AL28M72K8BJH9S - ATP ELECTRONICS

DRAM Modules

and

Industrial Grade Flash Products

Product Guide

About ATP

Established in 1991, ATP has accumulated years of experience in the design, manufacturing, and support of high performance, highest quality DRAM

modules and NAND flash storage products. ATP focuses in mission critical applications such as industrial/automation, telecom, medical, and

enterprise computing where high levels of technical support/expertise, consistency of performance, and manufacturing quality are required. A

certified Eco/Green partner of tier one OEMs, all ATP products are fully RoHS and China RoHS compliant.

A true manufacturer of both flash and DRAM products, ATP offers in-house design, testing, and product tuning at both the system and component

levels. In addition, ATP supply chain support includes controlled/fixed BOMs and long term product life cycles.

ATP System-In-Package (SIP) flash product manufacturing process is the backbone to our superior build quality and durability. The industry leading

SIP process involves advanced wire bonding, stacking, and encapsulation stages which make ATP products more consistently durable and reliable

with waterproof, extreme temperature durability.

Highest Quality Design, Manufacturing and Testing

ATP has implemented a systematic approach to a controlled design, manufacturing and testing procedures to ensure highest quality and reliability

products. ATP is an ISO9001-2000 certified manufacturer. Its production facilities and processes have been audited and qualified by major tier-one

OEMs. Rigorous qualify management programs, raw material inspection, statistical process control, 100% testing, and a strict product qualification

steps ensures reliable defect-free products and a low PPM failure rate. Through continuous process improvements, ATP is constantly refining and

innovating our production procedures to build best-in-class products and solutions. With design and service centers worldwide, ATP offers global 24

hour round-the-clock support. Our special services include drop-shipping, kitting, special OEM or customized packaging.

Customer Services and Support

ATP offers extensive customer services and support to help you every step of the way from concept, through design implementation, to technical

support and supply chain management.

ATP offers you a dedicated, knowledgeable and well-trained team of professionals to make your job easier and simpler with services that include

technical support, online-support resources, data sheets, order and supply chain management system, and fulfillment services.

A technology driven company, ATP continues to expand its product portfolio with new unique products such as the GPS Photo Finder and

micro-surveillance devices, enabling newer applications for flash storage. ATP also continues to develop storage based technologies such as its

Smart ‘n Secure (SnS) technology, allowing for the secure distribution of content on flash memory devices.

The ATP brand continues to grow through both

consumer and industrial OEM sales channels. With

multiple offices in the United States, Asia, and Europe,

ATP offers worldwide support in both engineering and

sales. ATP adheres to the strict ISO9001 QA standards

for quality and compatibility. All ATP memory products

are RoHS, CE, and FCC approved.

ATP’s SIP (System-In-Package) manufacturing process

encapsulates all exposed components and points of

failure to extend protection against water/moisture,

vibration/shock, ESD (electro-static discharge), and

extreme temperatures.

System-In-Package Technology

Protective encapsulation molding

ATP [ SIP ]

Other Brand

Exposed components

and contacts

Healthcare

Enterprise Computing

High Performance Computing

The dynamic pace of the networking/telecommunications industry

demands a memory product supplier with the flexibility of application

specific in-house design as well as supply chain support for rapid

deployment. ATP develops highly durable, reliable DRAM and solid

state storage solutions with these demands in mind.

Applications

WAN Optimization Appliances

High Performance Storage Caching

Routers/Gateways

PBX/IPBX

VPN/Firewall Appliances

Servers

ATP partners in Enterprise Computing typically have the highest

demands in terms of raw performance, capacity, and reliability.

ATP's DRAM lineup includes modules that maximize the capability

and performance of new systemboards. All certified, all endurance

tested. Our FAE and Engineering teams have the expertise and

support experience to both recommend and test any system

configuration for maximum performance and reliability, with all

factors such as heat/air flow, electrical demands, and module timing

considered.

With the continued development of NAND flash technologies, the

performance gains of solid state storage over traditional hard drives is

vast. This is especially true in many enterprise computing

environments which are typically higher traffic with an extremely high

number of concurrent transactions. ATP industrial SSDs (Solid State

Drive) and embedded flash products offer these performance gains in

IOPS and also employ the newest wear leveling, data integrity

technologies. The result is tremendous performance with predictable

lifetime and reliability.

