LM3557
LM3557 Step-Up Converter for White LED Applications
Literature Number: SNVS338A
LM3557
Step-Up Converter for White LED Applications
General Description
The LM3557 is a complete solution for white LED drive
applications. With minimal external component count, no DC
current leakage paths to ground, cycle-by-cycle current limit
protection, and output over-voltage protection circuitry, the
LM3557 offer superior performance and cost savings over
standard DC/DC boost component implementations.
The LM3557 switches at a fixed-frequency of 1.25 MHz,
which allows for the use of small external components. Also,
the LM3557 has a wide input voltage range to take advan-
tage of multi-cell input applications. With small external com-
ponents, high fixed frequency operation, and wide input
voltage range, the LM3557 is the most optimal choice for
LED lighting applications.
Features
nV
IN
Range: 2.7V–7.5V
nSmall External Components
n1.25 MHz Constant-Switching Frequency
nOutput Over-Voltage Protection
nInput Under-Voltage Protection
nCycle-By-Cycle Current Limit
nTRUE SHUTDOWN: No DC current paths to ground
during shutdown
nLow Profile Package: <1 mm Height -8 Pin LLP
nNo External Compensation
Applications
nWhite LED Display Lighting
nCellular Phones
nPDAs
Typical Application Circuit
20131601
FIGURE 1. Backlight Configuration
May 2000
LM3557 Step-Up Converter for White LED Applications
© 2006 National Semiconductor Corporation DS201316 www.national.com
Connection Diagram
Top View
20131602
8-Lead Thin Leadless Leadframe Package
See NS Package Number SDA08A
Ordering Information
Order Number Package
Marking
Supplied As
LM3557SD-2 L147B 1k Units, Tape and Reel
LM3557SDX-2 L147B 4.5k Units, Tape and Reel
Pin Descriptions
Pin # Name Description
1 Sw1 Drain Connection of the Internal Power Field Effect Transistor (FET) Switch (Figure 2: N1)
2V
IN
Input Voltage Connection
3 NC No Connection
4 En Device Enable Connection
5 Ovp Over-Voltage Protection Input Connection
6 Fb Feedback Voltage Connection
7 Sw2 Drain Connection of an Internal Field Effect Transistor (FET) Switch (Figure 2: N2)
8 Gnd Ground Connection
DAP DAP Die Attach Pad (DAP), must be soldered to the printed circuit board’s ground plane for enhanced thermal
dissipation
LM3557
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
IN
Pin −0.3V to +8V
En Pin −0.3V to +8V
Fb Pin −0.3V to +8V
Sw2 Pin −0.3V to +8V
Ovp Pin −0.3V to +30V
Sw1 Pin −0.3V to +40V
Continuous Power Dissipation Internally Limited
Maximum Junction Temperature
(T
J-MAX
) +150˚C
Storage Temperature Range −65˚C to +150˚C
ESD Rating (Note 2)
Human Body Model
Machine Model
2kV
150V
Operating Conditions (Notes 1, 6)
Junction Temperature (T
J
) Range −40˚C to +125˚C
Ambient Temperature (T
A
) Range −40˚C to +85˚C
Supply Voltage, V
IN
Pin 2.7V to 7.5V
En Pin 0V to V
IN
+0.4V
Thermal Properties (Notes 4, 7)
Junction-to-Ambient Thermal 55˚C/W
Resistance (θ
JA
), Leadless Leadframe Package
Electrical Characteristics (Notes 6, 8) Limits in standard typeface are for T
J
= 25˚C. Limits in bold type-
face apply over the full operating junction temperature range (−40˚C ≤T
J
≤+125˚C). Unless otherwise specified: V
IN
= 3.6V.
