FEATURES
LOW NOISE: 4.5nV/Hz max at 1kHz
LOW OFFSET: 100µV max
LOW DRIFT: 0.4µV/°C
HIGH OPEN-LOOP GAIN: 117dB min
HIGH COMMON-MODE REJECTION: 100dB min
HIGH POWER-SUPPLY REJECTION: 94dB min
FITS OP-07, OP-05, AD510, AND AD517
SOCKETS
Ultra-Low Noise, Precision
OPERATIONAL AMPLIFIERS
APPLICATIONS
PRECISION INSTRUMENTATION
DATA ACQUISITION
TEST EQUIPMENT
PROFESSIONAL AUDIO EQUIPMENT
TRANSDUCER AMPLIFIERS
RADIATION HARD EQUIPMENT
OPA27
OPA37
OPA27
OPA27
SBOS135C – JANUARY 1984 – REVISED AUGUST 2005
DESCRIPTION
The OPA27 and OPA37 are ultra-low noise, high-precision
monolithic operational amplifiers.
Laser-trimmed thin-film resistors provide excellent long-term
voltage offset stability and allow superior voltage offset
compared to common zener-zap techniques.
A unique bias current cancellation circuit allows bias and
offset current specifications to be met over the full –40°C to
+85°C temperature range.
The OPA27 is internally compensated for unity-gain stability.
The decompensated OPA37 requires a closed-loop gain 5.
The Texas Instruments’ OPA27 and OPA37 are improved
replacements for the industry-standard OP-27 and OP-37.
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1984-2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Output
+V
CC
V
CC
+In
In
Trim
Trim 8
7
6
4
1
2
3
OPA27, OPA37
2SBOS135C
www.ti.com
Top View
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage................................................................................... ±22V
Internal Power Dissipation (2) ....................................................... 500mW
Input Voltage ..................................................................................... ±VCC
Output Short-Circuit Duration (3) .................................................Indefinite
Differential Input Voltage (4) ............................................................. ±0.7V
Differential Input Current (4) ........................................................... ±25mA
Storage Temperature Range..........................................55°C to +125°C
Operating Temperature Range.........................................40°C to +85°C
Lead Temperature:
P (soldering, 10s) ....................................................................... +300°C
U (soldering, 3s) ......................................................................... +260 °C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Maximum package power dissipation versus ambient
temperature. (2) To common with ±VCC = 15V. (4) The inputs are protected by
back-to-back diodes. Current limiting resistors are not used in order to achieve
low noise. If differential input voltage exceeds ±0.7V, the input current should
be limited to 25mA.
PACKAGE PACKAGE
PRODUCT PACKAGE-LEAD
θ
JA DRAWING MARKING
OPA27 DIP-8 100°C/W P OPA27GP
OPA27 SO-8 160°C/W D OPA27U
OPA37 DIP-8 100°C/W P OPA37GP
OPA37 SO-8 160°C/W D OPA37U
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum located at the end of this document, or see the TI
website at www.ti.com.
PACKAGE/ORDERING INFORMATION(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
1
2
3
45
6
7
8
Offset Trim
+V
CC
In
+In
V
CC
Output
NC
NC = No Connection
Offset Trim
OPA27, OPA37 3
SBOS135C www.ti.com
ELECTRICAL CHARACTERISTICS
At VCC = ±15V and TA = +25°C, unless otherwise noted.
