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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM317L-N

SNVS775L –MARCH 2000–REVISED JANUARY 2018

LM317L-N Wide V

100-mA Adjustable Voltage Regulator

1 Features

1• Adjustable Output Down to 1.2 V

• 100-mA Output Current

• Capable of Handling up to 40V VIN

• Line Regulation Typically 0.01% /V

• Load Regulation Typically 0.1% /A

• No Output Capacitor Required (†)

• Current Limit Constant With Temperature

• Eliminates the Need to Stock Many Voltages

• Standard 3-Lead Transistor Package

• 80-dB Ripple Rejection

• Available in 3-Pin TO-92, 8-Pin SOIC, or 6-pin

DSBGA Packages

• Output is Short-Circuit Protected

• See AN-1112 (SNVA009) for DSBGA

Considerations

2 Applications

• Automotive LED Lighting

• Battery Chargers

• Post Regulation for Switching Supplies

• Constant-Current Regulators

• Microprocessor Supplies

Schematic Diagram

Full output current not available at high

input-output voltages

†Optional—improves transient response

*Needed if device is more than 6 inches

from filter capacitors

3 Description

The LM317L-N is an adjustable positive voltage

regulator capable of supplying 100 mA over a 1.2-V

to 37-V output range. The LM317L-N is easy to use

and requires only two external resistors to set the

output voltage. Both line and load regulation are

better than standard fixed regulators. The LM317L-N

is available packaged in a standard, easy-to-use

TO-92 transistor package.

The LM317L-N offers full overload protection.

Included on the chip are current limit, thermal

overload protection, and safe area protection.

Normally, no capacitors are required unless the

device is situated more than 6 inches from the input

filter capacitors, in which case an input bypass is

required.

The LM317L-N uses floating topology and sees only

the input-to-output differential voltage, therefore

supplies of several hundred volts can be regulated,

provided the maximum input-to-output differential is

not exceeded. The device makes a simple adjustable

switching regulator, a programmable output regulator,

or by connecting a fixed resistor between the

adjustment and output, the LM317L-N can be used

as a precision current regulator.

The LM317L-N is available in a standard 3-pin TO-92

transistor package, the 8-pin SOIC package, and 6-

pin DSBGA package. The LM317L-N is rated for

operation over a −40°C to 125°C range.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM317L-N TO-92 (3) 4.30 mm × 4.30 mm

SOIC (8) 3.91 mm × 4.90 mm

DSBGA (6) 1.68 mm × 1.019 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Rating ....................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics .......................................... 5

6.6 Typical Characteristics.............................................. 6

7 Detailed Description.............................................. 8

7.1 Overview................................................................... 8

7.2 Functional Block Diagram......................................... 9

7.3 Feature Description................................................. 10

7.4 Device Functional Modes........................................ 10

8 Application and Implementation ........................ 12

8.1 Application Information............................................ 12

8.2 Typical Applications ............................................... 12

9 Power Supply Recommendations...................... 25

10 Layout................................................................... 25

10.1 Layout Guidelines ................................................. 25

10.2 Layout Examples................................................... 25

10.3 Thermal Considerations........................................ 26

11 Device and Documentation Support................. 27

11.1 Documentation Support ........................................ 27

11.2 Community Resources.......................................... 27

11.3 Trademarks........................................................... 27

11.4 Electrostatic Discharge Caution............................ 27

11.5 Glossary................................................................ 27

12 Mechanical, Packaging, and Orderable

Information........................................................... 27

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision K (September 2015) to Revision L Page

• Changed TO-92 package view from top to bottom view........................................................................................................ 3

• Changed DSBGA package view from bump side down to top view ...................................................................................... 3

• Removed duplicate Protection Diodes section and Regulator With Protection Diodes image from the Device

Functional Modes section..................................................................................................................................................... 10

Changes from Revision J (March 2013) to Revision K Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1

Changes from Revision I (March 2013) to Revision J Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 25

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5 Pin Configuration and Functions

LP Plastic Package

3-Pin TO-92

Bottom View

YPB Package

6-Pin DSBGA

Top View

D Package

8-Pin SOIC

Top View

YPB Package

6-Pin DSBGA

Laser Mark

Pin Functions

PIN I/O DESCRIPTION

NAME TO-92 SOIC DSBGA

VIN 3 1 C1 I Supply input pin

VOUT 2 2, 3, 6, 7 A1 O Voltage output pin

ADJ 1 4 B2 I Output voltage adjustment pin. Connect to a resistor divider to set VO.

