCP and VCC_CORE are high.

10. The VCC max supported by the process is 1.1 V but the parameter can change (burnin voltage is higher).

11. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical

data. These specifications will be updated with characterized data from silicon measurements at a later

date.

Figure 3. Active VCC and ICC Processor Loadline

13 mV = Ripple

Slope = -5.9 mV/A at package

VCC_SENSE, VSS_SENSE pins.

Differential Remote Sense required.

VCC (V)

ICC (A)

VCC, DC Min[HFM][LFM]

VCC Min[HFM][LFM] ±VCC nom*1.5 %

= VR ST Pt Error 1/

VCC Nom[HFM][LFM]

VCC Max[HFM][LFM]

VCC, DC Max[HFM][LFM]

ICC max[HFM][LFM]

Note 1/ VCC Set Point Error Tolerance is per below:

Tolerance

--------------------------------

±1.5%

±11.5 mV

VCC Active Mode VID Code Range

----------------------------------------

VCC > 0.7500 V (VID 0111100)

VCC 0.7500 V (VID 0111100)

Electrical Specifications

Datasheet 29

Figure 4. Deeper Sleep VCC and ICC Processor Loadline

Table 8. FSB Differential BCLK Specifications

Symbol Parameter Min Typ Max Unit Figure Notes1

VIH Input High Voltage — — 1.15 V 7, 8

VOH Input Low Voltage — — -0.3 V 7, 8

VCROSS Crossing Voltage 0.3 — 0.55 V 2, 7, 9

ΔVCROSS Range of Crossing Points — — 140 mV 2, 7, 5

VSWING Differential Output Swing 300 — — mV 6

ILI Input Leakage Current -5 — +5 µA 3

Cpad Pad Capacitance 1.2 1.45 2.0 pF 4

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Crossing Voltage is defined as absolute voltage where rising edge of BCLK0 is equal to the falling edge of

BCLK1.

3. For Vin between 0 V and VIH.

4. Cpad includes die capacitance only. No package parasitics are included.

5. ΔVCROSS is defined as the total variation of all crossing voltages as defined in note 2.

6. Measurement taken from differential waveform.

7. Measurement taken from single-ended waveform.

8. “Steady state” voltage, not including Overshoots or Undershoots.

9. Only applies to the differential rising edge (BCLK0 rising and BCLK1 falling).

Electrical Specifications

30 Datasheet

Table 9. AGTL+ Signal Group DC Specifications

Symbol Parameter Min Typ Max Unit Notes1

VCCP I/O Voltage 1.00 1.05 1.10 V

GTLREF GTL Reference Voltage — 2/3 VCCP — V 6

RCOMP Compensation Resistor 27.23 27.5 27.78 Ω 10

RODT Termination Resistor — 55 — Ω 11

VIH Input High Voltage GTLREF+0.10 VCCP V

CCP+0.10 V 3,6

VIL Input Low Voltage -0.10 0 GTLREF–0.10 V 2,4

VOH Output High Voltage VCCP–0.10 VCCP V

CCP V 6

RTT Termination Resistance 46 [SS]

46 [CC] 55 61 [SS]

64 [CC] Ω 7, 12

RON (GTL

mode) GTL Buffer on Resistance 21 25 29 Ω 5

ILI Input Leakage Current — — ±100 µA 8

Cpad Pad Capacitance 1.8 2.1 2.75 pF 9

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low

value.

3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high

value.

4. VIH and VOH may experience excursions above VCCP. However, input signal drivers must comply with the

signal quality specifications.

5. This is the pull-down driver resistance.

6. GTLREF should be generated from VCCP with a 1% tolerance resistor divider.

7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver.

8. Specified with on-die RTT and RON are turned off.

9. Cpad includes die capacitance only. No package parasitics are included.

10. There are external resistor on the comp0 and comp2 pins.

11. On-die termination resistance, measured at 0.33*VCCP.

12. SS: source synchronous pins such as quad-pumped data bus and double-pumped address bus which

require a clock strobe. CC: Common clock pins.

Electrical Specifications

Datasheet 31

Table 10. Legacy CMOS Signal Group DC Specifications

Symbol Parameter Min Typ Max Unit Notes1

VCCP I/O Voltage 1.00 1.05 1.10 V

VIH Input High Voltage 0.7*VCCP V

CCP VCCP+0.1 V 2

VIL Input Low Voltage

CMOS -0.10 0.00 0.3*VCCP V 2, 3

VOH Output High Voltage 0.9*VCCP V

CCP V

CCP+0.1 V 2

VOL Output Low Voltage -0.10 0 0.1*VCCP V 2

IOH Output High Current 1.5 — 4.1 mA 5

IOL Output Low Current 1.5 — 4.1 mA 4

ILI Input Leakage

Current — — ± 100 µA 6

Cpad1 Pad Capacitance 1.6 2.1 2.55 pF 7

Cpad2 Pad Capacitance for

CMOS Input 0.95 1.2 1.45 8

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. The VCCP referred to in these specifications refers to instantaneous VCCP.

3. Reserved.

4. Measured at 0.1*VCCP.

5. Measured at 0.9*VCCP.

6. For Vin between 0V and VCCP. Measured when the driver is tri-stated.

7. Cpad1 includes die capacitance only for DPRSTP#, DPSLP#, PWRGOOD. No package

parasitics are included.

8. Cpad2 includes die capacitance for all other CMOS input signals. No package parasitics

are included.

Electrical Specifications

32 Datasheet

Table 11. Open Drain Signal Group DC Specifications

Symbol Parameter Min Typ Max Unit Notes1

VOH Output High Voltage VCCP-–5% VCCP V

CCP+5% V 3

VOL Output Low Voltage 0 — 0.20 V

IOL Output Low Current 16 — 50 mA 2

ILO Output Leakage

Current — — ±200 µA 4

Cpad Pad Capacitance 1.9 2.2 2.45 pF 5

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Measured at 0.2 VCCP.