OPA27
OPA37
PARAMETER CONDITIONS MIN TYP MAX UNITS
INPUT NOISE(6)
Voltage, fO = 10Hz 3.8 8.0 nV/Hz
fO = 30Hz 3.3 5.6 nV/Hz
fO = 1kHz 3.2 4.5 nV/Hz
fB = 0.1Hz to 10Hz 0.09 0.25 µVPP
Current,(1) fO = 10Hz 1.7 pA/Hz
fO = 30Hz 1.0 pA/Hz
fO = 1kHz 0.4 0.6 pA/Hz
OFFSET VOLTAGE(2)
Input Offset Voltage ±25 ±100 µV
Average Drift(3) TA MIN to TA MAX ±0.4 ±1.8 (6) µV/°C
Long Term Stability(4) 0.4 2.0 µV/mo
Supply Rejection ±VCC = 4 to 18V 94 120 dB
±VCC = 4 to 18V ±1±20 µV/V
BIAS CURRENT
Input Bias Current ±15 ±80 nA
OFFSET CURRENT
Input Offset Current 10 75 nA
IMPEDANCE
Common-Mode 2 || 2.5 G || pF
VOLTAGE RANGE
Common-Mode Input Range ±11 ±12.3 V
Common-Mode Rejection VIN = ±11VDC 100 122 dB
OPEN-LOOP VOLTAGE GAIN, DC RL 2k117 124 dB
RL 1k124 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product(5) OPA27 5(6) 8 MHz
OPA37 45(6) 63 MHz
Slew Rate(5) VO = ±10V,
RL = 2k
OPA27, G = +1 1.7(6) 1.9 V/µs
OPA37, G = +5 11(6) 11.9 V/µs
Settling Time, 0.01% OPA27, G = +1 25 µs
OPA37, G = +5 25 µs
RATED OUTPUT
Voltage Output RL 2kΩ±12 ±13.8 V
RL 600Ω±10 ±12.8 V
Output Resistance DC, Open Loop 70
Short Circuit Current RL = 025 60(6) mA
POWER SUPPLY
Rated Voltage ±15 VDC
Voltage Range,
Derated Performance ±4±22 VDC
Current, Quiescent IO = 0mADC 3.3 5.7 mA
TEMPERATURE RANGE
Specification 40 +85 °C
Operating 40 +85 °C
NOTES: (1) Measured with industry-standard noise test circuit (Figures 1 and 2). Due to errors introduced by this method, these current noise specifications should
be used for comparison purposes only. (2) Offset voltage specification are measured with automatic test equipment after approximately 0.5 seconds from power turn-
on. (3) Unnulled or nulled with 8k to 20k potentiometer. (4) Long-term voltage offset vs time trend line does not include warm-up drift. (5) Typical specification only
on plastic package units. Slew rate varies on all units due to differing test methods. Minimum specification applies to open-loop test. (6) This parameter specified by
design.
OPA27, OPA37
4SBOS135C
www.ti.com
OPA27
OPA37
PARAMETER CONDITIONS MIN TYP MAX UNITS
INPUT VOLTAGE(1)
Input Offset Voltage ±48 ±220(3) µV
Average Drift(2) TA MIN to TA MAX ±0.4 ±1.8(3) µV/°C
Supply Rejection ±VCC = 4.5 to 18V
±VCC = 4.5 to 18V 90 (3) 122 dB
BIAS CURRENT
Input Bias Current ±21 ±150(3) nA
OFFSET CURRENT
Input Offset Current 20 135(3) nA
VOLTAGE RANGE
Common-Mode Input Range ±10.5(3) ±11.8 V
Common-Mode Rejection VIN = ±11VDC 96(3) 122 dB
OPEN-LOOP GAIN, DC
Open-Loop Voltage Gain RL 2k113(3) 120 dB
RATED OUTPUT
Voltage Output RL = 2kΩ±11.0(3) ±13.4 V
Short Circuit Current VO = 0VDC 25 mA
TEMPERATURE RANGE
Specification 40 +85 °C
NOTES: (1) Offset voltage specification are measured with automatic test equipment after approximately 0.5s from power turn-on. (2) Unnulled or nulled with 8k to
20k potentiometer. (3) This parameter specified by design.
ELECTRICAL CHARACTERISTICS (Cont.)
At VCC = ±15V and 40°C TA +85°C, unless otherwise noted.
OPA27, OPA37 5
SBOS135C www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.
