- 1 -
M393A4K40BB0
Rev. 1.91, May. 2017
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datasheet
M393A2K40BB0
M393A4K40BB1
M393A2K40BB1
M393A1K43BB0
M393A1K43BB1
M393A2K40BB2
M393A4K40BB2
288pin Registered DIMM
based on 8Gb B-die
78FBGA with Lead-Free & Halogen-Free
(RoHS compliant)
- 2 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
Revision History
Revision No. History Draft Date Remark Editor
1.0 - First SPEC Release Nov. 2014 - J.Y.Lee
1.1 - Change of Part Number (Speed bin "RC") Jan. 2015 - J.Y.Lee
1.2 - Addition of VDDSPD tolerance on page 8 Mar. 2015 - J.Y.Lee
1.3 - Addition of IDD value (M393A2K40BB0-CPB, M393A2K40BB1-CRC,
M393A4K40BB1-CRC) on page 25 Apr. 2015 - J.Y.Lee
1.4 - Change of IDD 16th Dec. 2015 - J.Y.Lee
1.5 - Addition of Module line up (8GB) 3rd Feb. 2016 - J.Y.Lee
- Change of Physical Dimensions (Module Thickness)
1.6 - Addition of DDR4-2666 7th Apr. 2016 - J.Y.Lee
1.7 - Addition of IDD value on page 26~27
(M393A1K43BB1-CTD, M393A2K40BB2-CTD, M393A4K40BB2-CTD) 20th Sep. 2016 - J.Y.Lee
1.8 - Change of Physical Dimensions (32GB) on page 45~47 4th Oct. 2016 - J.Y.Lee
1.81 - Correction of Typo 17th Mar. 2017 - J.Y.Lee
1.9 - Change Physical dimension. 12th May, 2017 Final J.Y.Bae
1. Add hole for M393A4K40BB1 and M393A4K40BB2.
2. Remove RCD and SPD of back side dimension for M393A4K40BB0.
1.91 - Add revision history for 1.5version. 19th May, 2017 Final J.Y.Bae
"Change of Physical Dimensions (Module Thickness)"
- 3 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
Table Of Contents
288pin Registered DIMM based on 8Gb B-die
1. DDR4 Registered DIMM Ordering Information ............................................................................................................. 4
2. Key Features................................................................................................................................................................. 4
3. Address Configuration .................................................................................................................................................. 4
4. Registered DIMM Pin Configurations (Front side/Back side)........................................................................................ 5
5. Pin Description ............................................................................................................................................................. 6
6. ON DIMM Thermal Sensor ........................................................................................................................................... 6
7. Input/Output Functional Description.............................................................................................................................. 7
8. Registering Clock Driver Specification.......................................................................................................................... 9
8.1 Timing & Capacitance Values ................................................................................................................................. 9
8.2 Clock Driver Characteristics .................................................................................................................................... 9
9. Function Block Diagram:............................................................................................................................................... 10
9.1 8GB, 1Gx72 Module (Populated as 1 rank of x8 DDR4 SDRAMs) ......................................................................... 10
9.2 16GB, 2Gx72 Module (Populated as 1 rank of x4 DDR4 SDRAMs) ....................................................................... 11
9.3 32GB, 4Gx72 Module (Populated as 2 ranks of x4 DDR4 SDRAMs) ..................................................................... 12
10. Absolute Maximum Ratings ........................................................................................................................................ 14
10.1 Absolute Maximum DC Ratings............................................................................................................................. 14
11. AC & DC Operating Conditions................................................................................................................................... 14
11.1 Recommended DC Operating Conditions ............................................................................................................. 14
12. AC & DC Input Measurement Levels .......................................................................................................................... 15
12.1 AC & DC Logic Input Levels for Single-Ended Signals ......................................................................................... 15
12.2 AC and DC Input Measurement Levels : VREF Tolerances.................................................................................. 15
12.3 AC and DC Logic Input Levels for Differential Signals .......................................................................................... 16
12.3.1. Differential Signals Definition ......................................................................................................................... 16
12.3.2. Differential Swing Requirements for Clock (CK_t - CK_c) ............................................................................. 16
12.3.3. Single-ended Requirements for Differential Signals ...................................................................................... 17
12.4 Slew Rate Definitions ............................................................................................................................................ 18
12.4.1. Slew Rate Definitions for Differential Input Signals ( CK ) ............................................................................. 18
12.5 Differential Input Cross Point Voltage.................................................................................................................... 19
12.6 Single-ended AC & DC Output Levels................................................................................................................... 20
12.7 Differential AC & DC Output Levels....................................................................................................................... 20
12.8 Single-ended Output Slew Rate ............................................................................................................................ 20
12.9 Differential Output Slew Rate ................................................................................................................................ 21
12.10 Single-ended AC & DC Output Levels of Connectivity Test Mode ...................................................................... 22
12.11 Test Load for Connectivity Test Mode Timing ..................................................................................................... 22
13. DIMM IDD Specification Definition.............................................................................................................................. 23
14. IDD SPEC Table ......................................................................................................................................................... 26
15. Input/Output Capacitance ........................................................................................................................................... 30
16. Electrical Characterisitics and AC Timing ................................................................................................................... 31
16.1 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ................................................................ 31
16.2 Speed Bin Table Note ........................................................................................................................................... 36
17. Timing Parameters by Speed Grade .......................................................................................................................... 37
18. Physical Dimensions................................................................................................................................................... 43
18.1 1Gx8 based 1Gx72 Module (1 Rank) - M393A1K43BB0 ...................................................................................... 43
18.1.1. x72 DIMM, populated as one physical rank of x8 DDR4 SDRAMs................................................................ 43
18.2 1Gx8 based 1Gx72 Module (1 Rank) - M393A1K43BB1 ...................................................................................... 44
18.2.1. x72 DIMM, populated as one physical rank of x8 DDR4 SDRAMs................................................................ 44
18.3 2Gx4 based 2Gx72 Module (1 Rank) - M393A2K40BB0/M393A2K40BB1/M393A2K40BB2 ............................... 45
18.3.1. 2Gx72 DIMM, populated as one physical rank of x4 DDR4 SDRAMs ........................................................... 45
18.4 2Gx4 based 4Gx72 Module (2 Ranks) - M393A4K40BB0 .................................................................................... 46
18.4.1. 4Gx72 DIMM, populated as two physical ranks of x4 DDR4 SDRAMs.......................................................... 46
18.5 2Gx4 based 4Gx72 Module (2 Ranks) - M393A4K40BB1 .................................................................................... 47
18.5.1. 4Gx72 DIMM, populated as two physical ranks of x4 DDR4 SDRAMs.......................................................... 47
18.6 2Gx4 based 4Gx72 Module (2 Ranks) - M393A4K40BB2 .................................................................................... 48
18.6.1. 4Gx72 DIMM, populated as two physical ranks of x4 DDR4 SDRAMs.......................................................... 48
- 4 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
1. DDR4 Registered DIMM Ordering Information
NOTE :
1. "##" - PB/RC/TD
2. PB(2133Mbps 15-15-15)/RC(2400Mbps 17-17-17)/TD(2666Mbps 19-19-19)
- DDR4-2666(19-19-19) is backward compatible to DDR4-2400(17-17-17)
2. Key Features
• JEDEC standard 1.2V ± 0.06V Power Supply
•V
DDQ = 1.2V ± 0.06V
• 800 MHz fCK for 1600Mb/sec/pin,933 MHz fCK for 1866Mb/sec/pin, 1067MHz fCK for 2133Mb/sec/pin,1200MHz fCK for 2400Mb/sec/pin, 1333MHz
fCK for 2666Mb/sec/pin
• 16 Banks (4 Bank Groups)
• Programmable CAS Latency: 10,11,12,13,14,15,16,17,18,19,20
• Programmable Additive Latency (Posted CAS): 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency (CWL) = 9,11 (DDR4-1600), 10,12 (DDR4-1866), 11,14 (DDR4-2133), 12,16 (DDR4-2400) and 14,18 (DDR4-
2666)
• Burst Length: 8, 4 with tCCD = 4 which does not allow seamless read or write [either On the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower then TCASE 85C, 3.9us at 85C < TCASE 95C
• Asynchronous Reset
3. Address Configuration
Part Number2Density Organization Component Composition1Number of
Rank Height
M393A1K43BB0-CPB/RC
M393A1K43BB1-CTD 8GB 1Gx72 1Gx8(K4A8G085WB-BC##)*9 1 31.25mm
M393A2K40BB0-CPB
M393A2K40BB1-CRC
M393A2K40BB2-CTD
16GB 2Gx72 2Gx4(K4A8G045WB-BC##)*18 1 31.25mm
M393A4K40BB0-CPB
M393A4K40BB1-CRC
M393A4K40BB2-CTD
32GB 4Gx72 2Gx4(K4A8G045WB-BC##)*36 2 31.25mm
Speed DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666 Unit
11-11-11 13-13-13 15-15-15 17-17-17 19-19-19
tCK(min) 1.25 1.071 0.937 0.833 0.75 ns
CAS Latency 11 13 15 17 19 nCK
tRCD(min) 13.75 13.92 14.06 14.16 14.25 ns
tRP(min) 13.75 13.92 14.06 14.16 14.25 ns
tRAS(min) 35 34 33 32 32 ns
tRC(min) 48.75 47.92 47.06 46.16 46.25 ns
Organization Row Address Column Address Bank Group Address Bank Address Auto Precharge
2Gx4(8Gb) based Module A0-A16 A0-A9 BG0-BG1 BA0-BA1 A10/AP
- 5 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
4. Registered DIMM Pin Configurations (Front side/Back side)
NOTE:
1. VPP is 2.5V DC
2. Pin 230 is defined as NC for UDIMMs, RDIMMs and LRDIMMs. Pin 230 is defined as SAVE_n for NVDIMMs.
3. Pins 1 and 145 are defined as NC for UDIMMs, RDIMMs and LRDIMMs. Pins 1 and 145 are defined as 12V for Hybrid /NVDIMM
4. The 5th VPP is required on all modules. DIMMs.
Pin Front Pin Back Pin Front Pin Back Pin Front Pin Back Pin Front Pin Back
112V3,NC 145 12V3,NC 40 TDQS12_t,
DQS12_t 184 VSS 78 EVENT_n 222 PARITY 117 DQ52 261 VSS
2 VSS 146 VREFCA 41 TDQS12_c,
DQS12_c 185 DQS3_c 79 A0 223 VDD 118 VSS 262 DQ53
3 DQ4 147 VSS 42 VSS 186 DQS3_t 80 VDD 224 BA1 119 DQ48 263 VSS
4 VSS 148 DQ5 43 DQ30 187 VSS 81 BA0 225 A10/AP 120 VSS 264 DQ49
5 DQ0 149 VSS 44 VSS 188 DQ31 82 RAS_n/A16 226 VDD 121 TDQS15_t,
DQS15_t 265 VSS
6 VSS 150 DQ1 45 DQ26 189 VSS 83 VDD 227 RFU 122 TDQS15_c,
DQS15_c 266 DQS6_c
7TDQS9_t,
DQS9_t 151 VSS 46 VSS 190 DQ27 84 S0_n 228 WE_n/A14 123 VSS 267 DQS6_t
8TDQS9_c,
DQS9_c 152 DQS0_c 47 CB4 191 VSS 85 VDD 229 VDD 124 DQ54 268 VSS
9 VSS 153 DQS0_t 48 VSS 192 CB5 86 CAS_n/A15 230 NC 125 VSS 269 DQ55
10 DQ6 154 VSS 49 CB0 193 VSS 87 ODT0 231 VDD 126 DQ50 270 VSS
11 VSS 155 DQ7 50 VSS 194 CB1 88 VDD 232 A13 127 VSS 271 DQ51
12 DQ2 156 VSS 51 TDQS17_t,
DQS17_t 195 VSS 89 S1_n 233 VDD 128 DQ60 272 VSS
13 VSS 157 DQ3 52 TDQS17_c,
DQS17_c 196 DQS8_c 90 VDD 234 A17 129 VSS 273 DQ61
14 DQ12 158 VSS 53 VSS 197 DQS8_t 91 ODT1 235 NC,C2 130 DQ56 274 VSS
15 VSS 159 DQ13 54 CB6 198 VSS 92 VDD 236 VDD 131 VSS 275 DQ57
16 DQ8 160 VSS 55 VSS 199 CB7 93 C0,CS2_n,NC 237 NC,CS3_c,C1 132 TDQS16_t,
DQS16_t 276 VSS
17 VSS 161 DQ9 56 CB2 200 VSS 94 VSS 238 SA2 133 TDQS16_c,
DQS16_c 277 DQS7_c
18 TDQS10_t,
DQS10_t 162 VSS 57 VSS 201 CB3 95 DQ36 239 VSS 134 VSS 278 DQS7_t
19 TDQS10_c,
DQS10_c 163 DQS1_c 58 RESET_n 202 VSS 96 VSS 240 DQ37 135 DQ62 279 VSS
20 VSS 164 DQS1_t 59 VDD 203 CKE1 97 DQ32 241 VSS 136 VSS 280 DQ63
21 DQ14 165 VSS 60 CKE0 204 VDD 98 VSS 242 DQ33 137 DQ58 281 VSS
22 VSS 166 DQ15 61 VDD 205 RFU 99 TDQS13_t,
DQS13_t 243 VSS 138 VSS 282 DQ59
23 DQ10 167 VSS 62 ACT_n 206 VDD 100 TDQS13_c,
DQS13_c 244 DQS4_c 139 SA0 283 VSS
24 VSS 168 DQ11 63 BG0 207 BG1 101 VSS 245 DQS4_t 140 SA1 284 VDDSPD
25 DQ20 169 VSS 64 VDD 208 ALERT_n 102 DQ38 246 VSS 141 SCL 285 SDA
26 VSS 170 DQ21 65 A12/BC_n 209 VDD 103 VSS 247 DQ39 142 VPP 286 VPP
27 DQ16 171 VSS 66 A9 210 A11 104 DQ34 248 VSS 143 VPP 287 VPP
28 VSS 172 DQ17 67 VDD 211 A7 105 VSS 249 DQ35 144 RFU 288 VPP4
29 TDQS11_t,
DQS11_t 173 VSS 68 A8 212 VDD 106 DQ44 250 VSS
30 TDQS11_c,
DQS11_c 174 DQS2_c 69 A6 213 A5 107 VSS 251 DQ45
31 VSS 175 DQS2_t 70 VDD 214 A4 108 DQ40 252 VSS
32 DQ22 176 VSS 71 A3 215 VDD 109 VSS 253 DQ41
33 VSS 177 DQ23 72 A1 216 A2 110 TDQS14_t,
DQS14_t 254 VSS
34 DQ18 178 VSS 73 VDD 217 VDD 111 TDQS14_c,
DQS14_c 255 DQS5_c
35 VSS 179 DQ19 74 CK0_t 218 CK1_t 112 VSS 256 DQS5_t
36 DQ28 180 VSS 75 CK0_c 219 CK1_c 113 DQ46 257 VSS
37 VSS 181 DQ29 76 VDD 220 VDD 114 VSS 258 DQ47
38 DQ24 182 VSS 77 VTT 221 VTT 115 DQ42 259 VSS
39 VSS 183 DQ25 KEY 116 VSS 260 DQ43
- 6 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
5. Pin Description
NOTE :
