BSP 762 T Smart Power High-Side-Switch Features Product Summary * Overload protection Overvoltage protection Vbb(AZ) * Current limitation Operating voltage Vbb(on) * Short circuit protection On-state resistance RON * Thermal shutdown with restart Nominal load current I L(nom) * Overvoltage protection (including load dump) * Fast demagnetization of inductive loads * Reverse battery protection with external resistor * CMOS compatible input 41 V 5...34 V 100 2 mW A Loss of GND and loss of Vbb protection * ESD - Protection * * Very low standby current Application * All types of resistive, inductive and capacitive loads * C compatible power switch for 12 V and 24 V DC applications * Replaces electromechanical relays and discrete circuits General Description N channel vertical power FET with charge pump, ground referenced CMOS compatible input, monolithically integrated in Smart SIPMOS a technology. Fully protected by embedded protection functions. Page 1 2000-02-21 BSP 762 T Block Diagram + V bb Voltage source Overvoltage protection Current limit Gate protection V Logic OUT Limit for unclamped ind. loads Charge pump Level shifter Temperature sensor Rectifier IN ESD Load Logic miniPROFET GND Load GND Signal GND Pin Symbol Function 1 GND Logic ground 2 IN 3 OUT Output to the load 4 NC not connected 5 Vbb Positive power supply voltage 6 Vbb Positive power supply voltage 7 Vbb Positive power supply voltage 8 Vbb Positive power supply voltage Input, activates the power switch in case of logic high signal Page 2 2000-02-21 BSP 762 T Maximum Ratings at Tj = 25C, unless otherwise specified Parameter Symbol Value Supply voltage Vbb 40 Supply voltage for full short circuit protection Vbb(SC) Vbb Unit V T j = -40...+150C Continuous input voltage VIN -10 ... +16 Load current (Short - circuit current, see page 5) IL self limited Current through input pin (DC) I IN 5 Operating temperature Tj -40 ...+150 Storage temperature T stg -55 ... +150 Power dissipation 1) Ptot 1.5 W Inductive load switch-off energy dissipation 1)2) EAS 870 mJ A mA C single pulse, (see page 8) Tj =150 C, Vbb = 13.5 V, IL = 1 A Load dump protection 2) VLoadDump3)= V A + V S RI=2W, t d=400ms, VIN= low or high, VA=13,5V V V/RDGGXPS RL = 13.5 W 60 Electrostatic discharge voltage (Human Body Model) VESD according to ANSI EOS/ESD - S5.1 - 1993 kV ESD STM5.1 - 1998 1 5 Input pin all other pins Thermal Characteristics Thermal resistance @ min. footprint Rth(JA) - 95 - Thermal resistance @ 6 cm 2 cooling area 1) Rth(JA) - 70 83 K/W 1 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70m thick) copper area for drain connection. PCB is vertical without blown air. (see page 16) 2not tested, specified by design 3V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 . Supply voltages higher than Vbb(AZ) require an external current limit for the GND pin, e.g. with a 150W resistor in GND connection. A resistor for the protection of the input is integrated. Page 3 2000-02-21 BSP 762 T Electrical Characteristics Parameter and Conditions Symbol DW7M &9EE 9XQOHVVRWKHUZLVHVSHFLILHG Values min. typ. Unit max. Load Switching Capabilities and Characteristics On-state resistance mW RON Tj = 25 C, IL = 2 A, Vbb = 9...40 V - 70 100 Tj = 150 C - 140 200 IL(nom) 2 2.4 - A to 90% VOUT ton - 90 170 s to 10% VOUT toff - 90 230 10 to 30% VOUT , dV/dton - 0.8 1.7 70 to 40% VOUT , -dV/dtoff - 0.8 1.7 Operating voltage Vbb(on) 5 - 34 Undervoltage shutdown of charge pump Vbb(under) Tj = -40...+85 C - - 4 Tj = 150 C - - 5.5 - 4 5.5 Nominal load current; Device on PCB 1) TC = 85 C, Tj 150 C Turn-on time RL = 47 W Turn-off time RL = 47 W Slew rate on V/s RL = 47 W Slew rate off RL = 47 W Operating Parameters Undervoltage restart of charge pump Vbb(u cp) Standby current Ibb(off) A Tj = -40...