INPUT OFFSET VOLTAGE WARM-UP DRIFT
Time From Power Turn-On (min)
0
+10
+5
0
5
10
Offset Voltage Change (µV)
123456
INPUT VOLTAGE NOISE vs NOISE BANDWIDTH
(0.1Hz to Indicated Frequency)
Noise Bandwidth (Hz)
100 1k 10k 100k
10
1
0.1
0.01
Voltage Noise (µVrms)
R = 0
S
TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY
vs SOURCE RESISTANCE
Source Resistance ( )
100 1k 10k
100
80
60
10
8
6
40
20
4
2
1
Voltage Noise (nV/Hz)
-
+
R
1
R
1
R = 2 R
1
x
SOURCE
Resistor Noise Only
1kHz
10Hz
VOLTAGE NOISE SPECTRAL DENSITY
vs SUPPLY VOLTAGE
5
4
3
2
10
Supply Voltage (V )
CC
±5±10 ±15 ±20
Voltage Noise (nV/Hz)
1kHz
10Hz
Voltage Noise (nV/Hz)
VOLTAGE NOISE SPECTRAL DENSITY
vs TEMPERATURE
5
4
3
2
175 50 25 0 +25 +50 +75 +100 +125
Ambient Temperature (°C)
10Hz
1kHz
INPUT CURRENT NOISE SPECTRAL DENSITY
Current Noise (pA/Hz)
10
8
6
4
2
1
0.8
0.6
0.4
0.2
0.1 10 100 1k 10k
This industry-standard equation
is inaccurate and these figures should
be used for comparison purposes only!
Current Noise Test Circuit
I
n=
(e
no
)
2
(130nV)
2
1M 100
x
DUT
100k
500k
500k10ke
no
Frequency (Hz)
Warning:
OPA27, OPA37
6SBOS135C
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.
INPUT VOLTAGE NOISE SPECTRAL DENSITY
1 10 100 1k
Frequency (Hz)
Voltage Noise (nV/Hz)
10
8
6
4
2
0
OPEN-LOOP FREQUENCY RESPONSE
Frequency (Hz)
10 100 1k 10k 100k 1M 10M 100M
140
120
100
80
60
40
20
0
Voltage Gain (dB)
OPA27
OPA37
BIAS AND OFFSET CURRENT vs TEMPERATURE
Ambient Temperature (°C)
75 50 25 0 +25 +50
Bias
Offset
+75 +100 +125
Absolute Bias Current (nA)
20
15
10
5
0
Absolute Offset Current (nA)
20
15
10
5
0
OPA27 CLOSED-LOOP VOLTAGE GAIN AND
PHASE SHIFT vs FREQUENCY (G = 100)
Frequency (Hz)
10 100 1k 10k 100k 1M 10M 100M
Voltage Gain (dB)
Phase Shift (degrees)
50
40
30
20
10
0
10
20
0
45
90
135
180
225
Gain
OPA37 CLOSED-LOOP VOLTAGE GAIN AND
PHASE SHIFT vs FREQUENCY (G = 100)
Frequency (Hz)
10 100 1k 10k 100k 1M 10M 100M
Voltage Gain (dB)
Phase Shift (degrees)
50
40
30
20
10
0
10
20
0
45
90
135
180
225
Ø
Gain
G = 5
COMMON-MODE REJECTION vs FREQUENCY
140
120
100
80
60
40
20
0
Common-Mode Rejection (dB)
Frequency (Hz)
1 10 100 1k 10k 100k 1M 10M
OPA37
OPA27
OPA27, OPA37 7
SBOS135C www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.
POWER SUPPLY REJECTION vs FREQUENCY
140
120
100
80
60
40
20
0
Power Supply Rejection (dB)
Frequency (Hz)
1 10 100 1k 10k 100k 1M 10M
OPA27
V
CC
+V
CC
OPEN-LOOP VOLTAGE GAIN vs SUPPLY VOLTAGE
130
125
120
115
Voltage Gain (dB)
±5
Supply Voltage (V )
CC
±10 ±15 ±20 ±25
R = 2k
L
R = 600
L
OPEN-LOOP VOLTAGE GAIN vs TEMPERATURE
Voltage Gain (dB)
135
130
125
120
115
Ambient Temperature (°C)
75 50 25 0 +25 +50 +75 +100 +125
R
L
= 2k
SUPPLY CURRENT vs SUPPLY VOLTAGE
6
5
4
3
2
1
0
Supply Current (mA)
0
Supply Voltage (V )
CC
±5±10 ±15 ±20
+25°C
+125°C
55°C
COMMON-MODE INPUT VOLTAGE RANGE
vs SUPPLY VOLTAGE
+15
+10
+5
0
5
10
15
Common-Mode Range (V)
0
Supply Voltage (V )
CC
±5±10 ±15 ±20
T = +25°C
A
T = +125°C
A
T = 55°C
A
T = +25°C
A
T = +125°C
A
T = 55°C
A
OPA27 SMALL SIGNAL TRANSIENT RESPONSE
Time (µs)
+60
+40
+20
0
20
40
60
Output Voltage (mV)
012
A = +1
C = 15pF
VCL
L
0.5 1.5 2.5
OPA27, OPA37
8SBOS135C
www.ti.com
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, ±VCC = ±15VDC, unless otherwise noted.