1. Address A17 is only valid for 16 Gb x4 based SDRAMs.
2. RAS_n is a multiplexed function with A16.
3. CAS_n is a multiplexed function with A15.
4. WE_n is a multiplexed function with A14.
6. ON DIMM Thermal Sensor
NOTE : 1. All Samsung RDIMM support Thermal sensor on DIMM
[ Table 1 ] Temperature Sensor Characteristics
Pin Name Description Pin Name Description
A0–A171Register address input SCL I2C serial bus clock for SPD/TS and register
BA0, BA1 Register bank select input SDA I2C serial bus data line for SPD/TS and register
BG0, BG1 Register bank group select input SA0–SA2 I2C slave address select for SPD/TS and register
RAS_n2Register row address strobe input PAR Register parity input
CAS_n3Register column address strobe input VDD SDRAM core power supply
WE_n4Register write enable input VPP SDRAM activating power supply
CS0_n, CS1_n,
CS2_n, CS3_n DIMM Rank Select Lines input VREFCA SDRAM command/address reference supply
CKE0, CKE1 Register clock enable lines input VSS Power supply return (ground)
ODT0, ODT1 Register on-die termination control lines input VDDSPD Serial SPD/TS positive power supply
ACT_n Register input for activate input ALERT_n Register ALERT_n output
DQ0–DQ63 DIMM memory data bus RESET_n Set Register and SDRAMs to a Known State
CB0–CB7 DIMM ECC check bits EVENT_n SPD signals a thermal event has occurred
DQS0_t–
DQS17_t
Data Buffer data strobes
(positive line of differential pair) VTT SDRAM I/O termination supply
DQS0_c–
DQS17_c
Data Buffer data strobes
(negative line of differential pair) RFU Reserved for future use
CK0_t, CK1_t Register clock input (positive line of differential
pair)
CK0_c, CK1_c Register clocks input (negative line of differential
pair)
Grade Range Temperature Sensor Accuracy Units NOTE
Min. Typ. Max.
B
75 < Ta < 95 - +/- 0.5 +/- 1.0
C
-
40 < Ta < 125 - +/- 1.0 +/- 2.0 -
-20 < Ta < 125 - +/- 2.0 +/- 3.0 -
Resolution 0.25 C /LSB -
Thermal sensor
SA0 SA1 SA2
SCL
1K
EVENT_nEVENT_n
SCL
SDASDA
Serial PD with
SA0 SA1 SA2
VSSZQCAL
SCL
SDA
Register
SA0
SA1
SA2
- 7 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
7. Input/Output Functional Description
Symbol Type Function
CK0_t, CK0_c,
CK1_t, CK1_c Input Clock: CK_t and CK_c are differential clock inputs. All address and control input signals are sampled on the crossing of
the positive edge of CK_t and negative edge of CK_c.
CKE0, CKE1 Input
Clock Enable: CKE HIGH activates and CKE LOW deactivates internal clock signals and device input buffers and
output drivers. Taking CKE LOW provides Precharge Power-Down and Self-Refresh operation (all banks idle), or
Active Power-Down (row Active in any bank). CKE is synchronous for Self-Refresh exit. After VREFCA and Internal
DQ Vref have become stable during the power on and initialization sequence, they must be maintained during all
operations (including Self-Refresh). CKE must be maintained high throughout read and write accesses. Input buffers,
excluding CK_t, CK_c, ODT and CKE, are disabled during power-down. Input buffers, excluding CKE, are disabled
during Self-Refresh.
CS0_n, CS1_n,
CS2_n, CS3_n Input Chip Select: All commands are masked when CS_n is registered HIGH. CS_n provides for external Rank selection.
CS_n is considered part of the command code.
C0, C1, C2 Input Chip ID : Chip ID is only used for 3DS for 2,4,8 high stack via TSV to select each slice of stacked component. Chip ID
is considered part of the command code.
ODT0, ODT1 Input
On Die Termination: ODT (registered HIGH) enables RTT_NOM termination resistance internal to the DDR4 SDRAM.
When enabled, ODT is only applied to each DQ, DQS_t, DQS_c, TDQS_t and TDQS_c signal. The ODT pin will be
ignored if MR1 is programmed to disable RTT_NOM.
ACT_n Input Activation Command Input : ACT_n defines the Activation command being entered along with CS_n. The input into
RAS_n/A16, CAS_n/A15 and WE_n/A14 will be considered as Row Address A16, A15 and A14
RAS_n/A16.
CAS_n/A15.
WE_n/A14
Input
Command Inputs: RAS_n/A16, CAS_n/A15 and WE_n/A14 (along with CS_n) define the command being entered.
Those pins have multi function. For example, for activation with ACT_n Low, these are Addresses like A16, A15 and
A14 but for non-activation command with ACT_n High, these are Command pins for Read, Write and other command
defined in command truth table
BG0 - BG1 Input Bank Group Inputs: BG0 - BG1 define which bank group an Active, Read, Write or Precharge command is being
applied. BG0 also determines which mode register is to be accessed during a MRS cycle.
BA0 - BA1 Input Bank Address Inputs: BA0 - BA1 define to which bank an Active, Read, Write or Precharge command is being applied.
Bank address also determines which mode register is to be accessed during a MRS cycle.
A0 - A17 Input
Address Inputs: Provide the row address for ACTIVATE Commands and the column address for Read/Write
commands to select one location out of the memory array in the respective bank. A10/AP, A12/BC_n, RAS_n/A16,
CAS_n/A15 and WE_n/A14 have additional functions. See other rows. The address inputs also provide the op-code
during Mode Register Set commands. A17 is only defined for 16 Gb x4 SDRAM configurations.
A10 / AP Input
Auto-precharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be
performed to the accessed bank after the Read/Write operation. (HIGH: Autoprecharge; LOW: no Autoprecharge). A10
is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all
banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank addresses.
A12 / BC_n Input Burst Chop: A12/BC_n is sampled during Read and Write commands to determine if burst chop (on-thefly) will be
performed. (HIGH, no burst chop; LOW: burst chopped). See command truth table for details.
RESET_n CMOS
Input
Active Low Asynchronous Reset: Reset is active when RESET_n is LOW, and inactive when RESET_n is HIGH.
RESET_n must be HIGH during normal operation.
DQ Input/
Output
Data Input/ Output: Bi-directional data bus. If CRC is enabled via Mode register then CRC code is added at the end of
Data Burst. Any DQ from DQ0-DQ3 may indicate the internal Vref level during test via Mode Register Setting MR4
A4=High. Refer to vendor specific data sheets to determine which DQ is used.
DQS0_t-DQS17_t,
DQS0_c-DQS17_c
Input/
Output
Data Strobe: output with read data, input with write data. Edge-aligned with read data, centered in write data. The data
strobe DQS_t is paired with differential signals DQS_c, respectively, to provide differential pair signaling to the system
during reads and writes. DDR4 SDRAM supports differential data strobe only and does not support single-ended.
PAR Input
Command and Address Parity Input: DDR4 Supports Even Parity check in SDRAMs with MR setting. Once it’s enabled
via Register in MR5, then SDRAM calculates Parity with ACT_n, RAS_n/A16, CAS_n/A15, WE_n/A14, BG0-BG1,
BA0-BA1, A17-A0. Input parity should be maintained at the rising edge of the clock and at the same time with
command & address with CS_n LOW
ALERT_n Output
(Input)
Alert : It has multi functions such as CRC error flag, Command and Address Parity error flag as Output signal. If there
is error in CRC, then ALERT_n goes LOW for the period time interval and goes back HIGH. If there is error in
Command Address Parity Check, then ALERT_n goes LOW for relatively long period until on going SDRAM internal
recovery transaction is complete. During Connectivity Test mode this pin functions as an input.
Using this signal or not is dependent on the system. If the SDRAM ALERT_n pins are not connected to the ALERT_n
pin on the edge connector is must still be connected to VDD on DIMM.
RFU Reserved for Future Use: No on DIMM electrical connection is present
NC No Connect: No on DIMM electrical connection is present
- 8 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
NOTE :
1. For PC4 VDD is 1.2V. For PC4L VDD is TBD.
Symbol Type Function
VDD1Supply Power Supply: 1.2 V ± 0.06 V
VSS Supply Ground
VTT Supply VDD/2
VPP Supply SDRAM Activating Power Supply: 2.5V ( 2.375V min, 2.75V max)
VDDSPD Supply SPD and register supply voltage. Register requires the nominl volatge to be 2.5V ± 10%.