3. VOH is determined by value of the external pull-up resistor to VCCP.

4. For Vin between 0 V and VOH.

5. Cpad includes die capacitance only. No package parasitics are included.

Package Mechanical Specifications and Pin Information

Datasheet 33

4 Package Mechanical

Specifications and Pin

Information

This chapter provides the package specifications, pin-out assignments, and signal

description.

4.1 Package Mechanical Specifications

The processor is availabl e in 512 KB, 437 pins in FCBGA 8 package. The package

dimensions are shown in Figure .

Package Mechanical Specifications and Pin Information

34 Datasheet

4.1.1 Package Mechanical Drawings

Figure 5. Package Mechanical Drawing

4.2 Processor Pin-out Assignment

Figure are graphic representations of the processor pin-out assignments. Table 12 lists

the pin-out by signal name.

Package Mechanical Specifications and Pin Information

Datasheet 35

Figure 6. Pin-out Diagram (Top View, Left Side)

1 2 3 4 5 6 7 8 9101112131415161718192021

VSS RSVD_1 VSS D_B54 D_B56 GTLREF VSS VCCQ0 VCCP VCCP VCCP CORE_D

ET A_B35 VSS A_B20 A_B32 VSS VSS VSS

VSS VSS D_B60 D_B52 VSS D_B59 CMREF VSS VCCQ0 VCCP VCCP VCCP VSS A_B33 A_B34 A_B29 A_B30 A_B27 ADSTB_B

1VSS VSS

RSVD_2 D_B48 D_B55 D_B61 DINV_B3 D_B58 D_B62 VSS VTT VCCP VCCP VCCP VCC_SE

NSE A_B22 A_B28 A_B31 VSS A_B23 A_B17 A_B24 RSVD_3

VSS D_B63 D_B51 DP_B3 VSS NC_1

VCCA

VSS VTT VCCP VCCP VCCP VSS_SE

NSE VSS RESET_B VID1 AP_B0 VSS A_B21 A_B26 VSS

D_B53 DSTBN_

B3 VSS THRMDA THRMDC VSS VSS VSS VTT VCCP VCCP VCCP VCCPC6 VCCPC6 VSS VSS VID5 VID2 VSS A_B25 A_B19

D_B50 D_B57 DSTBP_B

3VSS VSS VSS VSS VTT VTT VCCP VCCP VCCP VCCPC6 VCCPC6 VID0 IERR_B VSS VSS A_B18 COMP2 COMP3

VSS D_B49 D_B40 VSS BSEL2 NC_2 VSS VTT VSS VCCP VCCP VCCP VSS VTT VID3 VID4 PROCHO

T_B VID6 REQ_B2 A_B9 VSS

D_B46 D_B41 VSS VSS BSEL1 NC_3 VSS VTT VSS VCCP VCCP VCCP VSS VTT BPM_B2 VSS THERMT

RIP_B VSS VSS A_B4 A_B11

D_B47 D_B45 D_B38 IGNNE_B VSS BSEL0 VSS VTT VSS VCCP VCCP VCCP VSS VTT BPM_B3 PREQ_B VSS BPM_B1 A_B7 A_B15 REQ_B1

VSS DSTBN_

B2 DSTBP_B

2NC_4 NC_5 VSS VSS VTT VSS VCCP VCCP VCCP VSS VTT VSS TRST_B BPM_B0 PRDY_B A_B14 ADSTB_B

0VSS

DINV_B2 D_B43 VSS VSS VSS VSS VSS VTT VSS VCCP VCCP VCCP VSS VTT VSS NC_7 TMS VSS VSS A_B12 A_B16

VSS D_B36 D_B44 DP_B2 VSS EXTBGR

EF VSS VTT VSS VCCP VCCP VCCP VSS VTT NC_6 TDO TCK AP_B1 A_B10 A_B13 VSS

D_B35 D_B42 D_B39 VSS VSS HFPLL VSS VTT VSS VCCP VCCP VCCP VSS VTT FORCEP

R_B TDI VSS SLP_B A_B8 A_B5 REQ_B0

D_B34 D_B37 VSS VSS VSS VSS VSS VTT VSS VCCP VCCP VCCP VSS VTT VSS VSS MCERR_

BVSS VSS REQ_B3 A_B3

VSS D_B33 D_B32 DP_B1 VSS EDM VSS VTT VSS VCCP VCCP VCCP VSS VTT LINT1 STPCLK_

BDPSLP_B DPRSTP

_B REQ_B4 A_B6 VSS

COMP0 COMP1 D_B28 VSS VSS RSP_B VSS VTT VSS VSS VSS VSS VSS VTT LINT0 FERR_B BINIT_B VSS DRDY_B BR0_B DEFER_

D_B19 D_B27 VSS DPWR_B ACLKPH VSS VSS VTT VTT VTT VTT VTT VTT VTT VSS VSS SMI_B A20M_B VSS RS_B2 BPRI_B

VSS D_B30 D_B26 VSS DCLKPH VSS VSS VSS DP_B0 VCCF

BCLK0 BCLK1

VSS VSS BR1_B INIT_B PWRGO

OD VSS ADS_B HITM_B VSS

VSS D_B25 D_B18 D_B31 VSS D_B21 D_B20 VSS D_B15 D_B1 VSS D_B5 D_B13 VSS D_B10 DINV_B0 VSS RS_B0 TRDY_B LOCK_B VSS

VSS VSS D_B24 DSTBN_

B1 DSTBP_B

1DINV_B1 D_B22 D_B17 D_B8 D_B7 D_B0 D_B2 D_B9 DSTBN_

B0 DSTBP_B

0D_B12 RS_B1 DBSY_B BNR_B VSS VSS

VSS VSS VSS D_B16 D_B23 VSS D_B29 D_B14 VSS D_B4 VSS D_B11 D_B3 VSS D_B6 HIT_B VSS VSS VSS

Package Mechanical Specifications and Pin Information

36 Datasheet

Table 12. Pin-out Arranged by Signal Name

Signal Name Ball #

A [10]# M19

A [11]# H21

A [12]# L20

A [13]# M20

A [14]# K19

A [15]# J20

A [16]# L21

A [17]# C19

A [18]# F19

A [19]# E21