Symbol Parameter Conditions Min Typ Max Units
V
IN
Input Voltage 2.7 7.5 V
I
Q
Quiescent Current V
EN
= 0V (Shutdown)
V
EN
= 1.8V; V
OVP
= 27V
(Non-Switching)
0.01
0.55
2
0.8
µA
mA
En Device Enable Threshold Device On
Device Off
0.9 0.3 V
I
CL
Power Switch Current Limit
(Note 10)
V
IN
=3V 0.4
0.55
0.8
0.8
1.1
1.02 A
R
DS(ON)
Power Switch ON Resistance I
Sw1
= 175 mA 800 1000 mΩ
TC
(R
DS(ON)
)
R
DS(ON)
Temperature
Coefficient 0.5 %/C
OVP Over-Voltage Protection (Note
5)
On Threshold
Off Threshold
22
21.5
26
25.5
28.5
28 V
UVP Under-Voltage Protection (Note
5)
On Threshold
Off Threshold
2.2
2.3 V
I
OVP
Over-Voltage Protection Pin
Bias Current (Note 3) 410 µA
I
EN
Enable Pin Bias Current (Note
3)
V
EN
= 1.8V 0.8 3µA
F
S
Switching Frequency V
IN
=3V 0.9 1.25 1.6 MHz
V
Fb-Sw2
Feedback Pin Voltage (Note 9) 0.459 0.51 0.561 V
I
Fb
Feedback Pin Bias Current
(Note 3) 0.03 2µA
D
MAX
Maximum Duty Cycle V
IN
=3V 85 90 %
I
LSw1
Sw1 Pin Leakage Current (Note
3)
V
Sw1
= 3.6V, Not Switching 0.002 2µA
I
LSw2
Sw2 Pin Leakage Current (Note
3)
V
Sw2
= 3.6V, Not Switching 0.001 1µA
I
LOVP
Ovp Pin Leakage Current (Note
3)
V
Ovp
= 3.6V, Not Switching 2nA
R
Sw2
Sw2 Pin Switch Resistance I
Sw2
=50mA 8 10 Ω
TC(R
Sw2
)R
Sw2
Temperature Coefficient 0.5 %/C
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not apply when
operating the device outside of its rated operating conditions.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
LM3557
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Electrical Characteristics (Notes 6, 8) Limits in standard typeface are for T
J
= 25˚C. Limits in bold typeface
apply over the full operating junction temperature range (−40˚C ≤T
J
≤+125˚C). Unless otherwise specified: V
IN
=
3.6V. (Continued)
Note 3: Current flows into the pin.
Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,
and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is
calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature.
Note 5: The on threshold indicates that the LM3557 is no longer switching or regulating LED current, while the off threshold indicates normal operation.
Note 6: All voltages are with respect to the potential at the GND pin.
Note 7: Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC
standard JESD51-7. The test board is a 4 layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm witha2x1array of thermal vias. The ground plane on the board
is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5 oz/1 oz/1 oz/1.5 oz). Ambient temperature in simulation is 22˚C, still air. Power
dissipation is 1W.
In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues. For more information on these topics, please
refer to Application Note 1187: Leadless Leadframe Package (LLP) and the Layout Guidelines section of this datasheet.
Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 9: Feedback pin voltage is with respect to the voltage at the Sw2 pin.
Note 10: The Power Switch Current Limit is tested in open loop configuration. For closed loop application current limit please see the Current Limit vs Temperature
performance graph.
Block Diagram
Operation
The LM3557 is a current-mode controlled constant-
frequency step-up converter optimized for the facilitation of
white LED driving/current biasing.
The LM3557’s operation can be best understood by the
following device functionality explanation. For the following
device functionality explanation, the block diagram in Figure
2serves as a functional schematic representation of the
underlying circuit blocks that make up the LM3557. When
the feedback voltage falls below, or rises above, the internal
reference voltage, the error amplifier outputs a signal that is
translated into the correct amount of stored energy within the
inductor that is required to put the feedback voltage back into
20131603
FIGURE 2. Block Diagram
LM3557
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Operation (Continued)
regulation when the stored inductor energy is then trans-
ferred to the load. The aforementioned translation is a con-
version of the error amplifier’s output signal to the proper
on-time duration of the N1 power field effect transistor (FET).
This conversion allows the inductor’s stored energy to in-
crease, or decrease, to a sufficient level that when trans-
ferred to the load will bring the feedback voltage back into
regulation.
An increase in inductor current corresponds to an increase in
the amount of stored energy within the inductor. Conversely,
a decrease in inductor current corresponds to a decrease in
the amount of stored energy. The inductor’s stored energy is
released, or transferred, to the load when the N1 power FET
is turned off. The transferred inductor energy replenishes the
output capacitor and keeps the white LED current regulated
at the designated magnitude that is based on the choice of
the R2 resistor. When the N1 power FET is turned on, the
energy stored within the inductor begins to increase while
the output capacitor discharges through the series string of
white LEDs, the R2 resistance, and N2 FET switch to
ground. Therefore, each switching cycle consist of some
amount of energy being stored in the inductor that is then
released, or transferred, to the load to keep the voltage at
the feedback pin in regulation at 510 mV above the Sw2 pin
voltage.