VREFCA Supply Reference voltage for CA
- 9 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
8. Registering Clock Driver Specification
8.1 Timing & Capacitance Values
Note:
1. This parameter does not include package capacitance
2. Data inputs are DCKE0/1, DODT0/1, DA0..DA17, DBA0..DBA1, DBG0..DBG1, DACT_n, DC0..DC2, DPAR, DCS0/1_n
8.2 Clock Driver Characteristics
Symbol Parameter Conditions DDR4-1600/1866/2133 DDR4-2400/2666 Units Notes
Min Max Min Max
fclock Input Clock Frequency application frequency 625 1080 625 1350 MHz
tCH/tCL Pulse duration, CK_t, CK_c HIGH or
LOW 0.4 - 0.4 - tCK
tACT Inputs active time4 before DRST_n is
taken HIGH
DCKE0/1 = LOW and DCS0/
1_n = HIGH 16 - 16 - tCK
tPDM Propagation delay, single-bit switch-
ing, CK_t/ CK_c to output 1.2V Operation 1 1.3 1 1.3 ns
tDIS output disable time Rising edge of Yn_t to out-
put float
0.5*tCK +
tQSK1(min) -0.5*tCK +
tQSK1(min) -ps
tEN output enable time Output valid to rising edge of
Yn_t
0.5*tCK -
tQSK1(max) -0.5*tCK -
tQSK1(max) -ps
CIInput capacitance, Data inputs NOTE1,2 0.8 1.1 0.8 1.0
pF
CCK Input capacitance, CK_t, CK_c NOTE1,2 0.8 1.1 0.8 1.0
CIR Input capacitance, DRST_n VI=VDD or VSS ;
VDD=1.2V 0.5 2.0 0.5 2.0
Symbol Parameter Conditions
DDR4-1600/1866/
2133 DDR4-2400 DDR4-2666 Units Notes
Min Max Min Max Min Max
tjit (cc) Cycle-to-cycle period jitter CK_t/CK_c stable 0 0.025 x
tCK 00.025 x
tCK 00.025 x
tCK ps
tSTAB Stabilization time - 5 - 5 - 5 us
tCKsk Clock Output skew - 10 - 10 - 10 ps
tjit(per) Yn Clock Period jitter -0.025 *
tCK
0.025 *
tCK
-0.025 *
tCK
0.025 *
tCK
-0.025 *
tCK
0.025 *
tCK ps
tjit(hper) Half period jitter -0.032 *
tCK
0.032 *
tCK
-0.032 *
tCK
0.032 *
tCK
-0.032 *
tCK
0.032 *
tCK ps
tQsk1 Qn Output to clock tolerance -0.125 *
tCK
0.125 *
tCK
-0.125 *
tCK
0.125 *
tCK -0.1 * tCK 0.1 * tCK ps
tdynoff Maximum re-driven dynamic clock
off-set -50-45-45ps
- 10 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
9. Function Block Diagram:
9.1 8GB, 1Gx72 Module (Populated as 1 rank of x8 DDR4 SDRAMs)
DQS_t
DQS_c D0
CKE
ODT
ZQ
DQ[7:0]
CS_n
DQS_t
DQS_c D1
CKE
ODT
ZQ
DQ[7:0]
CS_n
DQS_t
DQS_c D2
CKE
ODT
ZQ
DQ[7:0]
CS_n
DQS_t
DQS_c D3
CKE
ODT
ZQ
DQ[7:0]
CS_n
DQS_t
DQS_c
D4
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c D5
CKE
ODT
ZQ
DQ[7:0]
CS_n
DQS_t
DQS_c D6
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c D7
CKE
ODT
ZQ
DQ[7:0]
CS_n
DQS_t
DQS_c D8
CKE
ODT
ZQ
DQ[7:0]
CS_n
CS0A_n
ODT0A
CKE0A
CS0B_n
ODT0B
CKE0B
VSS VSS VSSVSSVSS
VSS VSSVSSVSS
R
E
G
I
S
T
E
R
BA[1:0]
A[16:0]
PARITY, ACT_n
CKE0
RESET_n
BA1:0]A -> BA[1:0] : SDRAMs D[4:0]
A[16:0]A -> A[16:0] : SDRAMs D[4:0]
PARA -> PAR, ACT_n : SDRAMs D[4:0]
CKE0A -> CKE : SDRAMs D[4:0]
BG[1:0] BG[1:0]A -> BG[1:0] : SDRAMs D[4:0]
BA[1:0]B -> BA[1:0] : SDRAMs D[8:5]
A[16:0]B -> A[16:0] : SDRAMs D[8:5]
PARB -> PAR, ACT_n : SDRAMs D[8:5]
CKE0B -> CKE : SDRAMs D[8:5]
Y1
(_t
, _c) -> CK
1(_t, _c)
: SDRAMs D[4:0]
QRESET_n : All SDRAMs
CK0_c
ODT0
CK0_t Y0
(_t
, _c) -> CK
0(_t, _c)
: SDRAMs D[8:5]
BG[1:0]B -> BG[1:0] : SDRAMs D[8:5]
CK1_c
CK1_t
CS0_n
ODT0A -> ODT : SDRAMs D[4:0]
ODT0B -> ODT : SDRAMs D[8:5]
CS0A_n -> CS_n : SDRAMs D[4:0]
CS0B_n -> CS_n : SDRAMs D[8:5]
V
SS
V
PP
D0 - D8
V
TT
V
DDSPD
Serial PD
V
DD
V
REFCA
NOTE :
1. Unless otherwise noted, resistor values are 15 5%.
2. See the Net Structure diagrams for all resistors associated with the command, address and control bus.
3. ZQ resistors are 240 1% . For all other resistor values refer to the appropriate wiring diagram.
D0 - D8
D0 - D8
D0 - D8
DQS0_t
DQS0_c
DQ[7:0]
DQS1_t
DQS1_c
DQ[15:8]
DQS2_t
DQS2_c
DQ[23:16]
DQS3_t
DQS3_c
DQ[31:24]
DQS8_t
DQS8_c
CB[7:0]
DQS4_t
DQS4_c
DQ[39:32]
DQS5_t
DQS5_c
DQ[47:40]
DQS6_t
DQS6_c
DQ[55:48]
DQS7_t
DQS7_c
DQ[63:56]
DBI_n/DM_nDBI0_n/DM0_n
DBI_n/DM_nDBI1_n/DM1_n
DBI_n/DM_nDBI2_n/DM2_n
DBI_n/DM_nDBI3_n/DM3_n
DBI_n/DM_nDBI8_n/DM8_n
DBI_n/DM_nDBI4_n/DM4_n
DBI_n/DM_nDBI5_n/DM5_n
DBI_n/DM_nDBI6_n/DM6_n
DBI_n/DM_nDBI7_n/DM7_n
Thermal sensor
SA0 SA1 SA2
SCL
1K
EVENT_nEVENT_n
SCL
SDASDA
Serial PD with
SA0 SA1 SA2
VSSZQCAL
SCL
SDA
Register
SA0
SA1
SA2
- 11 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
9.2 16GB, 2Gx72 Module (Populated as 1 rank of x4 DDR4 SDRAMs)
DQS0_t
DQS0_c
DQ[3:0]
DQS_t
DQS_c
D1
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS1_t
DQS1_c
DQ[11:8]
DQS_t
DQS_c
D2
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS2_t
DQS2_c
DQ[19:16]
DQS_t
DQS_c
D3
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS3_t
DQS3_c
DQ[27:24]
DQS_t
DQS_c
D4
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS8_t
DQS8_c
CB[3:0]
DQS_t
DQS_c
D5
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D6
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D7
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D8
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D9
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D10
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D15
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D16
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D17
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS_t
DQS_c
D18
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS4_t
DQS4_c
DQ[35:32]
DQS_t
DQS_c
D11
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS5_t
DQS5_c
DQ[43:40]
DQS_t
DQS_c
D12
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS6_t
DQS6_c
DQ[51:48]
DQS_t
DQS_c
D13
CKE
ODT
ZQ
DQ[3:0]
CS_n
DQS7_t
DQS7_c
DQ[59:56]
DQS_t
DQS_c
D14
CKE
ODT
ZQ
DQ[3:0]
CS_n
QACS0_n
QAODT0
QACKE0
QBCS0_n
QBODT0
QBCKE0
VSS VSS VSSVSSVSS
VSS VSS VSSVSSVSS
VSS VSSVSSVSS
VSS VSSVSSVSS
R
E
G
I
S
T
E
R
BA[1:0]
A[17:0]
ACT_n
PARITY
CKE0
RESET_n
QABA[1:0] -> BA[1:0] : SDRAMs D[10:1]
QAA[17:0] -> A[17:0] : SDRAMs D[10:1]
QAACT_n -> ACT_n : SDRAMs D[10:1]
QACKE0 -> CKE : SDRAMs D[10:1]
BG[1:0] QABG[1:0] -> BG[1:0] : SDRAMs D[10:1]
QBBA[1:0] -> BA[1:0] : SDRAMs D[18:11]
QBA[17:0] -> A[17:0] : SDRAMs D[18:11]
QBACT_n -> ACT_n : SDRAMs D[18:11]
QAPAR -> PAR : SDRAMs D[10:1]
QBPAR -> PAR : SDRAMs D[18:11]
QBCKE0 -> CKE : SDRAMs D[18:11]
Y0_c -> CK_c : SDRAMs D[18:11]
Y1_c -> CK_c : SDRAMs D[10:1]
QRST_n -> RESET_n : All SDRAMs
CK0_c
ODT0
CK0_t Y0
_t
-> CK
_t
: SDRAMs D[18:11]
Y1
_t
-> CK
_t
: SDRAMs D[10:1]
QBBG[1:0] -> BG[1:0] : SDRAMs D[18:11]
CK1_c
CK1_t
CS0_n
ALERT_n ERROR_IN_n -> ALERT_n : All SDRAMs
QAODT0 -> ODT : SDRAMs D[10:1]
QBODT0 -> ODT : SDRAMs D[18:11]
QACS0_n -> CS_n : SDRAMs D[10:1]
QBCS0_n -> CS_n : SDRAMs D[18:11]
V
SS
V
PP
D1 - D18
V
TT
V
DDSPD
Serial PD
V
DD
V
REFCA
NOTE :
1. Unless otherwise noted, resistor values are 15 5%.
2. See the Net Structure diagrams for all resistors associated with the command, address and control bus.
3. ZQ resistors are 240 1% . For all other resistor values refer to the appropriate wiring diagram.
Thermal sensor
SA0 SA1 SA2
SCL
1K
EVENT_nEVENT_n
SCL
SDASDA
Serial PD with
SA0 SA1 SA2
VSSZQCAL
SCL
SDA
Register
SA0
SA1
SA2
D1 - D18
D1 - D18
D1 - D18
DQS9_t
DQS9_c
DQ[7:4]
DQS10_t
DQS10_c
DQ[15:12]
DQS11_t
DQS11_c
DQ[23:20]
DQS12_t
DQS12_c
DQ[31:28]
DQS17_t
DQS17_c
CB[7:4]
DQS13_t
DQS13_c
DQ[39:36]
DQS14_t
DQS14_c
DQ[47:44]
DQS15_t
DQS15_c
DQ[55:52]
DQS16_t
DQS16_c
DQ[63:60]
- 12 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
9.3 32GB, 4Gx72 Module (Populated as 2 ranks of x4 DDR4 SDRAMs)
DQS0_t
DQS0_c
DQ[3:0]
DQS_t
DQS_c
D6
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS1_t
DQS1_c
DQ[11:8]
DQS_t
DQS_c
D7
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS2_t
DQS2_c
DQ[19:16]
DQS_t
DQS_c
D8
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS3_t
DQS3_c
DQ[27:24]
DQS_t
DQS_c
D9
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D16
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D17
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D18
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D19
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D11
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D12
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D13
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D14
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS9_t
DQS9_c
DQ[7:4]
DQS_t
DQS_c
D1
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS10_t
DQS10_c
DQ[15:12]
DQS_t
DQS_c
D2
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS11_t
DQS11_c
DQ[23:20]
DQS_t
DQS_c
D3
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS12_t
DQS12_c
DQ[31:28]
DQS_t
DQS_c
D4
CKE
ODT
ZQ
DQ[3:0]
CS
_n
QACS0
_n
QAODT0
QACKE0
VSS VSSVSSVSS
VSS VSSVSSVSS
VSS VSSVSSVSS
VSS VSSVSSVSS
NOTE :
1. Unless otherwise noted, resistor values are 15 5%.
2. See the Net Structure diagrams for all resistors associated with the command, address and control bus.
3. ZQ resistors are 240 1% . For all other resistor values refer to the appropriate wiring diagram.
Thermal sensor
SA0 SA1 SA2
SCL
1K
EVENT_nEVENT_n
SCL
SDASDA
Serial PD with
SA0 SA1 SA2
VSSZQCAL
SCL
SDA
Register
SA0
SA1
SA2
QACS1
_n
QAODT1
QACKE1
DQS8_t
DQS8_c
CB[3:0]
DQS_t
DQS_c
D10
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D20
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D15
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS17_t
DQS17_c
CB[7:4]
DQS_t
DQS_c
D5
CKE
ODT
ZQ
DQ[3:0]
CS
_n
VSS
VSS
VSS
VSS
V
SS
V
PP
D1 - D36
V
TT
V
DDSPD
Serial PD
V
DD
V
REFCA
D1 - D36
D1 - D36
D1 - D36
- 13 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
DQS4_t
DQS4_c
DQ[35:32]
DQS_t
DQS_c
D25
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS5_t
DQS5_c
DQ[43:40]
DQS_t
DQS_c
D26
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS6_t
DQS6_c
DQ[51:48]
DQS_t
DQS_c
D27
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS7_t
DQS7_c
DQ[59:56]
DQS_t
DQS_c
D28
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D33
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D34
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D35
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D36
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D29
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D30
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D31
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS_t
DQS_c
D32
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS13_t
DQS13_c
DQ[39:36]
DQS_t
DQS_c
D21
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS14_t
DQS14_c
DQ[47:44]
DQS_t
DQS_c
D22
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS15_t
DQS15_c
DQ[55:52]
DQS_t
DQS_c
D23
CKE
ODT
ZQ
DQ[3:0]
CS
_n
DQS16_t
DQS16_c
DQ[63:60]
DQS_t
DQS_c
D24
CKE
ODT
ZQ
DQ[3:0]
CS
_n
QBCS0_n
QBODT0
QBCKE0
VSS VSSVSSVSS
VSS VSSVSSVSS
VSS VSSVSSVSS
VSS VSSVSSVSS
QBCS1_n
QBODT1
QBCKE1
R
E
G
I
S
T
E
R
BA[1:0]
A[17:0]
ACT
_n
C[2:0]
PARITY
CKE0
CKE1
RESET
_n
QABA[1:0] -> BA[1:0] : SDRAMs D[20:1]
QAA[17:0] -> A[17:0] : SDRAMs D[20:1]
QAACT_n -> ACT_n : SDRAMs D[20:1]
QAC[2:0] -> C[2:0] : SDRAMs D[20:1]
QACKE0 -> CKE : SDRAMs D[10:1]
BG[1:0] QABG[1:0] -> BG[1:0] : SDRAMs D[20:1]
QBBA[1:0] -> BA[1:0] : SDRAMs D[36:21]
QBA[17:0] -> A[17:0] : SDRAMs D[36:21]
QBACT_n -> ACT_n : SDRAMs D[36:21]
QBC[2:0] -> C[2:0] : SDRAMs D[36:21]
QAPAR -> PAR : SDRAMs D[20:1]
QBPAR -> PAR : SDRAMs D[36:21]
QBCKE0 -> CKE : SDRAMs D[28:21]
Y0
_c
-> CK
_c
: SDRAMs D[24:21], D[32:29]
Y1
_c
-> CK
_c
: SDRAMs D[5:1], D[15:11]
QRST
_n
-> RESET
_n
: All SDRAMs
CK0
_c
ODT0
QACKE1 -> CKE : SDRAMs D[20:11]
QBCKE1 -> CKE : SDRAMs D[36:29]
CK0
_t
Y0
_t
-> CK
_t
: SDRAMs D[24:21], D[32:29]
Y1
_t
-> CK
_t
: SDRAMs D[5:1], D[15:11]
QBBG[1:0] -> BG[1:0] : SDRAMs D[36:21]
CK
1
_c
CK1
_t
ODT1
CS0
_n
CS1
_n
ALERT
_n
ERROR_IN
_n
- ALERT
_n
: All SDRAMs
QAODT0 -> ODT : SDRAMs D[10:1]
QBODT0 -> ODT : SDRAMs D[28:21]
QAODT1 -> ODT : SDRAMs D[20:11]
QBODT1 -> ODT : SDRAMs D[36:29]
QACS0_n -> CS_n : SDRAMs D[10:1]
QBCS0_n -> CS_n : SDRAMs D[28:21]
QACS1_n -> CS_n : SDRAMs D[20:11]
QBCS1_n -> CS_n : SDRAMs D[36:29]
Y2
_t
-> CK
_t
: SDRAMs D[28:25], D[36:33]
Y3
_t
-> CK
_t
: SDRAMs D[10:6], D[20:16]
Y2
_c
-> CK
_c
: SDRAMs D[28:25], D[36:33]
Y3
_c
-> CK
_c
: SDRAMs D[10:6], D[20:16]
NOTE :
1.