A [20]# A16

A [21]# D19

A [22]# C14

A [23]# C18

A [24]# C20

A [25]# E20

A [26]# D20

A [27]# B18

A [28]# C15

A [29]# B16

A [3]# P21

A [30]# B17

A [31]# C16

A [32]# A17

A [33]# B14

A [34]# B15

A [35]# A14

A [4]# H20

A [5]# N20

A [6]# R20

Signal Name Ball #

A [7]# J19

A [8]# N19

A [9]# G20

A20M# U18

ACLKPH U5

ADS# V19

ADSTB [0]# K20

ADSTB [1]# B19

BCLK [0] V11

BCLK [1] V12

BNR# Y19

BPM [0]# K17

BPM [1]# J18

BPM [2]# H15

BPM [3]# J15

BPRI# U21

BR0# T20

BR1# V15

BSEL [0] J6

BSEL [1] H5

BSEL [2] G5

COMP [0] T1

COMP [1] T2

COMP [2] F20

COMP [3] F21

D [0]# Y11

D [1]# W10

D [10]# W15

D [11]# AA13

D [12]# Y16

Signal Name Ball #

D [13]# W13

D [14]# AA9

D [15]# W9

D [16]# AA5

D [17]# Y8

D [18]# W3

D [19]# U1

D [2]# Y12

D [20]# W7

D [21]# W6

D [22]# Y7

D [23]# AA6

D [24]# Y3

D [25]# W2

D [26]# V3

D [27]# U2

D [28]# T3

D [29]# AA8

D [3]# AA14

D [30]# V2

D [31]# W4

D [32]# R3

D [33]# R2

D [34]# P1

D [35]# N1

D [36]# M2

D [37]# P2

D [38]# J3

D [39]# N3

D [4]# AA11

Package Mechanical Specifications and Pin Information

Datasheet 37

Signal Name Ball #

D [40]# G3

D [41]# H2

D [42]# N2

D [43]# L2

D [44]# M3

D [45]# J2

D [46]# H1

D [47]# J1

D [48]# C2

D [49]# G2

D [5]# W12

D [50]# F1

D [51]# D3

D [52]# B4

D [53]# E1

D [54]# A5

D [55]# C3

D [56]# A6

D [57]# F2

D [58]# C6

D [59]# B6

D [6]# AA16

D [60]# B3

D [61]# C4

D [62]# C7

D [63]# D2

D [7]# Y10

D [8]# Y9

D [9]# Y13

DBSY# Y18

DCLKPH V5

Signal Name Ball #

DEFER# T21

DINV [0]# W 16

DINV [1]# Y6

DINV [2]# L1

DINV [3]# C5

DPRSTP# R18

DPWR# U4

DRDY# T19

DSTBN [0]# Y14

DSTBN [1]# Y4

DSTBN [2]# K2

DSTBN [3]# E2

DSTBP [0]# Y15

DSTBP [1]# Y5

DSTBP [2]# K3

DSTBP [3]# F3

FERR# T16

FORCEPR# N15

GTLREF A7

HIT# AA17

HITM# V20

IERR# F16

IGNNE# J4

INIT# V16

LINT0 T15

LINT1 R15

LOCK# W20

MCERR# P17

NC D6

NC G6

NC H6

Signal Name Ball #

NC K4

NC K5

NC M15

NC L16

PRDY# K18

PREQ# J16

PROCHOT# G17

PWRGOOD V17

REQ [0]# N21

REQ [1]# J21

REQ [2]# G19

REQ [3]# P20

REQ [4]# R19

RESET# D15

RS [0]# W18

RS [1]# Y17

RS [2]# U20

AP#0 D17

DPSLP# R17

AP#1 M18

BNT# T17

CMREF B7

CORE_DET A13

EDM R6

HPPLL N6

RSP# T6

RSVD A3

RSVD C1

RSVD C21

VCCPC61 E13

VCCPC62 E14

Package Mechanical Specifications and Pin Information

38 Datasheet

Signal Name Ball #

VCCPC63 F13

VCCPC64 F14

SLP# N18

SMI# U17

STPCLK# R16

TCK M17

TDI N16

TDO M16

EXTREF M6

THERMTRIP# H17

THRMDA E4

THRMDC E5

TMS L17

TRDY# W19

TRST# K16

VCC A10

VCC A11

VCC A12

VCC B10

VCC B11

VCC B12

VCC C10

VCC C11

VCC C12

VCC D10

VCC D11

VCC D12

VCC E10

VCC E11

VCC E12

VCC F10

Signal Name Ball #

VCC F11

VCC F12

VCC G10

VCC G11

VCC G12

VCC H10

VCC H11

VCC H12

VCC J10

VCC J11

VCC J12

VCC K10

VCC K11

VCC K12

VCC L10

VCC L11

VCC L12

VCC M10

VCC M11

VCC M12

VCC N10

VCC N11

VCC N12

VCC P10

VCC P11

VCC P12

VCC R10

VCC R11

VCC R12

VCCA D7

VCCF V10

Signal Name Ball #

VCCQ0 A9

VCCQ0 B9

VCCSENSE C13

VID [0] F15

VID [1] D16

VID [2] E18

VID [3] G15

VID [4] G16

VID [5] E17

VID [6] G18

VSS A2

VSS A4

VSS A8

VSS A15

VSS A18

VSS A19

VSS A20

VSS B1

VSS B2

VSS B5

VSS B8

VSS B13

VSS B20

VSS B21

VSS C8

VSS C17

VSS D1

VSS D5

VSS D8

VSS D14

VSS D18

Package Mechanical Specifications and Pin Information

Datasheet 39

Signal Name Ball #

VSS D21

VSS E3

VSS E6

VSS E7

VSS E8

VSS E15

VSS E16

VSS E19

VSS F4

VSS F5

VSS F6

VSS F7

VSS F17

VSS F18

VSS G1

VSS G4

VSS G7

VSS G9

VSS G13

VSS G21

VSS H3

VSS H4

VSS H7

VSS H9

VSS H13

VSS H16

VSS H18

VSS H19

VSS J5