NC — 5, 8 B1, A2, C2 — No connection

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Rating (1)(2)

MIN MAX UNIT

Power dissipation Internally Limited

Input-output voltage differential 40 V

Operating junction temperature −40 125 °C

Lead temperature (soldering, 4 seconds) 260 °C

Storage temperature, Tstg −55 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000

V may actually have higher performance.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

Operating temperature −40 125 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LM317L-N

UNIT

TO-92 SOIC DSBGA

3 PINS 8 PINS 6 PINS

0.4-in

Leads 0.125-in

Leads

RθJA Junction-to-ambient thermal resistance 180 160 165 290 °C/W

RθJC(top) Junction-to-case (top) thermal resistance — 80.6 — — °C/W

RθJB Junction-to-board thermal resistance — — — — °C/W

ψJT Junction-to-top characterization parameter — 24.7 — — °C/W

ψJB Junction-to-board characterization parameter — 135.8 — — °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — °C/W

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(1) Unless otherwise noted, these specifications apply: −25°C ≤Tj≤125°C for the LM317L-N; VIN −VOUT = 5 V and IOUT = 40 mA. Although

power dissipation is internally limited, these specifications are applicable for power dissipations up to 625 mW. IMAX is 100 mA.

(2) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specification for thermal regulation.

(3) Thermal resistance of the TO-92 package is 180°C/W junction to ambient with 0.4-inch leads from a PCB and 160°C/W junction to

ambient with 0.125-inch lead length to PCB.

6.5 Electrical Characteristics (1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Line regulation TJ= 25°C, 3 V ≤(VIN −VOUT)≤40 V, IL≤20 mA(2) 0.01 0.04 %/V

Load regulation TJ= 25°C, 5 mA ≤IOUT ≤IMAX (2) 0.1% 0.5%

Thermal regulation TJ= 25°C, 10-ms Pulse 0.04 0.2 %/W

Adjustment pin current 50 100 μA

Adjustment pin current change 5 mA ≤IL≤100 mA

3 V ≤(VIN −VOUT)≤40 V, P ≤625 mW 0.2 5 μA

Reference voltage 3 V ≤(VIN −VOUT)≤40 V(3)

5 mA ≤IOUT ≤100 mA, P ≤625 mW 1.2 1.25 1.3 V

Line regulation 3 V ≤(VIN −VOUT)≤40 V, IL≤20 mA(2) 0.02 0.07 %/V

Load regulation 5 mA ≤IOUT ≤100 mA(2) 0.3% 1.5%

Temperature stability TMIN ≤TJ≤TMAX 0.65%

Minimum load current (VIN −VOUT)≤40 V 3.5 5 mA

3 V ≤(VIN −VOUT)≤15 V 1.5 2.5

Current limit 3 V ≤(VIN −VOUT)≤13 V 100 200 300 mA

(VIN −VOUT) = 40 V 25 50 150

RMS output noise, % of VOUT TJ= 25°C, 10 Hz ≤f≤10 kHz 0.003%

Ripple rejection ratio VOUT = 10 V, f = 120 Hz, CADJ = 0 65 dB

CADJ = 10 μF 66 80

Long-term stability TJ= 125°C, 1000 Hours 0.3% 1%

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6.6 Typical Characteristics

(Output capacitor = 0 μF unless otherwise noted.)