CK0_t, CK0_c terminated with 120 ± 5% resistor
.
2.
CK1_t, CK1_c terminated with 120 ± 5% resistor but not used.
3.
Unless otherwise noted resistors are 22 ± 5%.
- 15 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
10. Absolute Maximum Ratings
10.1 Absolute Maximum DC Ratings
[ Table 2 ] Absolute Maximum DC Ratings
NOTE:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect reliability
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard.
3. VDD and VDDQ must be within 300mV of each other at all times;and VREFCA must be not greater than 0.6 x VDDQ, When VDD and VDDQ are less than 500mV; VREFCA
may be equal to or less than 300mV
4. VPP must be equal or greater than VDD/VDDQ at all times.
11. AC & DC Operating Conditions
11.1 Recommended DC Operating Conditions
[ Table 3 ] Recommended DC Operating Conditions
NOTE:
1. Under all conditions VDDQ must be less than or equal to VDD.
2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.
3. DC bandwidth is limited to 20MHz.
Symbol Parameter Rating Units NOTE
VDD Voltage on VDD pin relative to Vss -0.3 ~ 1.5 V 1,3
VDDQ Voltage on VDDQ pin relative to Vss -0.3 ~ 1.5 V 1,3
VPP Voltage on VPP pin relative to Vss -0.3 ~ 3.0 V 4
VIN, VOUT Voltage on any pin except VREFCA to Vss -0.3 ~ 1.5 V 1,3
TSTG Storage Temperature -55 to +100 °C 1,2
Symbol Parameter Rating Unit NOTE
Min. Typ. Max.
VDD Supply Voltage 1.14 1.2 1.26 V 1,2,3
VDDQ Supply Voltage for Output 1.14 1.2 1.26 V 1,2,3
VPP Peak-to-Peak Voltage 2.375 2.5 2.75 V 3
- 16 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
12. AC & DC Input Measurement Levels
12.1 AC & DC Logic Input Levels for Single-Ended Signals
[ Table 4 ] Single-ended AC & DC Input Levels for Command and Address
NOTE:
1. See “Overshoot and Undershoot Specifications” on section.
2. The AC peak noise on VREFCA may not allow VREFCA to deviate from VREFCA(DC) by more than ± 1% VDD (for reference : approx. ± 12mV)
3. For reference : approx. VDD/2 ± 12mV
12.2 AC and DC Input Measurement Levels: VREF Tolerances.
The DC-tolerance limits and ac-noise limits for the reference voltages VREFCA is illustrated in Figure 1. It shows a valid reference voltage VREF(t) as a
function of time. (VREF stands for VREFCA).
VREF(DC) is the linear average of VREF(t) over a very long period of time (e.g. 1 sec). This average has to meet the min/max requirement in Table X.
Furthermore VREF(t) may temporarily deviate from VREF(DC) by no more than ± 1% VDD.
Figure 1. Illustration of VREF(DC) tolerance and VREF AC-noise limits
The voltage levels for setup and hold time measurements VIH(AC), VIH(DC), VIL(AC) and VIL(DC) are dependent on VREF
.
"VREF" shall be understood as VREF(DC), as defined in Figure 1.
This clarifies, that DC-variations of VREF affect the absolute voltage a signal has to reach to achieve a valid high or low level and therefore the time to
which setup and hold is measured. System timing and voltage budgets need to account for VREF(DC) deviations from the optimum position within the
data-eye of the input signals.
This also clarifies that the DRAM setup/hold specification and derating values need to include time and voltage associated with VREF AC-noise. Timing
and voltage effects due to AC-noise on VREF up to the specified limit (+/-1% of VDD) are included in DRAM timings and their associated deratings.
Symbol Parameter DDR4-1600/1866/2133/2400 DDR4-2666 Unit NOTE
Min. Max. Min. Max.
VIH.CA(DC75) DC input logic high VREFCA+ 0.075 VDD TBD TBD V
VIL.CA(DC75) DC input logic low VSS VREFCA-0.075 TBD TBD V
VIH.CA(AC100) AC input logic high VREF + 0.1 Note 2 TBD TBD V 1
VIL.CA(AC100) AC input logic low Note 2 VREF - 0.1 TBD TBD V 1
VREFCA(DC) Reference Voltage for ADD, CMD inputs 0.49*VDD 0.51*VDD TBD TBD V 2,3
voltage
VDD
VSS
time
- 17 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
12.3 AC and DC Logic Input Levels for Differential Signals
12.3.1 Differential Signals Definition
0.0
tDVAC
VIH.DIFF.MIN
half cycle
Differential Input Voltage (CK-CK)
time
tDVAC
VIH.DIFF.AC.MIN
VIL.DIFF.MAX
VIL.DIFF.AC.MAX
(CK_t - CK_c)
Figure 2. Definition of differential ac-swing and “time above ac-level” tDVAC
NOTE:
1. Differential signal rising edge from VIL.DIFF.MAX to VIH.DIFF.MIN must be monotonic slope.
2. Differential signal falling edge from VIH.DIFF.MIN to VIL.DIFF.MAX must be monotonic slope.
12.3.2 Differential Swing Requirements for Clock (CK_t - CK_c)
[ Table 5 ] Differential AC and DC Input Levels
NOTE:
1. Used to define a differential signal slew-rate.
2. for CK_t - CK_c use VIH.CA/VIL.CA(AC) of ADD/CMD and VREFCA;
3. These values are not defined; however, the differential signals CK_t - CK_c, need to be within the respective limits (VIH.CA(DC) max, VIL.CA(DC)min) for single-ended signals
as well as the limitations for overshoot and undershoot.
[ Table 6 ] Allowed Time Before Ringback (tDVAC) for CK_t - CK_c
Symbol Parameter DDR4 -1600/1866/2133 DDR4 -2400/2666 unit NOTE
min max min max
VIHdiff differential input high +0.150 NOTE 3 TBD NOTE 3 V 1
VILdiff differential input low NOTE 3 -0.150 NOTE 3 TBD V 1
VIHdiff(AC) differential input high ac 2 x (VIH(AC) - VREF)NOTE 3 2 x (VIH(AC) - VREF)NOTE 3 V 2
VILdiff(AC) differential input low ac NOTE 3 2 x (VIL(AC) - VREF)NOTE 3 2 x (VIL(AC) - VREF)V2
Slew Rate [V/ns]
tDVAC [ps] @ |VIH/Ldiff(AC)| = 200mV
min max
> 4.0 120 -
4.0 115 -
3.0 110 -
2.0 105 -
1.8 100 -
1.6 95 -
1.4 90 -
1.2 85 -
1.0 80 -
< 1.0 80 -
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datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
12.3.3 Single-ended Requirements for Differential Signals
Each individual component of a differential signal (CK_t, CK_c) has also to comply with certain requirements for single-ended signals.
CK_t and CK_c have to approximately reach VSEHmin / VSELmax (approximately equal to the ac-levels (VIH.CA(AC) / VIL.CA(AC)) for ADD/CMD
signals) in every half-cycle.
Note that the applicable ac-levels for ADD/CMD might be different per speed-bin etc. E.g., if Different value than VIH.CA(AC100)/VIL.CA(AC100) is used
for ADD/CMD signals, then these ac-levels apply also for the single-ended signals CK_t and CK_c
Figure 3. Single-ended requirement for differential signals.
Note that, while ADD/CMD signal requirements are with respect to VrefCA, the single-ended components of differential signals have a requirement with
respect to VDD / 2; this is nominally the same. The transition of single-ended signals through the ac-levels is used to measure setup time. For single-
ended components of differential signals the requirement to reach VSELmax, VSEHmin has no bearing on timing, but adds a restriction on the common
mode characteristics of these signals.
[ Table 7 ] Single-ended Levels for CK_t, CK_c
NOTE:
1. For CK_t - CK_c use VIH.CA/VIL.CA(AC) of ADD/CMD;
2. VIH(AC)/VIL(AC) for ADD/CMD is based on VREFCA;
3. These values are not defined, however the single-ended signals CK_t - CK_c need to be within the respective limits (VIH.CA(DC) max, VIL.CA(DC)min) for single-ended
signals as well as the limitations for overshoot and undershoot.
Symbol Parameter DDR4-1600/1866/2133 DDR4-2400/2666 Unit NOTE
Min Max Min Max
VSEH Single-ended high-level for CK_t , CK_c (VDD/2)+0.100 NOTE3 TBD NOTE3 V 1, 2
VSEL Single-ended low-level for CK_t , CK_c NOTE3 (VDD/2)-0.100 NOTE3 TBD V 1, 2
VDD or VDDQ
VSEH min
VDD/2 or VDDQ/2
VSEL max
VSEH
VSS or VSSQ
VSEL
CK
time
- 19 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
12.4 Slew Rate Definitions
12.4.1 Slew Rate Definitions for Differential Input Signals (CK)
[ Table 8 ] Differential Input Slew Rate Definition
Figure 4. Differential Input Slew Rate Definition for CK_t, CK_c
Description Defined by
from to
Differential input slew rate for rising edge(CK_t - CK_c) VILdiffmax VIHdiffmin VIHdiffmin - VILdiffmax DeltaTRdiff
Differential input slew rate for falling edge(CK_t - CK_c) VIHdiffmin VILdiffmax VIHdiffmin - VILdiffmax DeltaTFdiff
NOTE: The differential signal (i,e.,CK_t - CK_c) must be linear between these thresholds.
Delta TRdiff
Delta TFdiff
VIHdiffmin
0
VILdiffmax
Differential Input Voltage(i,e, CK_t - CK_c)
- 20 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
12.5 Differential Input Cross Point Voltage
To guarantee tight setup and hold times as well as output skew parameters with respect to clock, each cross point voltage of differential input signals
(CK_t, CK_c) must meet the requirements in Table 9. The differential input cross point voltage VIX is measured from the actual cross point of true and
complement signals to the midlevel between of VDD and VSS.
Figure 5. Vix Definition (CK)
[ Table 9 ] Cross Point Voltage for Differential Input Signals (CK)
Symbol Parameter DDR4-1600/1866/2133
min max
- Area of VSEH, VSEL VSEL =< VDD/2 -
145mV
VDD/2 - 145mV =<
VSEL =< VDD/2 -
100mV
VDD/2 + 100mV
=< VSEH =< VDD/
2 + 145mV
VDD/2 + 145mV
=< VSEH
VlX(CK) Differential Input Cross Point Voltage relative to
VDD/2 for CK_t, CK_c -120mV -(VDD/2 - VSEL) +
25mV
(VSEH - VDD/2) -
25mV 120mV
Symbol Parameter DDR4-2400/2666
min max
- Area of VSEH, VSEL TBD TBD TBD TBD
VlX(CK) Differential Input Cross Point Voltage relative to
VDD/2 for CK_t, CK_c TBD TBD TBD TBD
Vix
CK_t
VDD/2
VSS
VDD
CK_c
Vix
VSEL
VSEH
- 21 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
12.6 Single-ended AC & DC Output Levels
[ Table 10 ] Single-ended AC & DC Output Levels
NOTE:
1. The swing of ± 0.15 × VDDQ is based on approximately 50% of the static single-ended output peak-to-peak swing with a driver impedance of RZQ/7 and an effective test
load of 50 to VTT = VDDQ.
12.7 Differential AC & DC Output Levels
[ Table 11 ] Differential AC & DC Output Levels
NOTE:
1. The swing of ± 0.3 × VDDQ is based on approximately 50% of the static differential output peak-to-peak swing with a driver impedance of RZQ/7 and an effective test load
of 50 to VTT = VDDQ at each of the differential outputs.
12.8 Single-ended Output Slew Rate
With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOL(AC) and VOH(AC) for
single ended signals as shown in Table 12 and Figure 6.