Applications

Cache/Storage Systems

Data Warehousing

Multimedia Hosting/Video on Demand

Banking Services

Financial/Secure Transactions

Metadata Logging

High Speed Storage Caching

The leading edge, raw computing power needed by high performance

parallel and cluster organized computers is computed in teraflops.

Along with this type of computing comes enormous needs for high

performance DRAM modules. ATP high performance DRAM modules

offer this performance, ideal for applications such as scientific

simulations and research.

Applications

Scientific Research

Computational Fluid Dynamics

Building and Testing of Virtual Prototypes

Online Transaction Processing (OLTP) Structural Analysis, Modeling

and Simulation

Line-of-business (LOB) applications

Healthcare storage demands are not only mission critical but often

require data integrity in environments with exposure to water and

fluids. ATP flash products, built with SIP (System-in-Package) are fully

waterproof and ideal for these conditions.

Medical monitoring/recording devices often also require high transfer

speeds for high resolution video capture. ATP DRAM products are built

with the highest performance DRAM IC components while ATP

Industrial Grade Flash products allow for industry leading read and

write transfer speeds. ATP CompactFlash allow for speeds up to

45MB/sec, while ATP SSDs get into 100+MB/sec.

Applications

X-ray/Radiology

Sonogram/Ultra Sound

Fetal Monitoring

Life support/Data Logging

ATP Strengths:

Performance tuned for high IOPS

Highest Read/Write transfer speeds available

Highest density DRAM modules

First to market: latest spec, newest performance level

Long term supported fixed/controlled BOM

Long term availability (including lower density products)

Comprehensive flash storage device lineup for all

interfaces/applications

Application specific design, product performance

tuning/customization

In-house environment reliability testing, customized environmental

testing available

System level endurance/reliability testing

SIP (System-In-Package) built flash products

Extreme temperature, vibration, shock, ESD, dust, and water proof

durability

Compact form factors/profiles

In-house FAE team support, "our lab is your lab"

The

namic

ce of the networki

/telecommunications in

Networking/ Telecommunications

Industrial/Embedded computing storage and memory

implementations require a level of technical support and product

tunabiliy that only a true designer/manufacturer can offer. ATP designs,

builds, and supports all of its own DRAM and flash products. With full

control of the BOM, testing, and QA procedures, ATP can customize,

build, and tune a storage/memory solution for the most demanding or

unique embedded application.

Applications

Industrial Automation

Factory Machinery

Industrial PCs

Portable Electronics

On-Board Data Storage

Data logging

ATP works closely with the world leaders in rugged handheld,

providing storage and memory products robust enough for all harsh

outdoor environmental conditions. Rugged handheld units require

more than just brute physical durability in all conditions. They also

need storage/memory electrically sound enough for less than ideal,

often unreliable power sources.

ATP flash products, built with SIP (System-in-Package) offers

considerable protection from these elements along with waterproof,

dust, and ESD proof durability. Each ATP industrial grade BOM

configuration goes through extensive temperature shock, humidity,

ESD, and physical stress testing before being considered for

production. Low power consumption, power interruption protection,

and a wide input voltage range are also features ideal for mobile

rugged applications.

Applications

Mobile ERP

RFID

Barcode Scanning

Mobile Payment

Two-Way Radios

Rugged Smartphones

Automotive and other transportations applications require long term

data retention and product lifetimes as well as high tolerances for

shock, vibration, temperature range, humidity, and moisture.

ATP industrial grade flash products are built with pre-screened,

endurance tested SLC type flash components and are built for

maximum product lifetimes and long term data integrity. These

components together with ATP's SIP (System-In-Package) technology

allows for long term performance in all environments and hard physical

conditions.

Applications

Auto/Marine GPS Navigation

ECU/Engine Management

Auto/Marine Entertainment

Automotive Security

Industrial Automation

Military/Aerospace implementations of memory and solid state storage

require products that can perform under the harshest and most

unforgiving environments. Extreme temperature, vibration, and shock

stresses are among a few of the tolerances needed to be taken into

account. ATP flash products, built with SIP (System-in-Package) offers

considerable protection from these elements along with waterproof,

dust, and ESD proof durability. Each ATP industrial grade BOM

configuration goes through extensive temperature shock, humidity,

ESD, and physical stress testing before being considered for production.