Features:
CYCLE-BY-CYCLE CURRENT LIMIT
The current through the internal power FET (Figure 2: N1) is
monitored to prevent peak inductor currents from damaging
the part. If during a cycle (cycle = 1/switching frequency) the
peak inductor current exceeds the current limit rating for the
LM3557, the internal power FET would be forcibly turned off
for the remaining duration of that cycle.
OVER-VOLTAGE PROTECTION
When the output voltage exceeds the over-voltage protec-
tion (OVP) threshold, the LM3557’s internal power FET will
be forcibly turned off until the output voltage falls below the
over-voltage protection threshold minus the 500 mV hyster-
esis of the internal OVP circuitry.
UNDER-VOLTAGE PROTECTION
When the input voltage falls below the under-voltage protec-
tion (UVP) threshold, the LM3557’s internal power FET will
be forcibly turned off until the input voltage is above the
designated under-voltage protection threshold plus the
100 mV hysteresis of the internal UVP circuitry.
TRUE SHUTDOWN
When the LM3557 is put into shutdown mode operation
there are no DC current paths to ground. The internal FET
(Figure 2: N2) at the Sw2 pin turns off, leaving the white LED
string open circuited.
THERMAL SHUTDOWN
When the internal semiconductor junction temperature
reaches approximately 150˚C, the LM3557’s internal power
FET (Figure 2: N1) will be forcibly turned off.
Typical Performance Characteristics ( Circuit in Figure 1: L = DO1608C-223, D = SS16, and LED =
LWT67C. Efficiency: η=P
OUT
/P
IN
= [(V
OUT
–V
Fb
)*I
OUT
]/[V
IN
*I
IN
]. T
A
= 25˚C, unless otherwise stated).
I
Q
(SWITCHING) vs TEMPERATURE SWITCHING FREQUENCY vs TEMPERATURE
20131604 20131605
LM3557
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Typical Performance Characteristics ( Circuit in Figure 1: L = DO1608C-223, D = SS16, and LED =
LWT67C. Efficiency: η=P
OUT
/P
IN
= [(V
OUT
–V
Fb
)*I
OUT
]/[V
IN
*I
IN
]. T
A
= 25˚C, unless otherwise stated). (Continued)
En PIN CURRENT vs En PIN VOLTAGE CURRENT LIMIT vs TEMPERATURE
20131608
20131609
OVP PIN CURRENT vs TEMPERATURE R
DS(ON)
(Figure 2: N1) vs TEMPERATURE
20131610 20131611
R
Sw2
(Figure 2: N2) vs TEMPERATURE ENABLE THRESHOLD vs TEMPERATURE
20131612 20131613
LM3557
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Application Information
WHITE LED CURRENT SETTING
For backlighting applications, the white LED current is pro-
grammed by the careful choice of the R2 resistor.
Backlight:
V
En
≥0.9V
20131617
I
LED
: White LED Current.
V
Fb-Sw2
: Feedback Voltage.
R2: Resistor.
The feedback voltage is with respect to the voltage at the
Sw2 pin, not ground. For example, if the voltage on the Sw2
pin were 0.1V then the voltage at the Fb pin would be 0.61V
(typical).
ADJUSTING LED CURRENT USING PWM SIGNAL
The LED current can be controlled using a PWM signal on
the EN pin with frequencies in the range of 100Hz (greater
than visible frequency spectrum) to 1kHz. For controlling
LED currents down to the µA levels, it is best to use a PWM
signal frequency between 200-500Hz. The LM3557 LED
current can be controlled with PWM signal frequencies
above 1kHz but the controllable current decreases with
higher frequency.
ADJUSTING OVER-VOLTAGE PROTECTION
If the over-voltage protection (OVP) threshold is too low for a
particular application, a resistor divider circuit can be used to
adjust the OVP threshold of a given application. Instead of
having the Ovp pin connected to the output voltage, it can be
adjusted through a resistor divider circuit to only experience
a fraction of the output voltage magnitude. The resistor
divider circuit bias current should be at least 100 times
greater than the Ovp pin bias current. Using Figure 3, the
following equation can be used to adjust the output voltage:
20131618
V
OVP
: OVP Voltage Threshold.