[ Table 12 ] Single-ended Output Slew Rate Definition
NOTE:
1. Output slew rate is verified by design and characterization, and may not be subject to production test.
Figure 6. Single-ended Output Slew Rate Definition
Symbol Parameter DDR4-1600/1866/2133/2400/2666 Units NOTE
VOH(DC) DC output high measurement level (for IV curve linearity) 1.1 x VDDQ V
VOM(DC) DC output mid measurement level (for IV curve linearity) 0.8 x VDDQ V
VOL(DC) DC output low measurement level (for IV curve linearity) 0.5 x VDDQ V
VOH(AC) AC output high measurement level (for output SR) (0.7 - 0.15) x VDDQ V1
VOL(AC) AC output low measurement level (for output SR) (0.7 - 0.15) x VDDQ V1
Symbol Parameter DDR4-1600/1866/2133/2400/2666 Units NOTE
VOHdiff(AC) AC differential output high measurement level (for output SR) +0.3 x VDDQ V1
VOLdiff(AC) AC differential output low measurement level (for output SR) -0.3 x VDDQ V1
Description Measured Defined by
From To
Single ended output slew rate for rising edge VOL(AC) VOH(AC) [VOH(AC)-VOL(AC)] / Delta TRse
Single ended output slew rate for falling edge VOH(AC) VOL(AC) [VOH(AC)-VOL(AC)] / Delta TFse
VOH(AC)
VOL(AC)
delta TRsedelta TFse
VTT
- 22 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
[ Table 13 ] Single-ended Output Slew Rate
Description: SR: Slew Rate
Q: Query Output (like in DQ, which stands for Data-in, Query-Output)
se: Single-ended Signals
For Ron = RZQ/7 setting
NOTE:
1. In two cases, a maximum slew rate of 12 V/ns applies for a single DQ signal within a byte lane.
-Case 1 is defined for a single DQ signal within a byte lane which is switching into a certain direction (either from high to low or low to high) while all remaining DQ signals in the
same byte lane are static (i.e. they stay at either high or low).
-Case 2 is defined for a single DQ signal within a byte lane which is switching into a certain direction (either from high to low or low to high) while all remaining DQ signals in the
same byte lane are switching into the opposite direction (i.e. from low to high or high to low respectively). For the remaining DQ signal switching into the opposite direction, the
regular maximum limit of 9 V/ns applies
12.9 Differential Output Slew Rate
With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOLdiff(AC) and
VOHdiff(AC) for differential signals as shown in Table 14 and Figure 7.
[ Table 14 ] Differential Output Slew Rate Definition
NOTE:
1. Output slew rate is verified by design and characterization, and may not be subject to production test.
Figure 7. Differential Output Slew Rate Definition
[ Table 15 ] Differential Output Slew Rate
Description:
SR: Slew Rate
Q: Query Output (like in DQ, which stands for Data-in, Query-Output)
diff: Differential Signals
For Ron = RZQ/7 setting
Parameter Symbol DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666 Units
Min Max Min Max Min Max Min Max Min Max
Single ended output slew rate SRQse 4 9 4 9 4 9 4 9 4 9 V/ns
Description Measured Defined by
From To
Differential output slew rate for rising edge VOLdiff(AC) VOHdiff(AC) [VOHdiff(AC)-VOLdiff(AC)] / Delta TRdiff
Differential output slew rate for falling edge VOHdiff(AC) VOLdiff(AC) [VOHdiff(AC)-VOLdiff(AC)] / Delta TFdiff
Parameter Symbol DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666 Units
Min Max Min Max Min Max Min Max Min Max
Differential output slew rate SRQdiff 8 18 8 18 8 18 8 18 8 18 V/ns
VOHdiff(AC)
VOLdiff(AC)
delta TRdiffdelta TFdiff
VTT
- 23 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
12.10 Single-ended AC & DC Output Levels of Connectivity Test Mode
Following output parameters will be applied for DDR4 SDRAM Output Signal during Connectivity Test Mode.
[ Table 16 ] Single-ended AC & DC Output Levels of Connectivity Test Mode
NOTE:
1. The effective test load is 50 terminated by VTT = 0.5 * VDDQ.
Figure 8. Output Slew Rate Definition of Connectivity Test Mode
[ Table 17 ] Single-ended Output Slew Rate of Connectivity Test Mode
12.11 Test Load for Connectivity Test Mode Timing
The reference load for ODT timings is defined in Figure 9.
Figure 9. Connectivity Test Mode Timing Reference Load
Symbol Parameter DDR4-1600/1866/2133/2400/2666 Unit Notes
VOH(DC) DC output high measurement level (for IV curve linearity) 1.1 x VDDQ V
VOM(DC) DC output mid measurement level (for IV curve linearity) 0.8 x VDDQ V
VOL(DC) DC output low measurement level (for IV curve linearity) 0.5 x VDDQ V
VOB(DC) DC output below measurement level (for IV curve linearity) 0.2 x VDDQ V
VOH(AC) AC output high measurement level (for output SR) VTT + (0.1 x VDDQ) V 1
VOL(AC) AC output below measurement level (for output SR) VTT - (0.1 x VDDQ) V 1
Parameter Symbol DDR4-1600/1866/2133/2400/2666 Unit Notes
Min Max
Output signal Falling time TF_output_CT - 10 ns/V
Output signal Rising time TR_output_CT - 10 ns/V
VOH(AC)
TR_output_CT
VTT
VOL(AC)
TR_output_CT
V
DDQ
CT_INPUTS
DUT
DQ, DM
DQSU_t , DQSU_c
DQS_t , DQS_c
Rterm = 50 ohm
Timing Reference Points
V
SSQ
DQSL_t , DQSL_c
0.5*VDDQ
- 24 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
13. DIMM IDD Specification Definition
[ Table 18 ] Basic IDD, IPP and IDDQ Measurement Conditions
Symbol Description
IDD0
Operating One Bank Active-Precharge Current (AL=0)
CKE: High; External clock: On; tCK, nRC, nRAS, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: High
between ACT and PRE; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling; Data IO: VDDQ; DM_n:
stable at 1; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,...; Output Buffer and RTT: Enabled in Mode Registers2;
ODT Signal: stable at 0; Pattern Details: Refer to Component Datasheet for detail pattern
IDD0A Operating One Bank Active-Precharge Current (AL=CL-1)
AL = CL-1, Other conditions: see IDD0
IPP0 Operating One Bank Active-Precharge IPP Current
Same condition with IDD0
IDD1
Operating One Bank Active-Read-Precharge Current (AL=0)
CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: High
between ACT, RD and PRE; Command, Address, Bank Group Address, Bank Address Inputs, Data IO: partially toggling; DM_n: sta-
ble at 1; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,...; Output Buffer and RTT: Enabled in Mode Registers2; ODT
Signal: stable at 0; Pattern Details: Refer to Component Datasheet for detail pattern
IDD1A Operating One Bank Active-Read-Precharge Current (AL=CL-1)
AL = CL-1, Other conditions: see IDD1
IPP1 Operating One Bank Active-Read-Precharge IPP Current
Same condition with IDD1
IDD2N
Precharge Standby Current (AL=0)
CKE: High; External clock: On; tCK, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: stable at 1; Command,
Address, Bank Group Address, Bank Address Inputs: partially toggling; Data IO: VDDQ; DM_n: stable at 1; Bank Activity: all banks
closed; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: Refer to Component Datasheet
for detail pattern
IDD2NA Precharge Standby Current (AL=CL-1)
AL = CL-1, Other conditions: see IDD2N
IPP2N Precharge Standby IPP Current
Same condition with IDD2N
IDD2NT
Precharge Standby ODT Current
CKE: High; External clock: On; tCK, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: stable at 1; Command,
Address, Bank Group Address, Bank Address Inputs: partially toggling; Data IO: VSSQ; DM_n: stable at 1; Bank Activity: all banks
closed; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: toggling according; Pattern Details: Refer to Component
Datasheet for detail pattern
IDDQ2NT
(Optional)
Precharge Standby ODT IDDQ Current
Same definition like for IDD2NT, however measuring IDDQ current instead of IDD current
IDD2NL Precharge Standby Current with CAL enabled
Same definition like for IDD2N, CAL enabled3
IDD2NG Precharge Standby Current with Gear Down mode enabled
Same definition like for IDD2N, Gear Down mode enabled3,5
IDD2ND Precharge Standby Current with DLL disabled
Same definition like for IDD2N, DLL disabled3
IDD2N_par Precharge Standby Current with CA parity enabled
Same definition like for IDD2N, CA parity enabled3
IDD2P
Precharge Power-Down Current CKE: Low; External clock: On; tCK, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL:
0; CS_n: stable at 1; Command, Address, Bank Group Address, Bank Address Inputs: stable at 0; Data IO: VDDQ; DM_n: stable at 1;
Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0
IPP2P Precharge Power-Down IPP Current
Same condition with IDD2P
IDD2Q
Precharge Quiet Standby Current
CKE: High; External clock: On; tCK, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: stable at 1; Command,
Address, Bank Group Address, Bank Address Inputs: stable at 0; Data IO: VDDQ; DM_n: stable at 1;Bank Activity: all banks closed;
Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0
- 25 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
Symbol Description
IDD3N
Active Standby Current
CKE: High; External clock: On; tCK, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: stable at 1; Command,
Address, Bank Group Address, Bank Address Inputs: partially toggling; Data IO: VDDQ; DM_n: stable at 1;Bank Activity: all banks
open; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details:Refer to Component Datasheet
for detail pattern
IDD3NA Active Standby Current (AL=CL-1)
AL = CL-1, Other conditions: see IDD3N
IPP3N Active Standby IPP Current
Same condition with IDD3N
IDD3P
Active Power-Down Current
CKE: Low; External clock: On; tCK, CL: sRefer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: stable at 1; Command,
Address, Bank Group Address, Bank Address Inputs: stable at 0; Data IO: VDDQ; DM_n: stable at 1; Bank Activity: all banks open;
Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0
IPP3P Active Power-Down IPP Current
Same condition with IDD3P
IDD4R
Operating Burst Read Current
CKE: High; External clock: On; tCK, CL: Refer to Component Datasheet for detail pattern; BL: 82; AL: 0; CS_n: High between RD;
Command, Address, Bank Group Address, Bank Address Inputs: partially toggling; Data IO: seamless read data burst with different
data between one burst and the next one according; DM_n: stable at 1; Bank Activity: all banks open, RD commands cycling through
banks: 0,0,1,1,2,2,...; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: Refer to
Component Datasheet for detail pattern
IDD4RA Operating Burst Read Current (AL=CL-1)
AL = CL-1, Other conditions: see IDD4R
IDD4RB Operating Burst Read Current with Read DBI
Read DBI enabled3, Other conditions: see IDD4R
IPP4R Operating Burst Read IPP Current
Same condition with IDD4R
IDDQ4R
(Optional)
Operating Burst Read IDDQ Current
Same definition like for IDD4R, however measuring IDDQ current instead of IDD current
IDDQ4RB
(Optional)
Operating Burst Read IDDQ Current with Read DBI
Same definition like for IDD4RB, however measuring IDDQ current instead of IDD current
IDD4W
Operating Burst Write Current
CKE: High; External clock: On; tCK, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: High between WR;
Command, Address, Bank Group Address, Bank Address Inputs: partially toggling; Data IO: seamless write data burst with different
data between one burst and the next one; DM_n: stable at 1; Bank Activity: all banks open, WR commands cycling through banks:
0,0,1,1,2,2,...; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at HIGH; Pattern Details: Refer to Component
Datasheet for detail pattern
IDD4WA Operating Burst Write Current (AL=CL-1)
AL = CL-1, Other conditions: see IDD4W
IDD4WB Operating Burst Write Current with Write DBI
Write DBI enabled3, Other conditions: see IDD4W
IDD4WC Operating Burst Write Current with Write CRC
Write CRC enabled3, Other conditions: see IDD4W
IDD4W_par Operating Burst Write Current with CA Parity
CA Parity enabled3, Other conditions: see IDD4W
IPP4W Operating Burst Write IPP Current
Same condition with IDD4W
IDD5B
Burst Refresh Current (1X REF)
CKE: High; External clock: On; tCK, CL, nRFC: Refer to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n: High between
REF; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling; Data IO: VDDQ; DM_n: stable at 1; Bank
Activity: REF command every nRFC; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details:
Refer to Component Datasheet for detail pattern
IPP5B Burst Refresh Write IPP Current (1X REF)
Same condition with IDD5B
IDD5F2 Burst Refresh Current (2X REF)
tRFC=tRFC_x2, Other conditions: see IDD5B
IPP5F2 Burst Refresh Write IPP Current (2X REF)
Same condition with IDD5F2
- 26 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
NOTE:
1. Burst Length: BL8 fixed by MRS: set MR0 [A1:0=00].
2. Output Buffer Enable
- set MR1 [A12 = 0]: Qoff = Output buffer enabled
- set MR1 [A2:1 = 00]: Output Driver Impedance Control = RZQ/7
RTT_Nom enable
- set MR1 [A10:8 = 011]: RTT_NOM = RZQ/6
RTT_WR enable
- set MR2 [A10:9 = 01]: RTT_WR = RZQ/2
RTT_PARK disable
- set MR5 [A8:6 = 000]
3. CAL enabled: set MR4 [A8:6 = 001]: 1600MT/s
010]: 1866MT/s, 2133MT/s
011]: 2400MT/s, 2666MT/s
Gear Down mode enabled: set MR3 [A3 = 1]: 1/4 Rate
DLL disabled: set MR1 [A0 = 0]
CA parity enabled: set MR5 [A2:0 = 001]: 1600MT/s,1866MT/s, 2133MT/s
010]: 2400MT/s, 2666MT/s
Read DBI enabled: set MR5 [A12 = 1]
Write DBI enabled: set MR5 [A11 = 1]
4. Low Power Array Self Refresh (LP ASR): set MR2 [A7:6 = 00]: Normal
01]: Reduced Temperature range
10]: Extended Temperature range
11]: Auto Self Refresh
5. IDD2NG should be measured after sync pules (NOP) input.
Symbol Description
IDD5F4 Burst Refresh Current (4X REF)
tRFC=tRFC_x4, Other conditions: see IDD5B
IPP5F4 Burst Refresh Write IPP Current (4X REF)
Same condition with IDD5F4
IDD6N
Self Refresh Current: Normal Temperature Range
TCASE: 0 - 85°C; Low Power Array Self Refresh (LP ASR): Normal4; CKE: Low; External clock: Off; CK_t and CK_c#: LOW; CL: Refer
to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n#, Command, Address, Bank Group Address, Bank Address, Data IO:
High; DM_n: stable at 1; Bank Activity: Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: MID-
LEVEL
IPP6N Self Refresh IPP Current: Normal Temperature Range
Same condition with IDD6N
IDD6E
Self-Refresh Current: Extended Temperature Range
TCASE: 0 - 95°C; Low Power Array Self Refresh (LP ASR): Extended4; CKE: Low; External clock: Off; CK_t and CK_c: LOW; CL: Refer
to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n, Command, Address, Bank Group Address, Bank Address, Data IO:
High; DM_n:stable at 1; Bank Activity: Extended Temperature Self-Refresh operation; Output Buffer and RTT: Enabled in Mode
Registers2; ODT Signal: MID-LEVEL
IPP6E Self Refresh IPP Current: Extended Temperature Range
Same condition with IDD6E
IDD6R
Self-Refresh Current: Reduced Temperature Range
TCASE: 0 - 45°C; Low Power Array Self Refresh (LP ASR): Reduced4; CKE: Low; External clock: Off; CK_t and CK_c#: LOW; CL: Refer
to Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n#, Command, Address, Bank Group Address, Bank Address, Data IO:
High; DM_n:stable at 1; Bank Activity: Extended Temperature Self-Refresh operation; Output Buffer and RTT: Enabled in Mode
Registers2; ODT Signal: MID-LEVEL
IPP6R Self Refresh IPP Current: Reduced Temperature Range
Same condition with IDD6R
IDD6A
Auto Self-Refresh Current
TCASE: 0 - 95°C; Low Power Array Self Refresh (LP ASR): Auto4; CKE: Low; External clock: Off; CK_t and CK_c#: LOW; CL: Refer to
Component Datasheet for detail pattern; BL: 81; AL: 0; CS_n#, Command, Address, Bank Group Address, Bank Address, Data IO:
High; DM_n:stable at 1; Bank Activity: Auto Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal:
MID-LEVEL
IPP6A Auto Self-Refresh IPP Current
Same condition with IDD6A
IDD7
Operating Bank Interleave Read Current
CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, nRRD, nFAW, CL: Refer to Component Datasheet for detail pattern; BL: 81; AL:
CL-1; CS_n: High between ACT and RDA; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling; Data
IO: read data bursts with different data between one burst and the next one; DM_n: stable at 1; Bank Activity: two times interleaved cycling
through banks (0, 1, ...7) with different addressing; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern
Details: Refer to Component Datasheet for detail pattern
IPP7 Operating Bank Interleave Read IPP Current
Same condition with IDD7
IDD8 Maximum Power Down Current TBD
IPP8 Maximum Power Down IPP Current Same condition with IDD8
- 26 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
14. IDD SPEC Table
IDD and IPP values are for typical operating range of voltage and temperature unless otherwise noted.
[ Table 19 ] IDD and IDDQ Specification
NOTE :
1. DIMM IDD SPEC is based on the condition that de-actived rank (IDLE) is IDD2N. Please refer to Table 20.
2. IDD current measure method and detail patterns are described on DDR4 component datasheet.
3. VDD and VDDQ are merged on module PCB (IDDQ values are not considered by Qoff condition)
4. DIMM IDD Values are calculated based on the component IDD spec and Register power.
Symbol
M393A1K43BB0 :
8GB(1Gx72) Module
Unit NOTE
DDR4-2133 DDR4-2400 DDR4-2666
15-15-15 17-17-17 19-19-19
VDD 1.2V VPP 2.5V VDD 1.2V VPP 2.5V VDD 1.2V VPP 2.5V
IDD Max. IPP Max. IDD Max. IPP Max. IDD Max. IPP Max.
IDD0 590 36 605 36 620 36 mA
IDD0A 602 36 628 36 638 36 mA
IDD1 804 36 824 36 838 36 mA
IDD1A 822 36 847 36 873 36 mA
IDD2N 486 27 504 27 511 27 mA
IDD2NA 510 27 532 27 544 27 mA
IDD2NT 505 27 528 27 539 27 mA
IDD2NL 442 27 459 27 466 27 mA
IDD2NG 488 27 506 27 523 27 mA
IDD2ND 473 27 490 27 504 27 mA
IDD2N_par 504 27 521 27 530 27 mA
IDD2P 305 27 314 27 320 27 mA
IDD2Q 474 27 491 27 498 27 mA
IDD3N 573 27 591 27 605 27 mA
IDD3NA 593 27 613 27 633 27 mA
IDD3P 348 27 360 27 365 27 mA
IDD4R 1264 27 1323 27 1398 27 mA
IDD4RA 1294 27 1358 27 1439 27 mA
IDD4RB 1270 27 1339 27 1407 27 mA
IDD4W 1121 27 1181 27 1250 27 mA
IDD4WA 1156 27 1216 27 1290 27 mA
IDD4WB 1122 27 1183 27 1252 27 mA
IDD4WC 1063 27 1130 27 1200 27 mA
IDD4W_par 1195 27 1269 27 1358 27 mA
IDD5B 2055 162 2070 162 2212 162 mA
IDD5F2 1566 135 1587 135 1681 135 mA
IDD5F4 1385 126 1405 126 1482 126 mA
IDD6N 214 36 214 36 225 36 mA
IDD6E 307 45 306 45 318 54 mA
IDD6R 168 32 167 32 174 36 mA
IDD6A 211 36 210 36 219 36 mA
IDD7 1603 72 1613 77 1731 81 mA
IDD8 101 27 101 27 109 27 mA
- 27 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
NOTE :
1. DIMM IDD SPEC is based on the condition that de-actived rank (IDLE) is IDD2N. Please refer to Table 20.
2. IDD current measure method and detail patterns are described on DDR4 component datasheet.
3. VDD and VDDQ are merged on module PCB ( IDDQ values are not considered by Qoff condition)
4. DIMM IDD Values are calculated based on the component IDD spec and Register power.
Symbol
16GB(2Gx72) Module
Unit NOTE
M393A2K40BB0 M393A2K40BB1 M393A2K40BB2
DDR4-2133 DDR4-2400 DDR4-2666
15-15-15 17-17-17 19-19-19
VDD 1.2V VPP 2.5V VDD 1.2V VPP 2.5V VDD 1.2V VPP 2.5V
IDD Max. IPP Max. IDD Max. IPP Max. IDD Max. IPP Max.
IDD0 905 72 953 72 987 72 mA
IDD0A 929 72 999 72 1040 72 mA
IDD1 1186 72 1246 72 1339 72 mA
IDD1A 1223 72 1292 72 1357 72 mA
IDD2N 698 54 749 54 756 54 mA
IDD2NA 747 54 806 54 809 54 mA
IDD2NT 732 54 793 54 808 54 mA
IDD2NL 613 54 656 54 669 54 mA
IDD2NG 702 54 754 54 754 54 mA
IDD2ND 674 54 722 54 719 54 mA
IDD2N_par 735 54 785 54 791 54 mA
IDD2P 460 54 492 54 496 54 mA
IDD2Q 675 54 723 54 739 54 mA
IDD3N 856 54 928 54 987 54 mA
IDD3NA 895 54 972 54 1023 54 mA
IDD3P 537 54 586 54 592 54 mA
IDD4R 1860 54 2041 54 2263 54 mA
IDD4RA 1919 54 2110 54 2353 54 mA
IDD4RB 1882 54 2067 54 2298 54 mA
IDD4W 1771 54 1959 54 2146 54 mA
IDD4WA 1836 54 2031 54 2221 54 mA
IDD4WB 1771 54 1960 54 2146 54 mA
IDD4WC 1730 54 1852 54 2011 54 mA
IDD4W_par 1917 54 2132 54 2325 54 mA
IDD5B 3706 324 3782 324 4159 324 mA
IDD5F2 2750 270 2818 270 3040 270 mA
IDD5F4 2381 252 2445 252 2642 252 mA
IDD6N 374 72 404 72 443 72 mA
IDD6E 562 90 596 90 628 90 mA
IDD6R 282 63 308 63 322 63 mA
IDD6A 364 72 388 72 423 72 mA
IDD7 3297 144 3648 153 4221 162 mA
IDD8 160 54 181 54 200 54 mA
- 28 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
NOTE :
1. DIMM IDD SPEC is based on the condition that de-actived rank (IDLE) is IDD2N. Please refer to Table 20.
2. IDD current measure method and detail patterns are described on DDR4 component datasheet.
3. VDD and VDDQ are merged on module PCB ( IDDQ values are not considered by Qoff condition)
4. DIMM IDD Values are calculated based on the component IDD spec and Register power.
Symbol
32GB(4Gx72) Module
Unit NOTE
M393A4K40BB0 M393A4K40BB1 M393A4K40BB2
DDR4-2133 DDR4-2400 DDR4-2666
15-15-15 17-17-17 19-19-19
VDD 1.2V VPP 2.5V VDD 1.2V VPP 2.5V VDD 1.2V VPP 2.5V
IDD Max. IPP Max. IDD Max. IPP Max. IDD Max. IPP Max.
IDD0 1356 126 1438 126 1510 126 mA
IDD0A 1379 126 1485 126 1563 126 mA
IDD1 1667 126 1772 126 1903 126 mA
IDD1A 1704 126 1819 126 1920 126 mA
IDD2N 1189 108 1276 108 1300 108 mA
IDD2NA 1247 108 1349 108 1404 108 mA
IDD2NT 1216 108 1323 108 1402 108 mA
IDD2NL 979 108 1049 108 1084 108 mA
IDD2NG 1156 108 1244 108 1296 108 mA
IDD2ND 1100 108 1180 108 1224 108 mA
IDD2N_par 1221 108 1307 108 1328 108 mA
IDD2P 598 108 652 108 723 108 mA
IDD2Q 1103 108 1182 108 1224 108 mA
IDD3N 1461 108 1591 108 1759 108 mA
IDD3NA 1537 108 1678 108 1831 108 mA
IDD3P 748 108 840 108 873 108 mA
IDD4R 2341 108 2568 108 2827 108 mA
IDD4RA 2400 108 2637 108 2916 108 mA
IDD4RB 2363 108 2593 108 2862 108 mA
IDD4W 2252 108 2486 108 2710 108 mA
IDD4WA 2317 108 2557 108 2784 108 mA
IDD4WB 2252 108 2486 108 2709 108 mA
IDD4WC 2210 108 2379 108 2574 108 mA
IDD4W_par 2397 108 2658 108 2888 108 mA
IDD5B 4187 378 4308 378 4722 378 mA
IDD5F2 3231 324 3344 324 3604 324 mA
IDD5F4 2862 306 2971 306 3206 306 mA
IDD6N 734 144 796 144 881 144 mA
IDD6E 1108 180 1178 180 1250 180 mA
IDD6R 550 126 603 126 638 126 mA
IDD6A 714 144 763 144 840 144 mA
IDD7 3778 198 4175 207 4786 216 mA
IDD8 317 108 360 108 405 108 mA
- 29 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
[ Table 20 ] DIMM Rank Status
SEC DIMM Operating Rank The other Rank
IDD0 IDD0 IDD2N
IDD1 IDD1 IDD2N
IDD2P IDD2P IDD2P
IDD2N IDD2N IDD2N
IDD2Q IDD2Q IDD2Q
IDD3P IDD3P IDD3P
IDD3N IDD3N IDD3N
IDD4R IDD4R IDD2N
IDD4W IDD4W IDD2N
IDD5B IDD5B IDD2N
IDD6 IDD6 IDD6
IDD7 IDD7 IDD2N
IDD8 IDD8 IDD8
- 31 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
15. Input/Output Capacitance
[ Table 21 ] Silicon Pad I/O Capacitance
NOTE:
1. This parameter is not subject to production test. It is verified by design and characterization. The silicon only capacitance is validated by de-embedding the package L & C
parasitic. The capacitance is measured with VDD, VDDQ, VSS, VSSQ applied with all other signal pins floating. Measurement procedure tbd.