ATP, a true manufacturer, can offer long term supply chain support for

military applications where implementations and servicing components

are needed for years, even decades.

ATP content copy protection and write protection technologies also

allow for secure content distribution or recording.

Applications

GPS/Navigation

Secure Content Distribution

Rugged Computing

Rugged Personal Storage

Surveillance/Media Recording

In house environment reliability testing, customized environmental

testing available

Optional SnS content protection technology and write protection

technology

Lower profile and ultra compact form factors

In-house FAE team support, "our lab is your lab"

System Level endurance/reliability testing

ATP Strengths:

Industry’s best, 100% pre-screened and tested SLC flash components

SIP (System-In-Package) built flash products

Extreme temperature, vibration, shock, ESD, dust, and water proof

durability

Long term availability (including lower density products)

Application specific design, product performance

tuning/customization

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ATP works closel

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Rugged Handheld Computing

About ATP

The

VLP DDR3 ECC Modules

are well suited for space constrained next-generation computers and embedded systems

such as:

Featured DRAM Products

PC/104-Plus, PICMG SBCs: cPCI, PCI, PMC, VME

SBB storage canisters

Rugged Mobile Applications

Embedded Single Board Computers (SBC)

Green DDR2 FB-DIMM Modules

Up to 60% power saving compared to standard 1.8Vdd FB-DIMM

Built-in reliability with CRC (Cyclical Redundancy Checking)

protection and Bit Lane Failover Correction

High throughput and better system memory expandability

DDR3 VLP Modules for BLADES SERVERS

Higher data transfer rates, double the speed of DDR2 modules

Low power consumption

Optimizing memory-intensive systems' performances with less

power and faster access time

Ideal for use in blade servers, embedded computing, and other

space-constrained applications

Higher data transfer rates, double the speed of DDR2 modules

Low power consumption

Optimizing memory-intensive systems' performances with less

power and faster access time

DDR3 Modules for NEHALEM SERVERS

Design to satisfy the demanding memory application for the

embedded, telecom, military, and ruggedized computing

Higher Data transfer rates, double the speed of DDR2 modules

Low power consumption

DDR3 VLP ECC Modules for Industrial PC

DDR3 Memory Modules

High performance, data rate up to 1600MHz/1866MHz.

With 1.5Vdd the DDR3 memory modules are about 20% more efficient than the DDR2 counter parts which utilize 1.8Vdd.

The signal quality of DDR3 memory module excels with the implementation of high precision self calibration and Fly-by topology.