VSS J7

VSS J9

Signal Name Ball #

VSS J13

VSS J17

VSS K1

VSS K6

VSS K7

VSS K9

VSS K13

VSS K15

VSS K21

VSS L3

VSS L4

VSS L5

VSS L6

VSS L7

VSS L9

VSS L13

VSS L15

VSS L18

VSS L19

VSS M1

VSS M5

VSS M7

VSS M9

VSS M13

VSS M21

VSS N4

VSS N5

VSS N7

VSS N9

VSS N13

VSS N17

Signal Name Ball #

VSS P3

VSS P4

VSS P5

VSS P6

VSS P7

VSS P9

VSS P13

VSS P15

VSS P16

VSS P18

VSS P19

VSS R1

VSS R5

VSS R7

VSS R9

VSS R13

VSS R21

VSS T4

VSS T5

VSS T7

VSS T9

VSS T10

VSS T11

VSS T12

VSS T13

VSS T18

VSS U3

VSS U6

VSS U7

VSS U15

VSS U16

Package Mechanical Specifications and Pin Information

40 Datasheet

Signal Name Ball #

VSS U19

VSS V1

VSS V4

VSS V6

VSS V7

VSS V8

VSS V13

VSS V14

VSS V18

VSS V21

VSS W1

VSS W5

VSS W8

VSS W11

VSS W14

VSS W17

VSS W21

VSS Y1

VSS Y2

VSS Y20

VSS Y21

VSS AA2

VSS AA3

Signal Name Ball #

VSS AA4

VSS AA7

VSS AA10

VSS AA12

VSS AA15

VSS AA18

VSS AA19

VSS AA20

VSSSENSE D13

VTT C9

VTT D9

VTT E9

VTT F8

VTT F9

VTT G8

VTT G14

VTT H8

VTT H14

VTT J8

VTT J14

VTT K8

VTT K14

VTT L8

Signal Name Ball #

VTT L14

VTT M8

VTT M14

VTT N8

VTT N14

VTT P8

VTT P14

VTT R8

VTT R14

VTT T8

VTT T14

VTT U8

VTT U9

VTT U10

VTT U11

VTT U12

VTT U13

VTT U14

DP#0 V9

DP#1 R4

DP#2 M4

DP#3 D4

Package Mechanical Specifications and Pin Information

Datasheet 41

4.3 Signal Description

Table 13. Signal Description

Signal Name Type Description

A [31:3]# I/O

A [31:3]# (Address) defines a 232-byte physical memory address

space. In sub-phase 1 of the address phase, these pins transmit

the address of a transaction.

In sub-phase 2, these pins transmit transaction type information.

These signals must connect the appropriate pins of both agents

on the processor FSB. A [31:3]# are source synchronous signals

and are latched into the receiving buffers by ADSTB [1:0]#.

Address signals are used as straps which are sampled before

RESET# is de-asserted.

A20M# I

If A20M# (Address-20 Mask) is asserted, the processor masks

physical address bit 20 (A20#) before looking up a line in any

internal cache and before driving a read/write transaction on the

bus. Asserting A20M# emulates the 8086 processor's address

wrap-around at the 1-MB boundary. Assertion of A20M# is only

supported in real mode.

A20M# is an asynchronous signal. However, to ensure

recognition of this signal follo wing an input/output write

instruction, it must be valid along with the TRDY# assertion o f

the corresponding input/output Write bus transaction.

ADS# I/O

ADS# (Address Strobe) is asserted to indicate the validity of the

transaction address on the A [31:3]# and REQ [4:0]# pins. All

bus agents observe the ADS# activation to begin parity checking,

protocol checking, address decode, internal loop, or deferred

reply ID match operations associated with the new transaction.

ADSTB [1:0]# I/O

Address strobes are used to latch A [31:3]# and REQ [4:0]# on

their rising and falling edges. Strobes are associated with signals

as shown below.

Signals Associated Strobe

REQ [4:0]#, A [16:3]# ADSTB [0]#

A [31:17]# ADSTB [1]#

BCLK [1:0] I

The differential pair BCLK (Bus Clock) determines the FSB

frequency. All FSB agents must receive these signals to drive

their outputs and latch their inputs.

All external timing parameters are specified with respect to the

rising edge of BCLK0 crossing VCROSS.

BNR# I/O

BNR# (Block Next Request) is used to assert a bus stall by any

bus agent who is unable to accept new bus transactions. During a

bus stall, the current bus owner cannot issue any new

transactions.