2. DQ, DM_n, DQS_T, DQS_c, TDQS_T, TDQS_C. Although the DM, TDQS_T and TDQS_C pins have different functions, the loading matches DQ and DQS
3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here
4. Absolute value CK_T-CK_C
5. Absolute value of CIO(DQS_T)-CIO (DQS_c)
6. CI applies to ODT, CS_n, CKE, A0-A17, BA0-BA1, BG0-BG1, RAS_n/A16, CAS_n/A15, WE_n/A14, ACT_n and PAR.
7. CDI CTRL applies to ODT, CS_n and CKE
8. CDI_CTRL = CI(CTRL)-0.5*(CI(CLK_T)+CI(CLK_C))
9. CDI_ADD_ CMD applies to, A0-A17, BA0-BA1, BG0-BG1,RAS_n/A16, CAS_n/A15, WE_n/A14, ACT_n and PAR.
10. CDI_ADD_CMD = CI(ADD_CMD)-0.5*(CI(CLK_T)+CI(CLK_C))
11. CDIO = CIO(DQ,DM)-0.5*(CIO(DQS_T)+CIO(DQS_c))
12. Maximum external load capacitance on ZQ pin: tbd pF.
13.TEN pin may be DRAM internally pulled low through a weak pull-down resistor to VSS. In this case CTEN might not be valid and system shall verify TEN signal with Vendor
specific information.
Symbol Parameter DDR4-1600/1866/2133 DDR4-2400/2666 Unit NOTE
min max min max
CIO Input/output capacitance 0.55 1.4 0.55 1.15 pF 1,2,3
CDIO Input/output capacitance delta -0.1 0.1 -0.1 0.1 pF 1,2,3,11
CDDQS Input/output capacitance delta DQS_t and DQS_c - 0.05 - 0.05 pF 1,2,3,5
CCK Input capacitance, CK_t and CK_c 0.2 0.8 0.2 0.7 pF 1,3
CDCK Input capacitance delta CK_t and CK_c - 0.05 - 0.05 pF 1,3,4
CI Input capacitance (CTRL, ADD, CMD pins only) 0.2 0.8 0.2 0.7 pF 1,3,6
CDI_ CTRL Input capacitance delta (All CTRL pins only) -0.1 0.1 -0.1 0.1 pF 1,3,7,8
CDI_ ADD_CMD Input capacitance delta (All ADD/CMD pins only) -0.1 0.1 -0.1 0.1 pF 1,2,9,10
CALERT Input/output capacitance of ALERT 0.5 1.5 0.5 1.5 pF 1,3
CZQ Input/output capacitance of ZQ - 2.3 - 2.3 pF 1,3,12
CTEN Input capacitance of TEN 0.2 2.3 0.2 2.3 pF 1,3,13
- 32 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
16. Electrical Characterisitics and AC Timing
16.1 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
[ Table 22 ] DDR4-1600 Speed Bins and Operations
Speed Bin DDR4-1600
Unit NOTECL-nRCD-nRP 11-11-11
Parameter Symbol min max
Internal read command to first data tAA 13.7513
(13.50)5,11 18.00 ns 11
Internal read command to first data with read DBI enabled tAA_DBI tAA(min) + 2nCK tAA(max) +2nCK ns 11
ACT to internal read or write delay time tRCD 13.7513
(13.50)5,11 - ns 11
PRE command period tRP 13.7513
(13.50)5,11 - ns 11
ACT to PRE command period tRAS 35 9 x tREFI ns 11
ACT to ACT or REF command period tRC 48.75
(48.50)5,11 - ns 11
Normal Read DBI
CWL = 9 CL = 9 CL = 11 tCK(AVG)
1.5
1.6 ns 1,2,3,4,10,13
(Optional)5,11
CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,4,10
CWL = 9,11
CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,4
CL = 11 CL = 13 tCK(AVG) 1.25 <1.5 ns 1,2,3,4
CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3
Supported CL Settings 9,11,12 nCK 12,13
Supported CL Settings with read DBI 11,13,14 nCK 12
Supported CWL Settings 9,11 nCK
- 33 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
[ Table 23 ] DDR4-1866 Speed Bins and Operations
Speed Bin DDR4-1866
Unit NOTECL-nRCD-nRP 13-13-13
Parameter Symbol min max
Internal read command to first data tAA 13.9213
(13.50)5,11 18.00 ns 11
Internal read command to first data with read DBI enabled tAA_DBI tAA(min) + 2nCK tAA(max) +2nCK ns 11
ACT to internal read or write delay time tRCD 13.9213
(13.50)5,11 - ns 11
PRE command period tRP 13.9213
(13.50)5,11 - ns 11
ACT to PRE command period tRAS 34 9 x tREFI ns 11
ACT to ACT or REF command period tRC 47.92
(47.50)5,11 - ns 11
Normal Read DBI
CWL = 9 CL = 9 CL = 11 tCK(AVG)
1.5
1.6 ns 1,2,3,4,10,13
(Optional)5,11
CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,4,10
CWL = 9,11
CL = 10 CL = 12 tCK(AVG) Reserved ns 4
CL = 11 CL = 13 tCK(AVG)
1.25 <1.5
ns 1,2,3,4,6
(Optional)5,11
CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,6
CWL = 10,12
CL = 12 CL = 14 tCK(AVG) Reserved ns 1,2,3,4
CL = 13 CL = 15 tCK(AVG) 1.071 <1.25 ns 1,2,3,4
CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3
Supported CL Settings 9,11,12,13,14 nCK 12,13
Supported CL Settings with read DBI 11,13,14,15,16 nCK 12
Supported CWL Settings 9,10,11,12 nCK
- 34 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
[ Table 24 ] DDR4-2133 Speed Bins and Operations
Speed Bin DDR4-2133
Unit NOTECL-nRCD-nRP 15-15-15
Parameter Symbol min max
Internal read command to first data tAA 14.0613
(13.75)5,11 18.00 ns 11
Internal read command to first data with read DBI
enabled tAA_DBI tAA(min) + 3nCK tAA(max) + 3nCK ns 11
ACT to internal read or write delay time tRCD 14.06
(13.75)5,11 - ns 11
PRE command period tRP 14.06
(13.75)5,11 - ns 11
ACT to PRE command period tRAS 33 9 x tREFI ns 11
ACT to ACT or REF command period tRC 47.06
(46.75)5,11 - ns 11
Normal Read DBI
CWL = 9 CL = 9 CL = 11 tCK(AVG)
1.5
1.6 ns 1,2,3,4,10,1
3
(Optional)5,11
CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,10
CWL = 9,11 CL = 11 CL = 13 tCK(AVG)
1.25 <1.5
ns 1,2,3,4,7
(Optional)5,11
CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,7
CWL = 10,12 CL = 13 CL = 15 tCK(AVG)
1.071 <1.25
ns 1,2,3,4,7
(Optional)5,11
CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3,7
CWL = 11,14
CL = 14 CL = 17 tCK(AVG) Reserved ns 1,2,3,4
CL = 15 CL = 18 tCK(AVG) 0.937 <1.071 ns 1,2,3,4
CL = 16 CL = 19 tCK(AVG) 0.937 <1.071 ns 1,2,3
Supported CL Settings 9,11.12,13,14,15,16 nCK 12,13
Supported CL Settings with read DBI 11,13,14,15,16,18,19 nCK
Supported CWL Settings 9,10,11,12,14 nCK
- 35 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
[ Table 25 ] DDR4-2400 Speed Bins and Operations
Speed Bin DDR4-2400
Unit NOTECL-nRCD-nRP 17-17-17
Parameter Symbol min max
Internal read command to first data tAA 14.16
(13.75)5,11 18.00 ns 11
Internal read command to first data with read DBI
enabled tAA_DBI tAA(min) + 3nCK tAA(max) + 3nCK ns 11
ACT to internal read or write delay time tRCD 14.16
(13.75)5,11 - ns 11
PRE command period tRP 14.16
(13.75)5,11 - ns 11
ACT to PRE command period tRAS 32 9 x tREFI ns 11
ACT to ACT or REF command period tRC 46.16
(45.75)5,11 - ns 11
Normal Read DBI
CWL = 9 CL = 9 CL = 11 tCK(AVG) Reserved ns 1,2,3,4,9
CL = 10 CL = 12 tCK(AVG) 1.5 1.6 ns 1,2,3,4,9
CWL = 9,11
CL = 10 CL = 12 tCK(AVG) Reserved ns 4
CL = 11 CL = 13 tCK(AVG)
1.25 <1.5
ns 1,2,3,4,8
(Optional)5,11
CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,8
CWL = 10,12
CL = 12 CL = 14 tCK(AVG) Reserved ns 4
CL = 13 CL = 15 tCK(AVG)
1.071 <1.25 ns 1,2,3,4,8
(Optional)5,11
CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3,8
CWL = 11,14
CL = 14 CL = 17 tCK(AVG) Reserved ns 4
CL = 15 CL = 18 tCK(AVG)
0.937 <1.071 ns 1,2,3,4,8
(Optional)5,11
CL = 16 CL = 19 tCK(AVG) 0.937 <1.071 ns 1,2,3,8
CWL = 12,16
CL = 15 CL = 18 tCK(AVG) Reserved ns 1,2,3,4
CL = 16 CL = 19 tCK(AVG) Reserved ns 1,2,3,4
CL = 17 CL = 20 tCK(AVG) 0.833 <0.937
CL = 18 CL = 21 tCK(AVG) 0.833 <0.937 ns 1,2,3
Supported CL Settings 10,11,12,13,14,15,16,17,18 nCK 12,13
Supported CL Settings with read DBI 12,13,14,15,16,18,19,20,21 nCK
Supported CWL Settings 9,10,11,12,14,16 nCK
- 36 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
[ Table 26 ] DDR4-2666 Speed Bins and Operations
Speed Bin DDR4-2666
Unit NOTECL-nRCD-nRP 19-19-19
Parameter Symbol min max
Internal read command to first data tAA 14.2514
(13.75)5,12 18.00 ns 11
Internal read command to first data with read DBI
enabled tAA_DBI tAA(min) + 3nCK tAA(max) + 3nCK ns 11
ACT to internal read or write delay time tRCD 14.25
(13.75)5,12 - ns 11
PRE command period tRP 14.2514
(13.75)5,12 - ns 11
ACT to PRE command period tRAS 32 9 x tREFI ns 11
ACT to ACT or REF command period tRC 46.25
(45.75)5,12 - ns 11
Normal Read DBI
CWL = 9 CL = 9 CL = 11 tCK(AVG) Reserved ns 1,2,3,4,10
CL = 10 CL = 12 tCK(AVG) 1.5 1.6 ns 1,2,3,10
CWL = 9,11
CL = 10 CL = 12 tCK(AVG) Reserved ns 4
CL = 11 CL = 13 tCK(AVG)
1.25 <1.5
ns 1,2,3,4,9
(Optional)5,12
CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,9
CWL = 10,12
CL = 12 CL = 14 tCK(AVG) Reserved ns 4
CL = 13 CL = 15 tCK(AVG)
1.071 <1.25
ns 1,2,3,4,9
(Optional)5,12
CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3,9
CWL = 11,14
CL = 14 CL = 17 tCK(AVG) Reserved ns 4
CL = 15 CL = 18 tCK(AVG)
0.937 <1.071
ns 1,2,3,4,9
(Optional)5,12
CL = 16 CL = 19 tCK(AVG) 0.937 <1.071 ns 1,2,3,9
CWL = 12,16
CL = 15 CL = 18 tCK(AVG) Reserved ns 4
CL = 16 CL = 19 tCK(AVG) Reserved ns 1,2,3,4,9
CL = 17 CL = 20 tCK(AVG)
0.833 <0.937
ns
1,2,3,4,9
(Optional)5,12 1,2,3,4,9
CL = 18 CL = 21 tCK(AVG) 0.833 <0.937 ns 1,2,3
CWL = 14.18
CL = 17 CL = 20 tCK(AVG) Reserved ns 1,2,3,4
CL = 18 CL = 21 tCK(AVG) Reserved ns 1,2,3,4
CL = 19 CL = 22 tCK(AVG) 0.75 <0.833 ns 1,2,3,4
CL = 20 CL = 23 tCK(AVG) 0.75 <0.833 ns 1,2,3
Supported CL Settings 10,11,12,13,14,15,16,17,18,19,20 nCK 12
Supported CL Settings with read DBI 12,13,14,15,17,18,19,20,21,22,23 nCK
Supported CWL Settings 9,10,11,12,14,16,18 nCK
- 37 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
16.2 Speed Bin Table Note
Absolute Specification
- VDDQ = VDD = 1.20V +/- 0.06 V
- VPP = 2.5V +0.25/-0.125 V
- The values defined with above-mentioned table are DLL ON case.
- DDR4-1600, 1866, 2133,2400 and 2666 Speed Bin Tables are valid only when Geardown Mode is disabled.
1. The CL setting and CWL setting result in tCK(avg).MIN and tCK(avg).MAX requirements. When making a selection of tCK(avg), both need to be fulfilled: Requirements from
CL setting as well as requirements from CWL setting.
2. tCK(avg).MIN limits: Since CAS Latency is not purely analog - data and strobe output are synchronized by the DLL - all possible intermediate frequencies may not be
guaranteed. CL in clock cycle is calculated from tAA following rounding algorithm defined in Section 13.5.