DDR3 Application

About ATP

DDR3 Memory Modules

DDR3 240-pin Registered DIMM

ATP Part Number Density Organization Component Speed Rank Height Availability

AL12M72E4BJH9S 4GB 512M×72 256M×4 1333 2 1.18” Mass Production

AL12M72H8BJF8S 4GB 512M×72 128M×8 1066 4 1.18” Mass Production

AL56M72L8BJH9S 2GB 256M×72 128M×8 1333 2 0.74” Mass Production

AL56M72B8BJH9S 2GB 256Mx72 128M×8 1333 2 1.18” Mass Production

AL56M72M4BJH9S 2GB 256Mx72 256M×4 1333 1 0.74” Mass Production

AL28M72A8BJH9S 1GB 128Mx72 128M×8 1333 1 1.18” Mass Production

AL28M72K8BJH9S 1GB 128M×72 128Mx8 1333 1 0.74” Mass Production

DDR3 240-pin Un-buffered ECC DIMM

ATP Part Number Density Organization Component Speed Rank Height Availability

AQ56M72E8BJH9S 2GB 256M×72 128Mx8 1333 2 1.18” Mass Production

AQ28M72D8BJH9S 1GB 128M×72 128M×8 1333 1 1.18” Mass Production

DDR3 204-pin Un-buffered Non-ECC SODIMM

ATP Part Number Density Organization Component Speed Rank Height Availability

AW56M64F8BJH9S 2GB 256Mx64 128Mx8 1333 2 1.18” Mass Production

AW28M64B8BJH9S 1GB 128Mx64 128Mx8 1333 1 1.18” Mass Production

DDR3 240-pin Un-buffered Non-ECC DIMM

ATP Part Number Density Organization Component Speed Rank Height Availability

AQ12M64B8BKH9S 4GB 512M×64 256M×8 1333 2 1.18” Mass Production

AQ56M64B8BJH9S 2GB 256Mx64 128Mx8 1333 2 1.18” Mass Production

AQ28M64A8BJH9S 1GB 128Mx64 128Mx8 1333 1 1.18” Mass Production

Supermicro Server Board

X8DTN+

X8DTU

X8DTL-3

X8DAL-3

X8DAH+

X8DTT

X8DTH-i

X8DT3

2GB DDR3-1333 REG ECC: AL56M72B8BJH9S

4GB DDR3-1333 REG ECC: AL12M72E4BJH9S

2GB DDR3-1333 UNB ECC: AQ56M72E8BJH9S

S7002

S7010

S7012

S7016

S7017

S7020

Tyan Server Board

2GB DDR3-1333 REG ECC: AL56M72B8BJH9S

4GB DDR3-1333 REG ECC: AL12M72E4BJH9S

2GB DDR3-1333 UNB ECC: AQ56M72E8BJH9S

Intel Server Board

S5520SC

S5520UR

S5500BC

S5520HC/HCV

2GB DDR3-1333 REG ECC:AL56M72B8BJH9S

4GB DDR3-1333 REG ECC:AL12M72E4BJH9S

2GB DDR3-1333 UNB ECC:AQ56M72E8BJH9S

Complete DRAM Product Line

Certified by Server Board Manufacturers:

FB-DIMM Family

Fully Buffered

UNB ECC

REG ECC

UNB Non-ECC

REG ECC

UNB ECC

UNB Non-ECC

REG ECC

UNB ECC

REG ECC

UNB ECC

UNB Non-ECC

REG

UNB ECC

UNB Non-ECC

REG ECC

UNB ECC

SODIMM / miniDIMM Family

PC133 Family

DDR2 Family

DDR3 Family

VLP Family

DDR Family

Long term availability (including lower density products) for legacy systems.

Up to 60% power saving compared to standard 1.8Vdd FB-DIMM

Built-in reliability with CRC (Cyclical Redundancy Checking) protection and Bit Lane Failover

Correction

High throughput and better system memory expandability

High performance, date rate up to 1600MHz.

With 1.5Vdd the DDR3 memory modules are about 20% efficient than the DDR2 counter parts

which utilize 1.8Vdd.

The signal quality of DDR3 memory module excels with the implementation of high precision

self calibration and Fly-by topology.

Dramatic performance evolution: The DDR2 memory modules support twice data transfer rate

over DDR.

Lower Power Consumption: The DDR2 memory modules consume 30% or less power than the

DDR counter parts

Higher memory module density, Multiplied system memory capacity.

TYPE

DDR3-1333

DDR3-1066

DDR3-1333

DDR3-1066

DDR2-800

DDR2-667

Apple FB-DIMM

DDR2-667/800

Low voltage and Low Power

DDR2-400

DDR2-800

DDR2-667

DDR2-800

DDR2-667

DDR2-533

DDR2-800

DDR2-667

DDR-400

DDR-333

DDR-400

DDR-333

DDR2-800

DDR3-1333

DDR2-667

DDR-400

DDR2-667

DDR-400

DDR-800

DDR2-667

DDR-400

PC133

DDR2-667

DDR3-1333

DDR2-800

SPEEDPRODUCT PORTFOLIO FEATURES

Faster than SDRAM: 200-400Mhz

Higher density than SDRAM - up to 4GB

Low power consumption - 2.5V

Ideal for space-limited systems - 60% less board space than standard DIMMs

For blade servers which require low height due to cooling demand

Also used in single board computers, remote systems, and network switches

For space constrained applications, including notebooks and mobile workstations

Power saving

For use in embedded devices such as SBC (Single Board Computers), printers, routers, etc.