V
OUT
: Maximum Output Voltage (<35V).
R3: Resistor.
R4: Resistor.
20131616
FIGURE 3. Programmable Output Voltage
LM3557
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Application Information (Continued)
CONTINUOUS AND DISCONTINUOUS MODES OF
OPERATION
Since the LM3557 is a constant frequency pulse-width-
modulated step-up regulator, care must be taken to make
sure the maximum duty cycle specification is not violated.
The duty cycle equation depends on which mode of opera-
tion the LM3557 is in. The two operational modes of the
LM3557 are continuous conduction mode (CCM) and dis-
continuous conduction mode (DCM). Continuous conduction
mode refers to the mode of operation where during the
switching cycle, the inductor’s current never goes to and
stays at zero for any significant amount of time during the
switching cycle. Discontinuous conduction mode refers to
the mode of operation where during the switching cycle, the
inductor’s current goes to and stays at zero for a significant
amount of time during the switching cycle. Figure 4 illus-
trates the threshold between CCM and DCM operation. In
Figure 4, the inductor current is right on the CCM/DCM
operational threshold. Using this as a reference, a factor can
be introduced to calculate when a particular application is in
CCM or DCM operation. R is a CCM/DCM factor we can use
to compute which mode of operation a particular application
is in. If R is ≥1, then the application is operating in CCM.
Conversely, if R is <1, the application is operating in DCM.
The R factor inequalities are a result of the components that
make up the R factor. From Figure 4, the R factor is equal to
the average inductor current, I
L
(avg), divided by half the
inductor ripple current, ∆i
L
. Using Figure 4, the following
equation can be used to compute R factor:
20131620
20131621
20131622
20131623
V
IN
: Input Voltage.
V
OUT
: Output Voltage.
Eff: Efficiency of the LM3557.
Fs: Switching Frequency.
I
OUT
: White LED Current/Load Current.
L: Inductance Magnitude/Inductor Value.
D: Duty Cycle for CCM operation.
∆i
L
: Inductor Ripple Current.
I
L
(avg): Average Inductor Current.
For CCM operation, the duty cycle can be computed with:
20131624
20131625
t
ON
: Internal Power FET On-Time.
T
S
: Switching Period of Operation.
D: Duty Cycle for CCM Operation.
V
OUT
: Output Voltage.
V
IN
: Input Voltage.
For DCM operation, the duty cycle can be computed with:
20131619
FIGURE 4. Inductor Current Waveform
LM3557
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Application Information (Continued)
20131626
20131627
t
ON
: Internal Power FET On-Time.
T
S
: Switching Period of Operation.
D: Duty Cycle for DCM Operation.
V
OUT
: Output Voltage.
V
IN
: Input Voltage.
I
OUT
: White LED Current/Load Current.
Fs: Switching Frequency.
Eff: Efficiency of the LM3557.
L: Inductor Value/Inductance Magnitude.
INDUCTOR SELECTION
In order to maintain inductance, an inductor used with the
LM3557 should have a saturation current rating larger than
the peak inductor current of the particular application. Induc-
tors with low DCR values contribute decreased power losses
and increased efficiency. The peak inductor current can be
computed for both modes of operation: CCM (continuous
current mode) and DCM (discontinuous current mode).
The cycle-by-cycle peak inductor current for CCM operation
can be computed with:
20131628
20131629
V
IN
: Input Voltage.
Eff: Efficiency of the LM3557.
Fs: Switching Frequency.
I
OUT
: White LED Current/Load Current.
L: Inductance Magnitude/Inductor Value.
D: Duty Cycle for CCM Operation.
I
Peak
: Peak Inductor Current.
∆i
L
: Inductor Ripple Current.
I
L
(avg): Average Inductor Current.
The cycle-by-cycle peak inductor current for DCM operation
can be computed with:
20131630
V
IN
: Input Voltage.
Fs: Switching Frequency.
L: Inductance Magnitude/Inductor Value.
D: Duty Cycle for DCM Operation.
I
Peak
: Peak Inductor Current.