OPA37 SMALL SIGNAL TRANSIENT RESPONSE
Time (µs)
+60
+40
+20
0
20
40
60
Output Voltage (mV)
0.2 0.4 0.6
A = +5
C = 25pF
V
L
00.8 1.0 1.2
OPA27 LARGE SIGNAL TRANSIENT RESPONSE
Time (µs)
+6
+4
+2
0
2
4
6
Output Voltage (V)
246
081012
A = +1
VCL
OPA37 LARGE SIGNAL TRANSIENT RESPONSE
Time (µs)
+15
+10
+5
0
5
10
15
Output Voltage (V)
123
0456
A = +5
V
OPA27, OPA37 9
SBOS135C www.ti.com
APPLICATIONS INFORMATION
OFFSET VOLTAGE ADJUSTMENT
The OPA27 and OPA37 offset voltages are laser-trimmed
and require no further trim for most applications. Offset
voltage drift will not be degraded when the input offset is
nulled with a 10k trim potentiometer. Other potentiometer
values from 1k to 1M can be used, but VOS drift will be
degraded by an additional 0.1µV/°C to 0.2µV/°C. Nulling
large system offsets by use of the offset trim adjust will
degrade drift performance by approximately 3.3µV/°C per
millivolt of offset. Large system offsets can be nulled without
drift degradation by input summing.
The conventional offset voltage trim circuit is shown in Figure
3. For trimming very small offsets, the higher resolution
circuit shown in Figure 4 is recommended.
The OPA27 and OPA37 can replace 741-type operational
amplifiers by removing or modifying the trim circuit.
THERMOELECTRIC POTENTIALS
The OPA27 and OPA37 are laser-trimmed to microvolt-level
input offset voltages, and for very-low input offset voltage
drift.
Careful layout and circuit design techniques are necessary to
prevent offset and drift errors from external thermoelectric
potentials. Dissimilar metal junctions can generate small
EMFs if care is not taken to eliminate either their sources
(lead-to-PC, wiring, etc.) or their temperature difference (see
Figure 11).
Short, direct mounting of the OPA27 and OPA37 with close
spacing of the input pins is highly recommended. Poor layout
can result in circuit drifts and offsets which are an order of
magnitude greater than the operational amplifier alone.
FIGURE 1. 0.1Hz to 10Hz Noise Test Circuit.
FIGURE 2. Low Frequency Noise.
DUT OPA111
100k
2k
4.7µF
Voltage Gain
Total = 50,000
10
NOTE: All capacitor values are for nonpolarized capacitors only.
0.1µF
Scope
x1
R
IN
= 1M
100k
24.3k
4.3k
110k
0.1µF
22µF
2.2µF
0.1Hz TO 10Hz NOISE
1s/div 40nv/div
OPA27, OPA37
10 SBOS135C
www.ti.com
COMPENSATION
Although internally compensated for unity-gain stability, the
OPA27 may require a small capacitor in parallel with a
feedback resistor (RF) which is greater than 2k. This ca-
pacitor will compensate the pole generated by RF and CIN
and eliminate peaking or oscillation.
INPUT PROTECTION
Back-to-back diodes are used for input protection on the
OPA27 and OPA37. Exceeding a few hundred millivolts differ-
ential input signal will cause current to flow, and without
external current limiting resistors, the input will be destroyed.