+85 C, VIN = 0 V - - 10 Tj = 150C2) , VIN = 0 V - - 15 IL(off) - - 5 IGND - 0.5 1.3 Leakage output current (included in Ibb(off)) V VIN = 0 V Operating current mA VIN = 5 V 1 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70m thick) copper area for drain connection. PCB is vertical without blown air. (see page 16) 2higher current due temperature sensor Page 4 2000-02-21 BSP 762 T Electrical Characteristics Parameter and Conditions Symbol DW7M &9 EE 9XQOHVVRWKHUZLVHVSHFLILHG Values min. typ. Unit max. Protection Functions Initial peak short circuit current limit (pin 5 to 3) A IL(SCp) T j = -40 C, Vbb = 20 V, tm = 150 s - - 18 T j = 25 C - 10 - T j = 150 C 4 - - - 7 - VON(CL) 41 47 - Vbb(AZ) 41 - - Thermal overload trip temperature Tjt 150 - - C Thermal hysteresis DTjt - 10 - K Reverse battery2) -Vbb - - 32 V Drain-source diode voltage (VOUT > V bb) -VON - 600 - Repetitive short circuit current limit IL(SCr) T j = Tjt (see timing diagrams) Output clamp (inductive load switch off) V at V OUT = V bb - V ON(CL), I bb = 4 mA Overvoltage protection 1) I bb = 4 mA Reverse Battery mV T j = 150 C 1 see also VON(CL) in circuit diagram on page 7 2Requires a 150 W resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation! Input current has to be limited (see max. ratings page 3). Page 5 2000-02-21 BSP 762 T Electrical Characteristics Parameter and Conditions Symbol DW7M &9 EE 9XQOHVVRWKHUZLVHVSHFLILHG Values Unit min. typ. max. VIN(T+) - - 2.2 VIN(T-) 0.8 - - Input threshold hysteresis DVIN(T) - 0.3 - Off state input current (see page 12) IIN(off) 1 - 25 IIN(on) 3 - 25 1.5 3.5 5 Input Input turn-on threshold voltage V (see page 12) Input turn-off threshold voltage (see page 12) A VIN = 0.7 V On state input current (see page 12) VIN = 5 V Input resistance (see page 7) RI Page 6 kW 2000-02-21 BSP 762 T Terms Inductive and overvoltage output clamp Ibb + V bb V Z Vbb V I IN IL IN PROFET ON VON OUT OUT V GND GND IN V bb R IGND VOUT GND VON clamped to 47V typ. Overvoltage protection of logic part Input circuit (ESD protection) R IN + V bb I V ESD- ZD I I IN I Z2 RI L o gic GND V 7KHXVHRI(6']HQHUGLRGHVDVYROWDJHFODPS DW'&FRQGLWLRQVLVQRWUHFRPPHQGHG Z1 GND R GN D S ignal GND VZ1 =6.1V typ., VZ2=Vbb(AZ)=47V typ., RI=3.5 kW typ., RGND=150W Reverse battery protection - V bb Logic IN RI OUT Power Inverse Diode GND RL R GND Signal GND Power GND RGND=150W, RI=3.5kW typ., Temperature protection is not active during inverse current Page 7 2000-02-21 BSP 762 T Vbb disconnect with charged inductive load GND disconnect Vbb Vbb IN high OUT PROFET IN GND V bb V PROFET OUT GND V GND IN V bb GND disconnect with GND pull up Inductive Load switch-off energy dissipation Vbb IN PROFET OUT E bb E AS GND E Load Vbb V bb V IN V GND IN PROFET OUT L = GND ZL ^ R EL ER L Energy stored in load inductance: EL = 1/2 * L * IL2 While demagnetizing load inductance, the energy dissipated in PROFET is E AS = Ebb + EL - ER = o VON(CL) * iL(t) dt, with an approximate solution for RL > 0W: E AS = Page 8 IL * R L IL * L ) * ( V b b + | V O U T ( C L )| ) * ln (1 + | V O U T ( C L )| 2 * RL 2000-02-21 BSP 762 T Typ. transient thermal impedance Typ. transient thermal impedance Z thJA=f(tp) @ 6cm 2 heatsink area ZthJA=f(tp) @ min. footprint Parameter: D=tp/T Parameter: D=tp/T 10 2 10 2 D=0.5 K/W D=0.5 K/W D=0.2 D=0.2 10 1 D=0.1 10 1 D=0.05 ZthJA ZthJA D=0.05 D=0.02 10 0 D=0.1 D=0.02 10 0 D=0.01 D=0.01 10 -1 D=0 10 -1 D=0 10 -2 -7 -6 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10 10 10 s 10 10 -2 -7 -6 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10 10 10 4 tp s 10 tp Typ. on-state resistance Typ. on-state resistance RON = f(Tj) ; Vbb = 13,5V ; V in = high RON = f(Vbb ); IL = 0.5A ; Vin = high 160 200 mW mW 150C 150 RON RON 120 100 125 80 100 60 75 40 50 20 25 0 -40 -20 0 20 40 60 80 100 120 0 0 C 160 Tj Page 9 25C -40C 5 10 15 20 25 30 V Vbb 40 2000-02-21 4 BSP 762 T Typ. turn off time Typ. turn on time toff = f(Tj); RL = 47W ton = f(Tj ); R L = 47W 160 160 32V s s 9V 9V 120 13.5V t off ton 120 100 100 32V 80 80 60 60 40 40 20 20 0 -40 -20 0 20 40 60 80 100 120 0 -40 -20 C 160 0 20 40 60 80 100 120 Tj Tj Typ. slew rate on Typ. slew rate off dV/dton = f(Tj ) ; RL = 47 W dV/dtoff = f(Tj); RL = 47 W 2.0 2.0 V/s V/s 1.6 -dV dtoff 1.6 dV dton C 160 1.4 1.4 1.2 1.2 1.0 1.0 0.8 0.8 32V 0.6 32V 0.6 13.5V 0.4 0.4 13.5V 9V 9V 0.2 0.0 -40 -20 0.2 0 20 40 60 80 100 120 0.0 -40 -20 C 160 Tj 0 20 40 60 80 100 120 C 160 Tj Page 10 2000-02-21 BSP 762 T Typ. standby current Typ. leakage current Ibb(off) = f(Tj ) ; Vbb = 32V ; VIN = low IL(off) = f(Tj) ; Vbb = 32V ; VIN = low 2.0 7 A A 5 IL(off) Ibb(off) 1.6 4 1.4 1.2 1.0 3 0.8 0.6 2 0.4 1 0.2 0 -40 -20 0 20 40 60 80 100 120 0.0 -40 -20 C 160 0 20 40 60 80 100 120 C 160 Tj Tj Typ. initial peak short circuit current limit Typ. initial short circuit shutdown time IL(SCp) = f(Tj) ; Vbb = 20V toff(SC) = f(Tj,start ) ; Vbb = 20V 3.5 14 ms 10 toff(SC) IL(SCp) A 2.5 8 2.0 6 1.5 4 1.0 2 0.5 0 -40 -20 0 20 40 60 80 100 120 0.0 -40 -20 C 160 0 20 40 60 80 100 120 C 160 Tj Tj Page 11 2000-02-21 BSP 762 T Typ. input current Typ. input current IIN(on/off) = f(Tj); V bb = 13,5V; VIN = low/high IIN = f(VIN); Vbb = 13.5V VINlow 0,7V; VINhigh = 5V 200 14 A A 150C 160 10 I IN on I IN 140 8 120 -40...25C 100 6 off 80 60 4 40 2 20 0 -40 -20 0 20 40 60 80 100 120 0 0 C 160 2 4 8 V Tj VIN Typ. input threshold voltage Typ. input threshold voltage VIN(th) = f(Tj ) ; Vbb = 13,5V VIN(th) = f(Vbb) ; Tj = 25C 2.0 2.0 V V 1.4 off 1.2 1.6 VIN(th) VIN(th) on on 1.6 1.4 1.2 off 1.0 1.0 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0.0 -40 -20 0 20 40 60 80 100 120 0.0 5 C 160 Tj 10 15 20 25 35 V Vbb Page 12 2000-02-21 BSP 762 T Maximum allowable load inductance Maximum allowable inductive switch-off for a single switch off energy, single pulse L = f(I L); T jstart=150C, V bb=13.5V, R L=0W EAS = f(IL ); Tjstart = 150C, Vbb = 13,5V 2500 3000 mH mJ L EAS 2000 1500 1500 1000 1000 500 500 0 0.0 0.5 1.0 1.5 0 0.0 2.5 A 0.5 1.0 1.5 2.5 A IL IL Page 13 2000-02-21 BSP 762 T Timing diagrams Figure 2b: Switching a lamp, Figure 1a: Vbb turn on: IN IN OUT V bb I V L OUT t t Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition Figure 2c: Switching an inductive load IN IN V V OUT OUT 90% t on d V /d to n d V /d to f f t o ff 10% I IL L t t Page 14 2000-02-21 BSP 762 T Figure 5: Undervoltage restart of charge pump Figure 3a: Turn on into short circuit, shut down by overtemperature, restart by cooling Von IN t I L Vbb( ucp) I L(SCp) I Vbb( under ) L(SCr) Vbb tm t off(SC) t +HDWLQJXSRIWKHFKLSPD\UHTXLUHVHYHUDOPLOOLVHFRQGVGHSHQGLQJ RQH[WHUQDOFRQGLWLRQV Figure 4: Overtemperature: Reset if Tj < T jt IN V OUT T J t Page 15 2000-02-21 BSP 762 T Package and ordering code all dimensions in mm Ordering code: Q67060-S7301-A2 Printed circuit board (FR4, 1.5mm thick, one layer 70m, 6cm 2 active heatsink area ) as a reference for max. power dissipation Ptot nominal load current IL(nom) and thermal resistance R thja Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. 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Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 16 2000-02-21