Figure 1. Load Regulation Figure 2. Current Limit

Figure 3. Adjustment Current Figure 4. Dropout Voltage

Figure 5. Reference Voltage Temperature Stability Figure 6. Minimum Operating Current

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Typical Characteristics (continued)

(Output capacitor = 0 μF unless otherwise noted.)

Figure 7. Ripple Rejection Figure 8. Ripple Rejection

Figure 9. Output Impedance Figure 10. Line Transient Response

Figure 11. Load Transient Response Figure 12. Thermal Regulation

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7 Detailed Description

7.1 Overview

In operation, the LM317L-N develops a nominal 1.25-V reference voltage, VREF, between the output and

adjustment terminal. The reference voltage is impressed across program resistor R1 and, because the voltage is

constant, a constant current I1then flows through the output set resistor R2, giving an output voltage of:

(1)

Because the 100-μA current from the adjustment terminal represents an error term, the LM317L-N was designed

to minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating current

is returned to the output establishing a minimum load current requirement. If there is insufficient load on the

output, the output will rise.

Figure 13. Typical Application Circuit for Adjustable Regulator

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7.2 Functional Block Diagram

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7.3 Feature Description

7.3.1 Load Regulation

The LM317L-N is capable of providing extremely good load regulation but a few precautions are needed to

obtain maximum performance. The current set resistor connected between the adjustment terminal and the

output terminal (usually 240 Ω) must be tied directly to the output of the regulator rather than near the load. This

eliminates line drops from appearing effectively in series with the reference and degrading regulation. For

example, a 15-V regulator with 0.05-Ωresistance between the regulator and load will have a load regulation due

to line resistance of 0.05 Ω× IL. If the set resistor is connected near the load the effective line resistance will be

0.05 Ω(1 + R2/R1) or in this case, 11.5 times worse.

Figure 14 shows the effect of resistance between the regulator and 240-Ωset resistor.

With the TO-92 package, it is easy to minimize the resistance from the case to the set resistor, by using two

separate leads to the output pin. The ground of R2 can be returned near the ground of the load to provide

remote ground-sensing and improve load regulation.

Figure 14. Regulator With Line Resistance in Output Lead

7.4 Device Functional Modes

7.4.1 External Capacitors

An input bypass capacitor is recommended in case the regulator is more than 6 inches away from the usual large

filter capacitor. A 0.1-μF disc or 1-μF solid tantalum on the input is suitable input bypassing for almost all

applications. The device is more sensitive to the absence of input bypassing when adjustment or output

capacitors are used, but the above values will eliminate the possibility of problems.

The adjustment terminal can be bypassed to ground on the LM317L-N to improve ripple rejection and noise. This

bypass capacitor prevents ripple and noise from being amplified as the output voltage is increased. With a 10-μF

bypass capacitor 80-dB ripple rejection is obtainable at any output level. Increases over 10-μF do not appreciably

improve the ripple rejection at frequencies above 120 Hz. If the bypass capacitor is used, it is sometimes

necessary to include protection diodes to prevent the capacitor from discharging through internal low current

paths and damaging the device.

In general, the best type of capacitors to use is solid tantalum. Solid tantalum capacitors have low impedance

even at high frequencies. Depending upon capacitor construction, it takes about 25 μF in aluminum electrolytic to

equal 1-μF solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some

types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, a 0.01-μF disc may

seem to work better than a 0.1-μF disc as a bypass.

Although the LM317L-N is stable with no output capacitors, like any feedback circuit, certain values of external

capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1-μF solid

tantalum (or 25-μF aluminum electrolytic) on the output swamps this effect and insures stability.

7.4.2 Protection Diodes

When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to

prevent the capacitors from discharging through low current points into the regulator. Most 10-μF capacitors have

low enough internal series resistance to deliver 20-A spikes when shorted. Although the surge is short, there is

enough energy to damage parts of the IC.