Accidental static discharge, as well as high current, can dam-
age the amplifiers input circuit. Although the unit may still be
functional, important parameters such as input offset voltage,
drift, and noise may be permanently damaged, as will any
precision operational amplifier subjected to this abuse.
Transient conditions can cause feedthrough due to the amplifiers
finite slew rate. When using the OPA27 as a unity-gain buffer
(follower) a feedback resistor of 1k is recommended, as
shown in Figure 6.
NOISE: BIPOLAR VERSUS FET
Low-noise circuit design requires careful analysis of all noise
sources. External noise sources can dominate in many
cases, so consider the effect of source resistance on overall
operational amplifier noise performance. At low source im-
pedances, the lower voltage noise of a bipolar operational
amplifier is superior, but at higher impedances the high
current noise of a bipolar amplifier becomes a serious liabil-
ity. Above about 15k, the OPA111 low-noise FET opera-
tional amplifier is recommended for lower total noise than the
OPA27, as shown in Figure 5.
FIGURE 3. Offset Voltage Trim.
FIGURE 5. Voltage Noise Spectral Density Versus Source
Resistance.
FIGURE 6. Pulsed Operation.
FIGURE 8. Unity-Gain Inverting Amplifier.
FIGURE 7. Low-Noise RIAA Preamplifier.
FIGURE 4. High Resolution Offset Voltage Trim.
1
2
3
4
6
±4mV Typical Trim Range
NOTE: (1) 10k to 1M
Trim Potentiometer
(10k Recommended).
+V
CC
V
CC
OPA27/37
78
(1)
1
2
3
4
6
±280µV Typical Trim Range
NOTE: (1) 1kTrim Potentiometer.
+VCC
VCC
OPA27/37
78
4.7k4.7k
(1)
100 1k 10k 100k 1M 10M
1k
100
10
1
Voltage Noise Spectral Density, E
O
Typical at 1kHz (nV/Hz)
OPA111 + Resistor
OPA27 + Resistor
Source Resistance, R
S
()
E
O
R
S
E
O
= e
n2
+ (i
n
R
S
)
2
+ 4kTR
S
F
O
= 1kHz
Resistor Noise Only
OPA27 + Resistor
OPA111 + Resistor
Resistor Noise Only
OPA27 Output
1.9V/µs
R
F
1k
Input
+
OPA37 Output
97.6k
G 40dB at 1kHz.
Metal film resistors.
Film capacitors.
R
L
and C
L
per cartridge
manufacturers
recommendations. 1002
36
0.03µF0.01µF
7.87k
1µF
20k
R
L
Moving
Magnet
Cartridge C
L
OPA27 Output
Input
1k
1k2
36
OPA27, OPA37 11
SBOS135C www.ti.com
FIGURE 11. Low Frequency Noise Comparison.
FIGURE 10. NAB Tape Head Preamplifier.
FIGURE 9. High Slew Rate Unity-Gain Inverting Amplifier.
OPA37 Output
Input
1k
1k2
36
500pF
250
OPA37 Output
316k
4.99k
G 50dB at 1kHz.
Metal film resistors.
Film capacitors.
R
L
and C
L
per head
manufacturers
recommendations.
1002
36
0.01µF
1µF
20k
R
L
Magnetic Tape Head
C
L
10k
0.5µV
0.5µV
0.5µV
0.5µV
5µV
A. 741 noise with circuit well-shielded from air
currents and RFI. (Note scale change.)
B. OP-07AH with circuit well-shielded from air
currents and RFI.
C. OPA27AJ with circuit well-shielded from air
currents and RFI. (Represents ultimate
OPA27 performance potential.)
D. OPA27 with circuit unshielded and exposed
to normal lab bench-top air currents.
(External thermoelectric potentials far
exceed OPA27 noise.)
E. OPA27 with heat sink and shield which
protects input leads from air currents.
Conditions same as (D).
Offset G =1k 10Hz Low-
Pass Filter Chart
Recorder 10mV/mm
5mm/s
DUT
Total Gain = 10
6
10
OPA27, OPA37
12 SBOS135C
www.ti.com
FIGURE 12. Low Noise Instrumentation Amplifier.