Pin-for-Pin Replacement for Intel® Z-U130 Value SSD

The ATP Z-U130 eUSB SSD is a Pin-for-Pin replacement for Intel Z-U130 Value SSD. The ATP Z-U130 eUSB SSD is specifically

designed to support applications such as server, storage/accelerator, networking, telecommunications, mobile and

embedded computing, medical and automotive that previously used Intel’s Z-U130 Value SSD. The ATP Z-U130 eUSB SSD

meets or exceeds the Intel drive for power, reliability, profile, and RoHS compliance.

Ultra High Performance

The ATP Z-U130 eUSB SSD provides ultra high performance with SLC (Single Level Cell) NAND flash:

sequential read up to 35MB/s, sequential write up to 25MB/s.

Product Flexibility

With a broad range of densities, and support for multiple operating systems, ATP Z-U130 eUSB SSD provides the flexibility

needed for a wide array of applications. Small, frequently used files or even an entire operating system can be stored in the

ATP Z-U130 eUSB SSD. Furthermore, the optional low-profile (36.9*26.6*6.75 mm) of the ATP Z-U130 eUSB SSD integrates

easily into small footprint systems or embedded applications with little to no excess space.

Power Consumption Reduction

Without moving parts or refresh demands, ATP Z-U130 eUSB SSD typically requires less than 100mA of power to read data,

reducing power consumption beyond that of standard HDDs and SSDs using other interfaces (IDE, PATA or SATA).

Time-to-Market Advantages

Most chipsets and platforms already support USB, whereas integrating complex or proprietary technologies delays

development. Using a known, proven interface such as USB instead of other proprietary interfaces provides shorter design

process and time-to-market advantages.

ATP Z-U130 eUSB SSD

Pin-for-Pin Replacement for Intel's Z-U130 Value SSD

Embedded System Applications:Features:

Server

Storage/Accelerator

Networking

Telecommunications

Mobile and Embedded Computing

Healthcare and Transportation

Capacity: 512MB ~ 8GB

USB 2.0 Compliant and 1.1 Compatible

Advanced Flash Wear-Leveling Technology

Sudden PowerDown Data Corruption Protection

Fixed Disk Mode and ZIP/Removable Interface Modes Available

Ultra High Performance with SLC (Single Level Cell) NAND Flash :

sequential read up to 35MB/s, sequential write up to 25MB/s

High Reliability, MTBF (Mean Time Between Failures): 5 million hours

Enhanced Bad Block Management Algorithm w/ECC

Environmental Specifications:

Reliability:

Performance:

Certifications:

RoHS compliant / CE certification / FCC certification

Part No. Cross Reference (with Intel):

Intel product code Intel MM# ATP P/N Description

--- --- AF512SSGH 512MB Standard connector

--- --- AF512SSGI 512MB Low profile connector

SSDUSMS0001G1 888492 AF1GSSGH 1GB Standard connector

SSDUSMS0001G110 890946 AF1GSSGH 1GB Standard connector

SSDUSMS0001GL 890288 AF1GSSGI 1GB Low profile connector

SSDUSMS0001G1L10 890945 AF1GSSGI 1GB Low profile connector

SSDUSMS0002G1 888493 AF2GSSGH 2GB Standard connector

SSDUSMS0002G110 890944 AF2GSSGH 2GB Standard connector

SSDUSMS0002GL 890289 AF2GSSGI 2GB Low profile connector

SSDUSMS0002G1L10 890943 AF2GSSGI 2GB Low profile connector

SSDUSMS0004G1 888522 AF4GSSGH 4GB Standard connector

SSDUSMS0004G110 890942 AF4GSSGH 4GB Standard connector

SSDUSMS0004GL 890287 AF4GSSGI 4GB Low profile connector

--- --- AF8GSSGH 8GB Standard connector

--- --- AF8GSSGI 8GB Low profile connector

Temperature

Humidity

Vibration

Shock

Altitude

Type

Operating

Non-Operating

Operating

Non-Operating

Operating

Non-Operating

Operating

Non-Operating

Operating

Non-Operating

Standard

-40

to +85

C (industrial temp range)

-40

C to +85

C (under 500 hours)

8% to 95%, non condensing

15G peak-to-peak Max

2,000G Max

80,000 feet Max

Type Measurement

Type

Measurement

Physical Dimension Specifications:

36.9mm

26.6mm

9.65mm

Standard

36.9mm

Low Profile

26.6mm

6.75mm

Type

Data Retention

Endurance

MTBF (@ 25oC)

Measurement

10 years

>2,000,000 cycles (program/erase, in normal applications)

>5,000,000 hours

Read up to 35MB/s

Write up to 25MB/s

Data Transfer Rate

Length

Width

Thickness

ATP Industrial Grade Flash Cards

ATP Industrial Grade Flash Cards are designed for mission critical applications where consistent

performance is “crucial” in all environmental conditions. Using carefully screened SLC flash

components, all ATP Industrial Grade flash products are built using SIP (system in package)

technology, allowing for industry leading waterproof and extreme temperature durability.