Package Mechanical Specifications and Pin Information

42 Datasheet

Signal Name Type Description

BPM [0]# O

BPM [1]# I/O

BPM [2]# O

BPM [3]# I/O

BPM [3:0]# (Breakpoint Monitor) are breakpoint and

performance monitor signals. They are outputs from the

processor which indicate the status of breakpoints and

programmable counters used for monitoring processor

performance. BPM [3:0]# should connect the appropriate pins of

all FSB agents. This includes debug or performance monitoring

tools.

BPRI# I

BPRI# (Bus Priority Request) is used to arbitrate for ownership of

the FSB. It must connect the appropriate pins of both FSB

agents. Observing BPRI# active (as asserted by the priority

agent) causes the other agent to stop issuing new requests,

unless such requests are part of an ongoing locked operation.

The priority agent keeps BPRI# asserted until all of its requests

are completed then releases the bus by de-asserting BPRI#.

BR0# I/O

BR0# is used by the processor to request the bus. The arbitration

is done between the processor (Symmetric Agent) and Intel

945GSE (High Priority Agent).

BSEL [2:0] O

BSEL [2:0] (Bus Select) are used to select the processor input

clock frequency. Table 4 defines the possible combinations of the

signals and the frequency associated with each combination. The

required frequency is determined by the processor, chipset and

clock synthesizer. All agents must operate at the same frequency.

For Intel® Atom™ processor N270, the BSEL is fixed to operat at

133-MHz BCLK frequency.

COMP [3:0] PWR COMP [3 :0] must be terminated on the system board using

precision (1% tolerance) resisto rs.

D [63:0]# I/O

D [63:0]# (Data) are the data signals. These signals provide a

64-bit data path between the FSB agents, and must connect the

appropriate pins on both agents. The data driver asserts DRDY#

to indicate a valid data transfer.

D [63:0]# are quad-pumped signals and will thus be driven four

times in a common clock period. D [63:0]# are latched off the

falling edge of both DSTBP [3:0]# and DSTBN [3:0]#. Each

group of 16 data signals correspond to a pair of one DSTBP# and

one DSTBN#. The following table shows the grouping of data

signals to data strobes and DINV#.

Quad-Pumped Signal

Groups Data Group DSTBN#/DSTBP# DINV#

D [15:0]# 0 0

D [31:16]# 1 1

D [47:32]# 2 2

D [63:48]# 3 3

Furthermore, the DINV# pins determine the polarity of the data

signals. Each group of 16 data signals corresponds to one DINV#

signal. When the DINV# signal is active, the corresponding data

group is inverted and therefore sampled active high.

Package Mechanical Specifications and Pin Information

Datasheet 43

Signal Name Type Description

DBSY# I/O

DBSY# (Data Bus Busy) is asserted by the agent responsible for

driving data on the FSB to indicate that the data bus is in use.

The data bus is released after DBSY# is de-asserted. This signal

must connect the appropriate pins on both FSB agents.

DEFER# I

DEFER# is asserted by an agent to indicate that a transaction

cannot be guaranteed in-order completion. Assertion of DEFER#

is normally the responsibility of the addressed memory or

Input/Output agent. This signal must connect the appropriate

pins of both FSB agents.

DINV [3:0]# I

DINV [3:0]# (Data Bus Inversion) are source synchronous and

indicate the polarity of the D [63:0]# signals. The DINV [3:0 ]#

signals are activated when the data on the data bus is inverted.

The bus agent will invert the data bus signals if more than half

the bits, within the covered group, would change level in the next

cycle. DINV [3:0]# assignment to data bus signals is shown

below.

Bus Signal Data Bus Signals

DINV [3]# D [63:48]#

DINV [2]# D [47:32]#

DINV [1]# D [31:16]#

DINV [0]# D [15:0]#

DPRSTP# I

DPRSTP# when asserted on the platform causes the processor to

transition from the Deep Sleep State to the Deeper Sleep state.

In order to return to the Deep Sleep State, DPRSTP# must be de-

asserted. DPRSTP# is driven by the South Bridge chipset.

DPSLP# I

DPSLP# when asserted on the platform causes the processor to

transition from the Sleep State to the Deep Sleep state. In order

to return to the Sleep State, DPSLP# must be de-asserted.

DPSLP# is driven by the South Bridge chipset.

DPWR# I

DPWR# is a control signal from the Intel 945GSE chipset used to

reduce power on the processor data bus input buffers.

DRDY# I/O

DRDY# (Data Ready) is asserted by the data driver on each data

transfer, indicating valid data on the data bus. In a multi-

common clock data transfer, DRDY# may be de-asserted to

insert idle clocks. This signal must connect the appropriate pins of

both FSB agents.

DSTBN [3:0]# I/O

Data strobe used to latch in D [63:0]#

Signals Associated Strobe

D [15:0]# DINV [0]#, DSTBN [0]#

D [31:16]# DINV [1]#, DSTBN [1]#

D [47:32]# DINV [2]#, DSTBN [2]#

D [63:48]# DINV [3]#, DSTBN [3]#

Package Mechanical Specifications and Pin Information

44 Datasheet

Signal Name Type Description

DSTBP [3:0]# I/O

Data strobe used to latch in D [63:0]#.

Signals Associated Strobe

D [15:0]# DINV [0]#, DSTBP [0]#

D [31:16]# DINV [1]#, DSTBP [1]#

D [47:32]# DINV [2]#, DSTBP [2]#

D [63:48]# DINV [3]#, DSTBP [3]#

FERR#/PBE# O

FERR# (Floating-point Error)PBE#(Pending Break Event) is a

multiplexed signal and its meaning is qualified with STPCLK#.