FIGURE 13. Hydrophone Preamplifier. FIGURE 14. Long-Wavelength Infrared Detector Amplifier.
FIGURE 15. High Performance Synchronous Demodulator.
Output
OPA37
2
36
OPA37
3
26
6
1
5
3
2
INA105
Differential Amplifier
Input Stage Gain = 1 + 2RF/RG
+In
In
RG
101
RF
5k
RF
5k
Gain = 100
Bandwidth 500kHz For Gain = 1000, use INA106 differential amplifier.
25k
25k
25k25k
OPA37 Output
1k
2k
EDO 6166
Transducer Frequency Response
1kHz to 50kHz
2
36
1M
200
500pF 0.1µF
Output
NOTE: Use metal film resistors
and plastic film capacitor. Circuit
must be well shielded to achieve
low noise.
Responsivity 2.5 x 10
4
V/W
Output Noise 30µVrms, 0.1Hz to 10Hz
Dexter 1M
Thermopile
Detector
100100k
OPA27
2
36
0.1µF
Output
4.99k
D2
D1
DG188
TTL
In
S1S2
9.76k
500Balance
Trim
OPA27
2
3
1
8
6
20pF
10k
1k
4.75k
Offset
Trim
4.75k
+V
CC
Input
TTL INPUT
1
0
GAIN
+1
1
OPA27, OPA37 13
SBOS135C www.ti.com
FIGURE 16. Ultra-Low Noise N-Stage Parallel Amplifier.
2k
Gain = 1010V/V
VOS 2µV
Drift 0.07µV/°C
en 1nV/Hz at 10Hz
0.9nV/Hz at 100Hz
0.87nV/Hz at 1kHz
Full Power Bandwidth 180kHz
Gain Bandwidth 500MHz
Equivalent Noise Resistance 50
Signal-to-Noise Ratio ∝ √N
since amplifier noise is
uncorrelated.
2k
6
2
3
20
6
2
3
6
2
3
2k
6
2
3
6
2
3
OPA37
OPA37
OPA37
OPA37
OPA37
6
Output
2
3
OPA37
N = 10 Each OPA37
2k
2k
2k
2k
2k20
2k20
2k20
2k20
Input
OPA27, OPA37
14 SBOS135C
www.ti.com
FIGURE 18. High Slew Rate Unity-Gain Buffer.
FIGURE 17. Unity-Gain Buffer.
FIGURE 20. Balanced Pyroelectric Infrared Detector.FIGURE 19. RF Detector and Video Amplifier.
FIGURE 21. Magnetic Tachometer.
OPA27 Output
Input
1k
2
36
5V
5µs
R
S
= 50
+10V
0V
Output
10V
OPA37 Output
Input
1k
2
36
500pF
250
5V
5µs
RS = 50
+10V
0V
Output
10V
OPA37 Video
Output
20k200
VIRTEC V1000
Planar Tunnel
Diode
2
36
0.01µF
50
Input
200RFC 500pF
OPA27 Output
10k100
100µF/20V
Tantalum
2
36
+
+
1
3
2
10k10k
10µF/20V
Siemens LHI 948
+15V
OPA27 Output 0
+
4.8V
1k2
3
Airpax
Magnetic
Pickup
fOUT RPM N
Where N = Number of Gear Teeth
6
PACKAGE OPTION ADDENDUM
www.ti.com 9-Oct-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA27GP ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples
OPA27GPG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type Contact TI Distributor
or Sales Office
OPA27GU ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Request Free Samples
OPA27GU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples
OPA27GU/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples
OPA27GUE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Contact TI Distributor
or Sales Office
OPA27GUG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Contact TI Distributor
or Sales Office
OPA37GP ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples
OPA37GPG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type Contact TI Distributor
or Sales Office
OPA37GU ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Request Free Samples
OPA37GU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples
OPA37GU/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples
OPA37GUE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Contact TI Distributor
or Sales Office
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Oct-2010
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA27GU/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA37GU/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA27GU/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA37GU/2K5 SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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