Some recommended inductor manufacturers are as follows:
Coilcraft [www.coilcraft.com]
Coiltronics [www.cooperet.com]
TDK [www.tdk.com]
CAPACITOR SELECTION
Multilayer ceramic capacitors are the best choice for use
with the LM3557. Multilayer ceramic capacitors have the
lowest equivalent series resistance (ESR). Applied voltage
or DC bias, temperature, dielectric material type (X7R, X5R,
Y5V, etc), and manufacturer component tolerance have an
affect on the true or effective capacitance of a ceramic
capacitor. Be aware of how your application will affect a
particular ceramic capacitor by analyzing the aforemen-
tioned factors of your application. Before selecting a capaci-
tor always consult the capacitor manufacturer’s data curves
to verify the effective or true capacitance of the capacitor in
your application.
INPUT CAPACITOR SELECTION
The input capacitor serves as an energy reservoir for the
inductor. In addition to acting as an energy reservoir for the
inductor the input capacitor is necessary for the reduction in
input voltage ripple and noise experienced by the LM3557.
The reduction in input voltage ripple and noise helps ensure
the LM3557’s proper operation, and reduces the effect of the
LM3557 on other devices sharing the same supply voltage.
To ensure low input voltage ripple, the input capacitor must
have an extremely low ESR. As a result of the low input
voltage ripple requirement multilayer ceramic capacitors are
the best choice. A minimum capacitance of 2.0 µF is required
for normal operation, consult the capacitor manufacturer’s
data curves to verify whether the minimum capacitance re-
quirement is going to be achieved for a particular application.
OUTPUT CAPACITOR SELECTION
The output capacitor serves as an energy reservoir for the
white LED load when the internal power FET switch (Figure
2: N1) is ON or conducting current. The requirements for the
output capacitor must include worst case operation such as
when the load opens up and the LM3557 operates in over-
voltage protection (OVP) mode operation. A minimum ca-
pacitance of 0.5 µF is required to ensure normal operation.
Consult the capacitor manufacturer’s data curves to verify
whether the minimum capacitance requirement is going to
be achieved for a particular application.
Some recommended capacitor manufacturers are as fol-
lows:
TDK
[www.tdk.com]
Murata
[www.murata.com]
Vishay
[www.vishay.com]
DIODE SELECTION
To maintain high efficiency it is recommended that the aver-
age current rating (I
F
or I
O
) of the selected diode should be
larger than the peak inductor current (I
Lpeak
). To maintain
diode integrity the peak repetitive forward current (I
FRM
)
must be greater than or equal to the peak inductor current
(I
Lpeak
). Diodes with low forward voltage ratings (V
F
) and low
LM3557
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Application Information (Continued)
junction capacitance magnitudes (C
J
or C
T
or C
D
) are con-
ducive to high efficiency. The chosen diode must have a
reverse breakdown voltage rating (V
R
and/or V
RRM
) that is
larger than the output voltage (V
OUT
). No matter what type of
diode is chosen, Schottky or not, certain selection criteria
must be followed:
1. V
R
and V
RRM
>V
OUT
2. I
F
or I
O
≥I
LOAD
or I
OUT
3. I
FRM
≥I
Lpeak
Some recommended diode manufacturers are as follows:
Vishay [www.vishay.com]
Diodes, Inc [www.diodes.com]
On Semiconductor [www.onsemi.com]
LAYOUT CONSIDERATIONS
All components, except for the white LEDs, must be placed
as close as possible to the LM3557. The die attach pad
(DAP) must be soldered to the ground plane.
The input capacitor, Cin, must be placed close to the
LM3557. Placing Cin close to the device will reduce the
metal trace resistance effect on input voltage ripple. The
feedback current setting resistor R2 must be placed close to
the Fb and Sw2 pins. The output capacitor, Cout, must be
placed close to the Ovp and Gnd pin connections. Trace
connections to the inductor should be short and wide to
reduce power dissipation, increase overall efficiency, and
reduce EMI radiation. The diode, like the inductor, should
have trace connections that are short and wide to reduce
power dissipation and increase overall efficiency. For more
details regarding layout guidelines for switching regulators
refer to Applications Note AN-1149.
LM3557
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Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead Thin Leadless Leadframe Package
NS Package Number SDA08A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
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LM3557 Step-Up Converter for White LED Applications
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