When STPCLK# is not asserted, FERR#/PBE# indicates a floating

point when the processor detects an unmasked floating-point

error. FERR# is similar to the ERROR# signal on the Intel 387

coprocessor, and is included for compatibility with systems using

MSDOS*- type floating-point error reporting. When STPCLK# is

asserted, an assertion of FERR#/PBE# indicates that the

processor has a pending break event waiting for service. The

assertion of FERR#/PBE# indicates that the processor should be

returned to the Normal state. When FERR#/PBE# is asserted,

indicating a break event, it will remain asserted until STPCLK# is

de-asserted. Assertion of PREQ# when STPCLK# is active will

also cause an FERR# break event.

For additional information on the pending break event

functionality, including identification of support of the feature and

enable/disable information, refer to Volume 3 of the Intel® 64

and IA-32 Architectures Software Developer's Manuals and the

Intel® Processor Identification and CPUID Instruction Application

Note.

For termination requirements please contact your Intel

representative.

CMREF PWR

CMREF determines the signal reference level for CMOS input pins.

CMREF should be set at 1/2 VCCP. CMREF is used by the CMOS

receivers to determine if a signal is a logical-0 or logical-1.

NOTE: Because of not using CMOS, CMREF and GTLREF should be

provided with 2/3 VCCP.

GTLREF PWR

GTLREF determines the signal reference level for AGTL+ input

pins. GTLREF should be set at 2/3 VCCP. GTLREF is used by the

AGTL+ receivers to determine if a signal is a logical-0 o r logical-

HIT#

HITM# I/O

HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction

snoop operation results. Either FSB agent may assert both HIT#

and HITM# together to indicate that it requires a snoop stall,

which can be continued by reasserting HIT# and HITM# together.

Package Mechanical Specifications and Pin Information

Datasheet 45

Signal Name Type Description

IERR# O

IERR# (Internal Error) is asserted by a processor as the result of

an internal error. Assertion of IERR# is usually accompanied by a

SHUTDOWN transaction on the FSB. This transaction may

optionally be converted to an external error signal (e.g., NMI) by

system core logic. The processor will keep IERR# asserted until

the assertion of RESET#, BINIT#, or INIT#.

IGNNE# I

IGNNE# (Ignore Numeric Error) is asserted to force the processor

to ignore a numeric error and continue to execute non-control

floating-point instructions. If IGNNE# is de-asserted, the

processor generates an exception on a non-control floating-point

instruction if a previous floating-point instruction caused an error.

IGNNE# has no effect when the NE bit in control register-0 (CR0)

is set.

IGNNE# is an asynchronous signal. However, to ensure

recognition of this signal following an Input/O utput write

instruction, it must be valid along with the TRDY# assertion o f

the corresponding Input/Output Write bus transaction.

INIT# I

INIT# (Initialization), when asserted, resets integer registers

inside the processor without affecting its internal caches or

floating-point registers. The processor then begins execution at

the power-on Reset vector configured during power-on

configuration. The processor continues to handle snoop requests

during INIT# assertion. INIT# is an asynchronous signal.

However, to ensure recognition of this signal following an

Input/Output Write instruction, it must be valid along with the

TRDY# assertion of the corresponding Input/Output Write bus

transaction. INIT# must connect the appropriate pins of both FSB

agents.

If INIT# is sampled active on the active to inactive transition of

RESET#, the processor reverses its FSB data and address signals

internally to ease motherboard layout for systems where the

chipset is on the other side of the motherboard.

D [63:0] => D [0:63]

A [31:3] => A [3:31]

DINV [3:0]# is also reversed.

LINT [1:0] I

LINT [1:0] (Local APIC Interrupt) must connect the appropriate

pins of all APIC Bus agents. When the APIC is disabled, the LINT0

signal becomes INTR, a maskable interrupt request signal, and

LINT1 becomes NMI, a non-maskable interrupt. INTR and NMI

are backward compatible with the signals of those names on the

Pentium processor. Both signals are asynchronous.

Both of these signals must be software configured via BIOS

programming of the APIC register space to be used either as

NMI/INTR or LINT [1:0]. Because the APIC is enabled by default

after Reset, operation of these pins as LINT [1:0] is the default

configuration.

Package Mechanical Specifications and Pin Information

46 Datasheet

Signal Name Type Description

LOCK# I/O

Lock# indicates to the system that a transaction must occur

atomically. This signal must connect the appropriate pins of both

FSB agents. For a locked sequence of transactions, LOCK# is

asserted from the beginning of the first transaction to the end of

the last transaction.

When the priority agent asserts BPRI# to arbitrate for ownership

of the FSB, it will wait until it observes LOCK# deasserted. This

enables symmetric agents to retain ownership of the FSB

throughout the bus locked operation and ensure the atomicity of

lock.

PRDY# O

Probe Ready signal used by debug tools to request debug

operation of the processor. Please contact your Intel

representative for more implementation details.

PREQ# I

Probe Request signal used by debug tools to request debug

operation of the processor. Please contact your Intel

representative for more implementation details.

PROCHOT# I/O, O

(DP)

As an output, PROCHOT# (Processor Ho t) will go active when the

processor temperature monitoring sensor detects that the

processor has reached its maximum safe operating temperature.

This indicates that the processor Thermal Control Circuit (TCC)

has been activated, if enabled. As an input, assertion of

PROCHOT# by the system will activate the TCC, if enabled. The

TCC will remain active until the system de-asserts PROCHOT#.

This signal may require voltage translation on the motherboard.

Please contact your Intel representative for more implementation

details.

PWRGOOD I

PWRGOOD (Power Good) is a processor input. The processor

requires this signal to be a clean indication that the clocks and

power supplies are stable and within their specifications. ‘Clean’

implies that the signal will remain low (capable of sinking leakage

current), without glitches, from the time that the power supplies

are turned on until they come within specification. The signal

must then transition monotonically to a high state. PWRGO OD

can be driven inactive at any time, but clocks and power must

again be stable before a subsequent rising edge of PWRGOOD. It

must also meet the minimum pulse width specification, and be

followed by a 2-ms (minimum) RESET# pulse.