• Operating/Storage Temp Range: -40°C to +85°C

• Fixed BOM available for all form factors

• System-in-Package Built, Humidity/Dust/ESD proof

• RoHS/China RoHS Certified

• Built with Pre-Screened Samsung SLC NAND

• sudden powerdown data corruption protection

• enhanced bad block management algorithm with

ECC (Error Correction Code)

• MTBF: 2 million hours

Industrial Grade SD/SDHC, miniSD/miniSDHC,

microSD

• Up to 22.5MB/sec Data Transfer Speed

• SPI Mode Compatible

Industrial Grade CompactFlash

• Up to 45MB/sec Data Transfer Speed

• IDE/Fixed Disk Mode Compatible

• UDMA Mode 5 Compatible

ATP’s SIP (System-In-Package) manufacturing process encapsulates all exposed

components and points of failure to extend protection against water/moisture,

vibration/shock, ESD (electro-static discharge), and extreme temperatures.

System-In-Package Technology

Protective encapsulation molding

ATP [ SIP ] Other Brand

Exposed components

and contacts

Models Available

CompactFlash

Product

USB DriveSDHC/SD/miniSD/microSD

Densities Available

Support

Read Performance (Seq)

Write Performance (Seq)

MTBF

Dimensions

Operating Voltage

Operating Temperature

N/A

SDHC: 4GB,8GB

SD: Up to 2GB

miniSD: Up to 4GB

microSD: Up to 2GB

SD: 32 X 24 X 2.1 (mm)

miniSD: 21.5 x 20 x 1.4 (mm)

microSD: 15 x 11 x 1 (mm)

Up to 22.5MB/sec

SD 1.1, SD 2.0

Up to 20MB/sec

2,000,000 Hours

2.7V- 3.6V

-40°C to +85°C

Features & Specifications

Type I CompactFlash

Up to 16GB

Pure IDE, PIO, MW-DMA,

UDMA mode

36.4 X 42.8 X 3.3 (mm)

Up to 45MB/sec

(UDMA Mode)

up to 36MB/sec

(UDMA Mode)

2,000,000 Hours

2.7V – 3.6V

4.5V – 5.5V

-40°C to +85°C

Type A USB

Up to 4GB

Bootable,

AWARD BIOS update

17.5 X 36.6 X 9.4 (mm)

Up to 35MB/sec

Up to 28MB/sec

2,000,000 Hours

-40°C to +85°C

Introducing ATP Solid State Drives, ultra reliable, high performance storage solutions designed for

mission-critical applications which demand the highest level of reliability, durability, and data integrity. With

significant performance and power advantages, ATP SSDs can benefit a wide range of I/O storage applications

such as streaming video servers, servers, telecommunications, networking, virtualization, and more.

ATP Solid State Drives

Optimized for Mission-Critical

and High-Performance Storage Applications

For steaming video servers, ATP SSDs save power while cutting space requirements. For servers, ATP SSDs deliver better reliability while

using less power compared to traditional HDDs. Virtualization is an area where ATP SSDs can also provide a major performance increase. ATP

SSDs enable virtualized servers and virtualized storage to significantly reduce data-center IOPS performance bottlenecks. With data-center

costs based on square footage and the amount of power consumed, ATP SSDs provides relief via significantly higher performance per watt

and a very low heat load on air-conditioning systems. ATP SSDs are produced under a stringent RoHS and Green Package compliant

manufacturing process to guarantee a consistent high level of build quality and performance.

Full Manufacturer Support and Product Consistency

Being a true manufacturer gives ATP the ability to support customers with a fixed BOM policy, ensuring both consistent compatibility and

performance. ATP also fully supports its customers with product customization and tuning to optimize performance in particular or specialized

applications.