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Device Functional Modes (continued)

When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge

into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage

of the regulator, and the rate of decrease of VIN. In the LM317L-N, this discharge path is through a large junction

that is able to sustain a 2-A surge with no problem. This is not true of other types of positive regulators. For

output capacitors of 25 μF or less, the ballast resistors and output structure of the LM317L-N limit the peak

current to a low enough level so that there is no need to use a protection diode.

The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs

when either the input or output is shorted. Internal to the LM317L-N is a 50-Ωresistor which limits the peak

discharge current. No protection is needed for output voltages of 25 V or less and 10-μF capacitance. Figure 15

shows an LM317L-N with protection diodes included for use with outputs greater than 25 V and high values of

output capacitance.

D1 protects against C1

D2 protects against C2

Figure 15. Regulator With Protection Diodes

7.4.3 DSBGA Light Sensitivity

Exposing the LM317L-N DSBGA package to bright sunlight may cause the VREF to drop. In a normal office

environment of fluorescent lighting the output is not affected. The LM317 DSBGA does not sustain permanent

damage from light exposure. Removing the light source causes VREF of the LM317L-N to recover to the proper

value.

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM317L-N is a versatile, high-performance, linear regulator with 1% output-voltage accuracy. An output

capacitor can be added to further improve transient response, and the ADJ pin can be bypassed to achieve very

high ripple-rejection ratios. Its functionality can be used in many different applications that require high

performance regulation, such as battery chargers, constant-current regulators, and microprocessor supplies.

8.2 Typical Applications

8.2.1 1.25-V to 25-V Adjustable Regulator

Full output current not available at high input-output voltages

†Optional—improves transient response

*Needed if device is more than 6 inches from filter capacitors

Figure 16. 1.25-V to 25-V Adjustable Regulator

8.2.1.1 Design Requirements

The device component count is very minimal, employing two resistors as part of a voltage-divider circuit and an

output capacitor for load regulation. An input capacitor is needed if the device is more than 6 inches from filter

capacitors. An optional bypass capacitor across R2 can also be used to improve PSRR.

8.2.1.2 Detailed Design Procedure

The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 16. For

details on capacitor selection, see External Capacitors.

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Typical Applications (continued)

8.2.1.3 Application Curve

As shown in Figure 17, VOUT rises with VIN minus some dropout voltage. This dropout voltage during start-up will

vary with ROUT.

VOUT = 5 V

Figure 17. VOUT vs VIN

8.2.2 Digitally-Selected Outputs

Figure 18 demonstrates a digitally-selectable output voltage. In its default state, all transistors are off and the

output voltage is set based on R1 and R2. By driving certain transistors, the associated resistor is connected in

parallel to R2, modifying the output voltage of the regulator.

*Sets maximum VOUT

Figure 18. Digitally-Selected Outputs

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Typical Applications (continued)

8.2.3 High Gain Amplifier

This application uses the LM395 Power Transistor to amplify the input voltage. The LM317L connected to R2

produces a constant current of 1.2V/R2 through the BJT. By altering the base current entering the LM395, the

effective resistance can be changed resulting in an appropriate voltage fluctuation at the output.

Figure 19. High Gain Amplifier

8.2.4 Adjustable Current Limiter

This application will limit the output current to the IOUT in the diagram. The current limit is determined by adjusting

the resistance between the VOUT and VADJ pins. The 1.2-V reference voltage across R1 generates the maximum

current.

12 ≤R1 ≤240

Figure 20. Adjustable Current Limiter

8.2.5 Precision Current Limiter

This application will limit the output current to the IOUT in the diagram. An initial reference current is generated

based on the resistance between the VOUT and VADJ pins. In the case of Figure 21, 1.25 V across 1 kΩplus half

of the 500-Ωresistor results in 1 mA of current, producing 1.5 V total across the two resistors in series. This

voltage also appears across R1, making the maximum current the sum of the branch currents.