The PWRGOOD signal must be supplied to the processor; it is

used to protect internal circuits against voltage sequencing

issues. It should be driven high throughout boundary scan

operation. For termination requirements, please contact your

Intel representative for more implementation details.

REQ [4:0]# I/O

REQ [4:0]# (Request Command) must connect the appropriate

pins of both FSB agents. They are asserted by the current bus

owner to define the currently active transaction type. These

signals are source synchronous to ADSTB [0] #.

Package Mechanical Specifications and Pin Information

Datasheet 47

Signal Name Type Description

RESET# I

Asserting the RESET# signal resets the processor to a known

state and invalidates its internal caches without writing back any

of their contents. For a power-on Reset, RESET# must stay active

for at least two milliseconds after VCC and BCLK have reached

their proper specifications. On observing active RESET#, both

FSB agents will de-assert their outputs within two clocks. All

processor straps must be valid within the specified setup time

before RESET# is de-asserted.

Please contact your Intel representative for more implementation

details.

RS [2:0]# I RS [2:0]# (Response Status) are driven by the response agent

(the agent responsible for completion of the current transaction),

and must connect the appropriate pins of both FSB agents.

RSVD Reserved All other RSVD signals can be left as No Connects.

SLP# I

SLP# (Sleep), when asserted in Stop-Grant state, causes the

processor to enter the Sleep state. During Sleep state, the

processor stops providing internal clock signals to all units,

leaving only the Phase-Locked Loop (PLL) still operating.

Processors in this state will not recognize sno ops or interrupts.

The processor will recognize only assertio n of the RESET# signal,

de-assertion of SLP#, and removal of the BCLK input while in

Sleep state. If SLP# is de-asserted, the processor exits Sleep

state and returns to Stop-Grant state, restarting its internal clock

signals to the bus and processor core units. If DPSLP# is asserted

while in the Sleep state, the processor will exit the Sleep state

and transition to the Deep Sleep state.

SMI# I

SMI# (System Management Interrupt) is asserted

asynchronously by system logic. On accepting a System

Management Interrupt, the processor saves the current state and

enters System Management Mode (SMM). An SMI Acknowledge

transaction is issued, and the processor begins program

execution from the SMM handler. If SMI# is asserted during the

de-assertion of RESET# the processor will tri-state its outputs.

STPCLK# I

STPCLK# (Stop Clock), when asserted, causes the processor to

enter a low power Stop-Grant state. The processor issues a Stop-

Grant Acknowledge transaction, and stops providing internal

clock signals to all processor core units except the FSB and APIC

units. The processor continues to snoop bus transactions and

service interrupts while in Stop-Grant state. When STPCLK# is

de-asserted, the processor restarts its internal clock to all units

and resumes execution. The assertion of STPCLK# has no effect

on the bus clock; STPCLK# is an asynchronous input.

TCK I

TCK (Test Clock) provides the clock input for the processor Test

Bus (also known as the Test Access Port). Please contact your

Intel representative for more implementation details.

TDI I

TDI (Test Data In) transfers serial test data into the processor.

TDI provides the serial input needed for JTAG specification

support. Please contact your Intel representative for more

implementation details.

Package Mechanical Specifications and Pin Information

48 Datasheet

Signal Name Type Description

TDO O

TDO (Test Data Out) transfers serial test data out of the

processor. TDO provides the serial output needed for JTAG

specification support. Please contact your Intel representative for

more implementation details.

TEST[1:4]

Refer to the appropriate platform design guide for further TEST1,

TEST2, TEST3, and TEST4 termination requirements and

implementation details. All TEST signals can be left as No

Connects.

THRMTRIP# O

The processor protects itself from catastrophic overheating by

use of an internal thermal sensor. This sensor is set well above

the normal operating temperature to ensure that there are no

false trips. The processor will stop all execution when the junction

temperature exceeds approximately 125°C. This condition is

signaled to the system by the THERMTRIP# (Thermal Trip) pin.

For termination requirements, please contact your Intel

representative for more implementation details.

THRMDA PWR Thermal Diode - Anode

THRMDC PWR Thermal Diode - Cathode

TMS I

TMS (Test Mode Select) is a JTAG specification support signal

used by debug tools. Please contact your Intel representative for

more implementation details.

TRDY# I

TRDY# (Target Ready) is asserted by the target to indicate that it

is ready to receive a write or implicit writeback data transfer.

TRDY# must connect the appropriate pins of both FSB agents.

TRST# I

TRST# (Test Reset) resets the Test Access Port (TAP) logic.

TRST# must be driven low during power on Reset. Please contact

your Intel representative for more implementation details.

VCCA PWR

VCCA provides isolated power for the internal processor core

PLLs. Please contact your Intel representative for more

implementation details.

VCC PWR Processor core power supply

VSS GND Processor core ground node.

VSS / NCTF GND Non Critical to Function

VID [6:0] O

VID [6:0] (Voltage ID) pins are used to support automatic

selection of power supply voltages (VCC). Unlike some previous

generations of processors, these are CMOS signals that are

driven by the processor. The voltage supply for these pins must

be valid before the VR can supply VCC to the processor.

Conversely, the VR output must be disabled until the voltage

supply for the VID pins becomes valid. The VID pins are needed

to support the processor voltage specification variations. See

Table 3 for definitions of these pins. The VR must supply the

voltage that is requested by the pins, or disable itself.