Highly Reliable

Pre-screened SLC (Single Level Cell) components along with onboard ECC (Error Correction Code), wear leveling algorithms, and reserve block

management technologies allow for MTBF ratings over 3 million hours. ATP SSDs also include SMART functionality for health status

monitoring/logging and sudden power down protection against data corruption.

Outstanding Performance

• Optimized for a high 10000 IOPS (Input/Output Operations per Second)

• Sequential data transfer rates up to 170MB/sec

Product Details

Specifications

Host Interface

Transfer Mode

• 2.5" Type (100.0±0.3 x 70±0.3 x 9.5±0.3 mm)

• Serial ATA 2.0a specification

• SATA 3.0 gigabits per second

• PIO Mode 0, 1, 2, 3, 4

• Multiword DMA 0, 1, 2

• UDMA Mode 0, 1, 2, 3, 4, 5, 6

Performance

• Sustained Data Read: 170MB/sec. (max.)

• Sustained Data Write: 140MB/sec. (max.)

• Access time: < 0.1ms

• Random IOPS: 6,000 ( 4KB random read)

Temperature Range

Humidity

Vibration

Shock

System Reliability

Environmental specifications

• Non-Operating: -40°C to +85°C

• 8%~95%, non-condensing

• 5G, 7~2000Hz, (12Cycle/Axis) 3 axes

• 1500G/0.5ms, 3 axes

• ECC (BCH): 8 or 15 bit in 512Bytes

• MTBF: > 3,000,000 Hours

• Memory type: Single layer cell (SLC)

NAND Flash memory

• Write endurance: >10 years@ 1TByte/day

• Read endurance: unlimited

• Wear Leveling: support

DC Input voltage

Power Consumption

Power Requirement

• +5VDC, ±5% (4.75V ~ 5.25V)

• Sustained write: Typical 410mA

• Sustained read: Typical 310mA

• Idle: Typical 140mA

• Stand-by: Typical 140mA

• Complete line of DRAM modules and NAND Flash products

• Extensive support on DDR3, DDR2, DDR, SDRAM, DRAM memory modules

• Extensive Interface expertise and support on SATA, PATA, CF, UDMA CF, USB, and SD Flash Products

• Application specific form factors (VLP, UDIMM, RDIMM, miniDIMM, SORDIMM, SOCDIMM)

• Unique SIP (System-In-Package) technology

• Extended temperature product offering for industrial grade applications

Why ATP?

True Manufacturer

A true manufacturer of both flash and DRAM products, ATP offers in-house design, testing, and product tuning at both the system and

component levels.

Customization

• Custom module and Flash designs

• Electronic Design and Manufacturing Services (EDMS)

• Patented Security features

• Private Labeling

Quality, Performance, Reliability, Service

ATP JAPAN

TEL: +81-46-229-7501/ or -7502

FAX: +81-46-229-7503

sales-japan@atpinc.com

www.atpinc.co.jp

ATP TAIWAN

TEL: +886-2-2659-6368

FAX: +886-2-2659-4982

sales-apac@atpinc.com

ATP CHINA

TEL: +86-21-5080-2220

FAX: +86-21-5080-0172

sales-apac@atpinc.com

www.atpinc.com.cn

ATP USA

TEL: +1-408-732-5000

FAX: +1-408-732-5055

sales@atpinc.com

ATP EUROPE

TEL: +31-88-287-0000

FAX: +31-88-287-0099

sales-emea@atpinc.com

Quality, Performance, Reliability, Service

Sales and Engineering Support

• Efficient, competent and professional sales staff to serve your needs

• Application specific design and customization to meet your specific requirements

• Fast turn sample and production orders

• Global manufacturing facilities, technical support, and logistics support including experience with contract manufacturer coordination.

Controlled Bill of Materials (BOM)

• Quality and Engineering documents provided

• Long product life cycles with buffer inventory support and advance PCNs

Test for Reliability

• Extended and Industrial Temperature Testing

• Environmental testing

• Application testing

Industry Association and Compliance

Visit our Web site for the latest information.

http://www.atpinc.com/

This information is subject to change without notice.