Figure 21. Precision Current Limiter

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Typical Applications (continued)

8.2.6 Slow Turnon 15-V Regulator

An application of LM317L-N includes a PNP transistor with a capacitor to implement slow turnon functionality

(see Figure 22). As VIN rises, the PNP sinks current from the ADJ rail. The output voltage at start-up is the

addition of the 1.25-V reference plus the drop across the base to emitter. While this is happening, the capacitor

begins to charge and eventually opens the PNP. At this point, the device functions normally, regulating the

output at 15 V. A diode is placed between C1 and VOUT to provide a path for the capacitor to discharge. Such

controlled turnon is useful for limiting the in-rush current.

Figure 22. Slow Turnon 15-V Regulator

8.2.7 Adjustable Regulator With Improved Ripple Rejection

To improve ripple rejection, a capacitor is used to bypass the ADJ pin to GND (see Figure 23). This is used to

smooth output ripple by cleaning the feedback path and stopping unnecessary noise from being fed back into the

device, propagating the noise.

†Solid tantalum

*Discharges C1 if output is shorted to ground

Figure 23. Adjustable Regulator With Improved Ripple Rejection

8.2.8 High Stability 10-V Regulator

This application will regulate to an output voltage of 10 V and will remain stable even with input voltage

transients. The LM329 is a precision Zener reference diode that helps maintain stability.

Figure 24. High Stability 10-V Regulator

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Typical Applications (continued)

8.2.9 Adjustable Regulator With Current Limiter

This application regulates to an output voltage set by the ratio of R2 and R1 and limits the output current using

R3 as shown in Figure 25.

Short circuit current is approximately 600 mV/R3, or 60 mA (compared to LM317L-NZ's 200-mA current limit).

At 25-mA output only 3/4 V of drop occurs in R3 and R4.

Figure 25. Adjustable Regulator With Current Limiter

8.2.10 0-V to 30-V Regulator

This application regulates the output voltage from 0 V to 30 V using the resistor divider at the output. The

adjustment pin reference voltage is 1.25 V so select the resistor divider that provides the needed output voltage.

Full output current not available at high input-output voltages

Figure 26. 0-V to 30-V Regulator

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Typical Applications (continued)

8.2.11 Regulator With 15-mA Short-Circuit Current

This application regulates to a 10-V output with a 15-mA short-circuit current. The output voltage is set by the

resistor divider at the output and the PNP is required to set the short-circuit current.

Figure 27. Regulator With 15-mA Short-Circuit Current

8.2.12 Power Follower

This application provides an output voltage that follows the input voltage while providing a current gain. The

LM395 is a power transistor that operates as an emitter follower and provides a short-circuit current limit while

the LM317 acts as a constant-current load.

Figure 28. Power Follower

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Typical Applications (continued)

8.2.13 Adjusting Multiple On-Card Regulators With Single Control

Figure 29 shows how multiple LM317L-N regulators can be controlled by setting one resistor. Because each

device maintains the reference voltage of about 1.25 V between its VOUT and ADJ pins, we can connect each

ADJ rail to a single resistor, setting the same output voltage across all devices. This allows for independent

outputs, each responding to its corresponding input only. Designers must also consider that by the nature of the

circuit, changes to R1 and R2 will affect all regulators.

*All outputs within ± 100 mV

†Minimum load −5 mA

Figure 29. Adjusting Multiple On-Card Regulators With Single Control*

8.2.14 100-mA Current Regulator

This application regulates the output current to maximum of 100 mA as shown in Figure 30.

Figure 30. 100-mA Current Regulator

8.2.15 1.2-V to 12-V Regulator With Minimum Program Current

This application regulates the output voltage between 1.2 V and 12 V depending on the resistor divider at the

output while allowing minimum programmable load current down to 2 mA as shown in Figure 31.

*Minimum load current ≈2 mA

Figure 31. 1.2-V to 12-V Regulator With Minimum Program Current

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Typical Applications (continued)

8.2.16 50-mA Constant Current Battery Charger for Nickel-Cadmium Batteries

This application provides a 50-mA constant current at the output which can be used as a constant current battery

charger for Nickel-Cadmium batteries. The resistor at the output sets the output current value.