VCCP PWR Processor I/O Power Supply

Package Mechanical Specifications and Pin Information

Datasheet 49

Signal Name Type Description

VCC_SENSE O

VCCSENSE is an isolated low impedance connection to processor

core power (VCC). It can be used to sense or measure power near

the silicon with little noise. Please contact your Intel

representative for more implementation details.

VSS_SENSE O

VSS_SENSE is an isolated low impedance connection to processor

core VSS. It can be used to sense or measure ground near the

silicon with little noise. Please contact your Intel repr esentative

for more implementation details.

Thermal Specifications and Design Considerations

50 Datasheet

5 Thermal Specifications and

Design Considerations

The processor requires a thermal solution to maintain temperatures within operating

limits. A complete thermal solution includes both component and system level thermal

management features.

The system/processor thermal solution should be desi gned such that the processor

remains within the minimum and maximum junction temperature (TJ) specifications at

the corresponding thermal design power (TDP) value listed in Table 14 through Table

16. Thermal solutions not designed to provide this level of thermal capability may

affect the long-term reliability of the processor and system.

Attempts to operate the processor outside these operating lim its may result in

permanent damage to the processor and potentially other components in the system.

Table 14. Power Specifications for the Processor

Symbol Processor

Number Core Frequency and

Voltage Thermal Design

Power Unit Notes

TDP N270 1.6 GHz HFM VCC 2.5W W

At 90°C

1, 4

Symbol Parameter Min Typ Max Unit Notes

PAH,

PSGNT

Auto Halt, Stop Grant Power

at HFM VCC

at LFM VCC

— —

1.0

0.7

At 70°C

PDSLP Deep Sleep Power — — 0.5 W At 50°C

2, 5

PDPRSLP Deeper Sleep Power — — 0.5 W At 50°C

2, 5

TJ Junction Temperature 0 — 90 °C 3, 4

NOTES:

1. The TDP specification should be used to design the processor thermal solution. The TDP

is not the maximum theoretical power the processor can generate.

2. Not 100% tested. These power specifications are determined by characterization of the

processor currents at higher temperatures and extrapolating the values for the

temperature indicated.

3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal

Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.

Refer to Section Error! Reference source not found. for more details.

4. The Intel Thermal Monitor automatic mode must be enabled for the processor to

operate within specifications.

5. Deep Sleep state is mapped to Deeper Sleep State.

Thermal Specifications and Design Considerations

Datasheet 51

The processor incorporates three methods of monitoring die temperature: the D igital

Thermal Sensor, Intel Thermal Monitor, and the Thermal Diode. The Intel Thermal

Monitor (detailed in Section 5.2) must be used to determine when the maximum

specified processor junction temperature has been reached.

5.1 Thermal Diode

The processor incorporates an on-die PNP transistor whose base emitter juncti on is

used as a thermal “diode”, with its collector shorted to ground. The thermal diode can

be read by an off-die analog/digital converter (a thermal sensor) located on the

motherboard or a stand-alone measurement kit. The thermal di ode may be used to

monitor the die temperature of the processor for thermal management or

instrumentation purposes but is not a reliable indication that the maximum operating

temperature of the processor has been reached. When using the thermal diode, a

temperature offset value must be read from a processor MSR and applied. S ee

Section 5.2 for more details. See Section 5.3 for thermal diode usage recommendation

when the PROCHOT# signal is not asserted.

The reading of the external thermal sensor (on the motherboard) connected to the

processor thermal diode signals will not necessarily reflect the temperature of the

hottest location on the die. This i s due to inaccuracies in the external thermal sensor,

on-die temperature gradients between the location of the thermal diode and the

hottest location on the die, and time based variations in the die temperature

measurement. Time based variations can occur when the sampling rate of the thermal

diode (by the thermal sensor) is slower than the rate at which the TJ temperature can

change.

Offset between the thermal diode based temperature reading and the Intel Thermal

Monitor reading may be characterized using the Intel Thermal Monitor’s Automatic

mode activation of the thermal control circuit. This temperature offset must be taken

into account when using the processor thermal diode to implement power

management events. This offset is different than the diode Toffset value programmed

into the processor Model Specific Register (MSR).

Table 15 and Table 16 provide the diode interface and specifications. Transistor model

parameters shown in Table 16 provide more accurate temperature measurements

when the diode ideality factor is closer to the maximum or minimum li m its. Contact

your external sensor supplier for their recommendati on. The thermal diode is separate

from the Thermal Monitor’s thermal sensor and cannot be used to predict the behavior

of the Thermal Monitor.

Thermal Specifications and Design Considerations

52 Datasheet

Table 15. Thermal Diode Interface

Signal Name Pin/Ball Number Signal Description

THERMDA E4 Thermal diode anode

THERMDC E5 Thermal diode cathode

Table 16. Thermal Diode Parameters using Transistor Model

Symbol Parameter Min Typ Max Unit Notes

IFW Forward Bias Current 5 — 200 μA 1

IE Emitter Current 5 — 200 μA 1

nQ Transistor Ideality 0.997 1.001 1.015 2,3,4

Beta 0.25 — 0.65 2,3

RT Series Resistance 2.79 4.52 6.24 Ω 2,5

NOTES:

1. Intel does not support or recommend operation of the thermal diode under reverse

bias.

2. Characterized across a temperature range of 50–100°C.

3. Not 100% tested. Specified by design characterization.

4. The ideality factor, nQ, represents the deviation from ideal transistor model behavior as

exemplified by the equation for the collector current:

IC = IS * (e qVBE/nQkT –1)

where IS = saturation current, q = electronic charge, VBE = voltage across the

transistor base emitter junction (same nodes as VD), k = Boltzmann Constant, and

T = absolute temperature (Kelvin).

5. The series resistance, RT, provided in the Diode Model Table (Table 16) can be used for