Figure 32. 50-mA Constant Current Battery Charger for Nickel-Cadmium Batteries

8.2.17 5-V Logic Regulator With Electronic Shutdown

Figure 33 shows a variation of the 5-V output regulator application uses the LM317L-N, along with an NPN

transistor, to provide shutdown control. The NPN will either block or sink the current from the ADJ pin by

responding to the TTL pin logic. When TTL is pulled high, the NPN is on and pulls the ADJ pin to GND, and the

LM317L-N outputs about 1.25 V. When TTL is pulled low, the NPN is off and the regulator outputs according to

the programmed adjustable voltage.

*Minimum output ≈1.2 V

Figure 33. 5-V Logic Regulator With Electronic Shutdown*

8.2.18 Current-Limited 6-V Charger

The current in a battery charger application is limited by switching between constant-current and constant-voltage

states (see Figure 34). When the battery pulls low current, the drop across the 1-Ωresistor is not substantial and

the NPN remains off. A constant voltage is seen across the battery, as regulated by the resistor divider. When

current through the battery rises past peak current, the 1 Ωprovides enough voltage to turn the transistor on,

pulling ADJ close to ground. This results in limiting the maximum current to the battery.

*Sets peak current, IPEAK = 0.6 V/R1

**1000 μF is recommended to filter out any input transients.

Figure 34. Current Limited 6-V Charger

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Typical Applications (continued)

8.2.19 Short Circuit-Protected 80-V Supply

This application provides a 80-V output voltage from 0 mA to 20 mA as shown in Figure 35. The Triad provides

an AC to DC conversion and the short-circuit protection is provided by the fuse. The output voltage can be

adjusted by adjusting the resistor divider at the output.

Figure 35. Short Circuit-Protected 80-V Supply

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Typical Applications (continued)

8.2.20 Basic High-Voltage Regulator

This application regulates the output voltage from 1.2 V to 160 V at 25 mA as shown in Figure 36. The output

voltage is set by the resistor divider at the output. The Darlington pair transistor configuration provides a current

gain from the input source to the LM317.

Q1, Q2: NSD134 or similar

C1, C2: 1 μF, 200-V mylar**

*Heat sink

Figure 36. Basic High-Voltage Regulator

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Typical Applications (continued)

8.2.21 Precision High-Voltage Regulator

This application regulates the output voltage from 8 V to 160 V at 25 mA as shown in Figure 37. The Zener diode

connected from the adjust pin to VOUT provides better precision than the basic high-voltage regulator.

Q1, Q2: NSD134 or similar

C1, C2: 1 μF, 200-V mylar**

*Heat sink

**Mylar is a registered trademark of DuPont Co.

Figure 37. Precision High-Voltage Regulator

8.2.22 Tracking Regulator

This application regulates to an output voltage set by the output resistor divider and also uses the LM301A

operational amplifier to provide a negative voltage that tracks the output voltage.

A1 = LM301A, LM307, or LF13741 only

R1, R2 = matched resistors with good TC tracking

Figure 38. Tracking Regulator

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Typical Applications (continued)

8.2.23 Regulator With Trimmable Output Voltage

This application provides an output voltage set by the output resistor divider that can be finely tuned to ±1% by

removing output resistors. See the trim procedure in Figure 39.

Trim Procedure:

— If VOUT is 23.08 V or higher, cut out R3 (if lower, don't cut it out).

— Then if VOUT is 22.47 V or higher, cut out R4 (if lower, don't).

— Then if VOUT is 22.16 V or higher, cut out R5 (if lower, don't).

This will trim the output to well within ±1% of 22.00 VDC, without any of the expense or uncertainty of a trim pot (see

LB-46). This technique can be used at any output voltage level.

Figure 39. Regulator With Trimmable Output Voltage

8.2.24 Precision Reference With Short-Circuit Proof Output

This application provides a precise output voltage with short-circuit protection. The precision results from using

the LM308A operational amplifier connected between the adjust pin and output voltage pin as a comparator with

the LM299AH precision reference.

*R1–R4 from thin-film network,

Beckman 694-3-R2K-D or similar

Figure 40. Precision Reference With Short-Circuit Proof Output

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Typical Applications (continued)

8.2.25 Fully-Protected (Bulletproof) Lamp Driver

This application drives a lamp using a programmable gain instrumentation amplifier at the output.

Figure 41. Fully-Protected (Bulletproof) Lamp Driver

8.2.26 Lamp Flasher

This application uses a combination of capacitors and resistors connected between the output voltage pin and

the adjust pin to cause the lamp connected at the output voltage pin to flash.

Output rate—4 flashes per second at 10% duty cycle

Figure 42. Lamp Flasher

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9 Power Supply Recommendations

The input supply to the LM317L-N must be kept at a voltage level lower than the maximum input-to-output

differential voltage of 40 V. When possible, the minimum dropout voltage must also be met with extra headroom

to keep the LM317L-N in regulation. TI recommends using an input capacitor, especially when the input pin is

located more than 6 inches away from the power supply source. For more information regarding capacitor

selection, see External Capacitors.

10 Layout

10.1 Layout Guidelines

Some layout guidelines should be followed to ensure proper regulation of the output voltage with minimum noise.

Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the

feedback loop from VOUT to ADJ should be kept as short as possible. To improve PSRR, a bypass capacitor can

be placed at the ADJ pin and must be located as close as possible to the IC. In cases when VIN shorts to ground,

an external diode should be placed from VOUT to VIN to divert the surge current from the output capacitor and

protect the IC. Similarly, in cases when a large bypass capacitor is placed at the ADJ pin and VOUT shorts to

ground, an external diode should be placed from ADJ to VOUT to provide a path for the bypass capacitor to

discharge. These diodes must be placed close to the corresponding IC pins to increase their effectiveness.

10.2 Layout Examples

Figure 43. Layout Example (SOT-223)

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Layout Examples (continued)

Figure 44. Layout Example (TO-220)

10.3 Thermal Considerations

When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC

circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large.

Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change)

per watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or

temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation

depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the

percentage change of VOUT, per watt, within the first 10 ms after a step of power is applied. The LM317L-N

specification is 0.2%/W, maximum.

In Figure 12, a typical output of the LM317L-N changes only 7 mV (or 0.07% of VOUT =−10 V) when a 1-W pulse

is applied for 10 ms. This performance is thus well inside the specification limit of 0.2%/W × 1 W = 0.2%

maximum. When the 1-W pulse is ended, the thermal regulation again shows a 7-mV change as the gradients

across the LM317L-N chip die out.

NOTE

The load regulation error of about 14 mV (0.14%) is additional to the thermal regulation

error.

LM317L-N

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM317LITP/NOPB ACTIVE DSBGA YPB 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 P

LM317LITPX/NOPB ACTIVE DSBGA YPB 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 P

LM317LM/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 LM317

LM317LMX NRND SOIC D 8 2500 Non-RoHS

& Green Call TI Call TI -40 to 125 LM317

LM317LMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 LM317

LM317LZ/LFT1 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM317

LM317LZ/LFT2 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM317

LM317LZ/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM317

LM317LZ/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM317

LM317LZ/LFT7 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM317

LM317LZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 LM317

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 2

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM317LITP/NOPB DSBGA YPB 6 250 178.0 8.4 1.09 1.75 0.66 4.0 8.0 Q1

LM317LITPX/NOPB DSBGA YPB 6 3000 178.0 8.4 1.09 1.75 0.66 4.0 8.0 Q1

LM317LMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM317LMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM317LITP/NOPB DSBGA YPB 6 250 210.0 185.0 35.0

LM317LITPX/NOPB DSBGA YPB 6 3000 210.0 185.0 35.0

LM317LMX SOIC D 8 2500 367.0 367.0 35.0

LM317LMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

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