3. tCK(avg).MAX limits: Calculate tCK(avg) = tAA.MAX / CL SELECTED and round the resulting tCK(avg) down to the next valid speed bin (i.e. 1.5ns or 1.25ns or 1.071ns or
0.937ns or 0.833ns). This result is tCK(avg).MAX corresponding to CL SELECTED.
4. ‘Reserved’ settings are not allowed. User must program a different value.
5. 'Optional' settings allow certain devices in the industry to support this setting, however, it is not a mandatory feature. Refer to supplier's data sheet and/or the DIMM SPD
information if and how this setting is supported.
6. Any DDR4-1866 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/
Characterization.
7. Any DDR4-2133 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/
Characterization.
8. Any DDR4-2400 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/
Characterization.
9. Any DDR4-2666 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/
Characterization.
10. DDR4-1600 AC timing apply if DRAM operates at lower than 1600 MT/s data rate.
11. Parameters apply from tCK(avg) min to tCK(avg) max at all standard JEDEC clock period values as stated in the Speed Bin Tables.
12. CL number in parentheses, it means that these numbers are optional.
13. DDR4 SDRAM supports CL=9 as long as a system meets tAA(min).
14. Each speed bin lists the timing requirements that need to be supported in order for a given DRAM to be JEDEC compliant. JEDEC compliance does not require support for
all speed bins within a given speed. JEDEC compliance requires meeting the parameters for a least one of the listed speed bins.
- 38 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
17. Timing Parameters by Speed Grade
[ Table 27 ] Timing Parameters by Speed Bin for DDR4-1600 to DDR4-2666
Speed DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666
Units NOTE
Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
Clock Timing
Minimum Clock Cycle Time (DLL off mode) tCK
(DLL_OFF) 820820820820820ns
Average Clock Period tCK(avg) 1.25 <1.5 1.071 <1.25 0.937 <1.071 0.833 <0.937 0.750 <0.833 ns 35,36
Average high pulse width tCH(avg) 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 tCK(avg)
Average low pulse width tCL(avg) 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 tCK(avg)
Absolute Clock Period tCK(abs) tCK(avg)min + tJIT(per)min_tot
tCK(avg)m ax + tJIT(per)max_tot tCK(avg)
Absolute clock HIGH pulse width tCH(abs) 0.45 - 0.45 - 0.45 - 0.45 - 0.45 - tCK(avg) 23
Absolute clock LOW pulse width tCL(abs) 0.45 - 0.45 - 0.45 - 0.45 - 0.45 - tCK(avg) 24
Clock Period Jitter- total JIT(per)_tot -63 63 -54 54 -47 47 -42 42 -38 38 ps 23
Clock Period Jitter- deterministic JIT(per)_dj -31 31 -27 27 -23 23 -21 21 -19 19 ps 26
Clock Period Jitter during DLL locking peri-
od tJIT(per, lck) -50 50 -43 43 -38 38 -33 33 -30 30 ps
Cycle to Cycle Period Jitter tJIT(cc) - 125 - 107 - 94 - 83 - 75 ps
Cycle to Cycle Period Jitter during DLL
locking period tJIT(cc, lck) - 100 - 86 - 75 - 67 - 60 ps
Duty Cycle Jitter tJIT(duty) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD ps
Cumulative error across 2 cycles tERR(2per) -92 92 -79 79 -69 69 -61 61 -55 55 ps
Cumulative error across 3 cycles tERR(3per) -109 109 -94 94 -82 82 -73 73 -66 66 ps
Cumulative error across 4 cycles tERR(4per) -121 121 -104 104 -91 91 -81 81 -73 73 ps
Cumulative error across 5 cycles tERR(5per) -131 131 -112 112 -98 98 -87 87 -78 78 ps
Cumulative error across 6 cycles tERR(6per) -139 139 -119 119 -104 104 -92 92 -83 83 ps
Cumulative error across 7 cycles tERR(7per) -145 145 -124 124 -109 109 -97 97 -87 87 ps
Cumulative error across 8 cycles tERR(8per) -151 151 -129 129 -113 113 -101 101 -91 91 ps
Cumulative error across 9 cycles tERR(9per) -156 156 -134 134 -117 117 -104 104 -94 94 ps
Cumulative error across 10 cycles tERR(10per) -160 160 -137 137 -120 120 -107 107 -96 96 ps
Cumulative error across 11 cycles tERR(11per) -164 164 -141 141 -123 123 -110 110 -99 99 ps
Cumulative error across 12 cycles tERR(12per) -168 168 -144 144 -126 126 -112 112 -101 101 ps
Cumulative error across 13 cycles tERR(13per) -172 172 -147 147 -129 129 -114 114 -103 103 ps
Cumulative error across 14 cycles tERR(14per) -175 175 -150 150 -131 131 -116 116 -104 104 ps
Cumulative error across 15 cycles tERR(15per) -178 178 -152 152 -133 133 -118 118 -106 106 ps
Cumulative error across 16 cycles tERR(16per) -180 189 -155 155 -135 135 -120 120 -108 108 ps
Cumulative error across 17 cycles tERR(17per) -183 183 -157 157 -137 137 -122 122 -110 110 ps
Cumulative error across 18 cycles tERR(18per) -185 185 -159 159 -139 139 -124 124 -112 112 ps
Cumulative error across n = 13, 14 . . . 49,
50 cycles tERR(nper)
tERR(nper)min = ((1 + 0.68ln(n)) * tJIT(per)_total min)
tERR(nper)max = ((1 + 0.68ln(n)) * tJIT(per)_total max) ps
Command and Address setup time to
CK_t, CK_c referenced to Vih(ac) / Vil(ac)
levels
tIS(base) 115 - 100 - 80 - 62 - TBD - ps
Command and Address setup time to
CK_t,CK_c referenced to Vref levels tIS(Vref) 215 - 200 - 180 - 162 - TBD - ps
Command and Address hold time to CK_t,
CK_c referenced to Vih(dc) / Vil(dc) levels tIH(base)140-125-105-87-TBD-ps
Command and Address hold time to CK_t,
CK_c referenced to Vref levels tIH(Vref) 215 - 200 - 180 - 162 - TBD - ps
Control and Address Input pulse width for
each input tIPW 600-525-460-410-385-ps
Command and Address Timing
CAS_n to CAS_n command delay for same
bank group tCCD_L
max(5
nCK,
6.250 ns)
-
max(5
nCK,
5.355 ns)
-
max(5
nCK,
5.625 ns)
-
max(5
nCK,
5 ns)
-
max(5
nCK,
5 ns)
-nCK34
CAS_n to CAS_n command delay for dif-
ferent bank group tCCD_S 4 - 4 - 4 - 4 - 4 - nCK 34
ACTIVATE to ACTIVATE Command delay
to different bank group for 2KB page size tRRD_S(2K) Max(4nC
K,6ns) -Max(4nC
K,5.3ns) -Max(4nC
K,5.3ns) -Max(4nC
K,5.3ns) -Max(4nC
K,5.3ns) -nCK34
ACTIVATE to ACTIVATE Command delay
to different bank group for 2KB page size tRRD_S(1K) Max(4nC
K,5ns)
Max(4nC
K,4.2ns)
Max(4nC
K,3.7ns)
Max(4nC
K,3.3ns) -Max(4nC
K,3ns) -nCK34
- 39 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
ACTIVATE to ACTIVATE Command delay
to different bank group for 1/2KB page size tRRD_S(1/2K) Max(4nC
K,5ns)
Max(4nC
K,4.2ns)
Max(4nC
K,3.7ns)
Max(4nC
K,3.3ns) -Max(4nC
K,3ns) -nCK34
ACTIVATE to ACTIVATE Command delay
to same bank group for 2KB page size tRRD_L(2K) Max(4nC
K,7.5ns)
Max(4nC
K,6.4ns)
Max(4nC
K,6.4ns)
Max(4nC
K,6.4ns) -Max(4nC
K,6.4ns) -nCK34
ACTIVATE to ACTIVATE Command delay
to same bank group for 1KB page size tRRD_L(1K) Max(4nC
K,6ns)
Max(4nC
K,5.3ns)
Max(4nC
K,5.3ns)
Max(4nC
K,4.9ns) -Max(4nC
K,4.9ns) -nCK34
ACTIVATE to ACTIVATE Command delay
to same bank group for 1/2KB page size tRRD_L(1/2K) Max(4nC
K,6ns)
Max(4nC
K,5.3ns)
Max(4nC
K,5.3ns)
Max(4nC
K,4.9ns) -Max(4nC
K,4.9ns) -nCK34
Four activate window for 2KB page size tFAW_2K Max(28nC
K,35ns)
Max(28nC
K,30ns)
Max(28nC
K,30ns)
Max(28nC
K,30ns) -Max(28nC
K,30ns) -ns34
Four activate window for 1KB page size tFAW_1K Max(20nC
K,25ns)
Max(20nC
K,23ns)
Max(20nC
K,21ns)
Max(20nC
K,21ns) -Max(20nC
K,21ns) -ns34
Four activate window for 1/2KB page size tFAW_1/2K Max(16nC
K,20ns)
Max(16nC
K,17ns)
Max(16nC
K,15ns)
Max(16nC
K,13ns) -Max(16nC
K,12ns) -ns34
Delay from start of internal write transaction
to internal read command for different bank
group
tWTR_S max(2nC
K,2.5ns) -max(2nC
K,2.5ns) -max(2nC
K,2.5ns) -
max
(2nCK,
2.5ns)
-
max
(2nCK,
2.5ns)
-ns
1,2,e,3
4
Delay from start of internal write transaction
to internal read command for same bank
group
tWTR_L max(4nC
K,7.5ns) -max(4nC
K,7.5ns) -max(4nC
K,7.5ns) -
max
(4nCK,7.5
ns)
-
max
(4nCK,7.5
ns)
-1,34
Internal READ Command to PRECHARGE
Command delay tRTP max(4nC
K,7.5ns) -max(4nC
K,7.5ns) -max(4nC
K,7.5ns) -
max
(4nCK,7.5
ns)
-
max
(4nCK,7.5
ns)
-34
WRITE recovery time tWR 15 - 15 - 15 - 15 - 15 - ns 1
Write recovery time when CRC and DM are
enabled
tWR_CRC
_DM
tWR+max
(4nCK,3.7
5ns)
-
tWR+max
(5nCK,3.7
5ns)
-
tWR+max
(5nCK,3.7
5ns)
-
tWR+max
(5nCK,3.7
5ns)
-
tWR+max
(5nCK,3.7
5ns)
-ns1, 28
delay from start of internal write transaction
to internal read command for different bank
group with both CRC and DM enabled
tWTR_S_C
RC_DM
tWTR_S+
max
(4nCK,3.7
5ns)
-
tWTR_S+
max
(5nCK,3.7
5ns)
-
tWTR_S+
max
(5nCK,3.7
5ns)
-
tWTR_S+
max
(5nCK,3.7
5ns)
-
tWTR_S+
max
(5nCK,3.7
5ns)
-ns
2, 29,
34
delay from start of internal write transaction
to internal read command for same bank
group with both CRC and DM enabled
tWTR_L_C
RC_DM
tWTR_L+
max
(4nCK,3.7
5ns)
-
tWTR_L+
max
(5nCK,3.7
5ns)
-
tWTR_L+
max
(5nCK,3.7
5ns)
-
tWTR_L+
max
(5nCK,3.7
5ns)
-
tWTR_L+
max
(5nCK,3.7
5ns)
-ns
3,30,
34
DLL locking time tDLLK 597 - 597 - 768 - 768 - 854 - nCK
Mode Register Set command cycle time tMRD 8 - 8 - 8 - 8 - 8 - nCK
Mode Register Set command update delay tMOD max(24nC
K,15ns) -max(24nC
K,15ns) -max(24nC
K,15ns) -max(24nC
K,15ns) -max(24nC
K,15ns) -nCK50
Multi-Purpose Register Recovery Time tMPRR 1 - 1 - 1 - 1 - 1 - nCK 33
Multi Purpose Register Write Recovery
Time tWR_MPR
tMOD
(min)
+ AL + PL
-
tMOD
(min)
+ AL + PL
-
tMOD
(min)
+ AL + PL
-
tMOD
(min)
+ AL + PL
-
tMOD
(min)
+ AL + PL
-nCK
Auto precharge write recovery + precharge
time tDAL(min) Programmed WR + roundup (tRP / tCK(avg)) nCK
DQ0 or DQL0 driven to 0 set-up time to first
DQS rising edge tPDA_S 0.5 - 0.5 - 0.5 - 0.5 - 0.5 - UI 45,47
DQ0 or DQL0 driven to 0 hold time from
last DQS falling edge tPDA_H 0.5 - 0.5 - 0.5 - 0.5 - 0.5 - UI 46,47
CS_n to Command Address Latency
CS_n to Command Address Latency tCAL
max(3
nCK,
3.748 ns)
-
max(3
nCK,
3.748 ns)
-
max(3
nCK,
3.748 ns)
-
max(3
nCK,
3.748 ns)
-
max(3
nCK,
3.748 ns)
-nCK
Mode Register Set command cycle time in
CAL mode tMRD_tCAL tMOD+
tCAL -tMOD+
tCAL -tMOD+
tCAL -tMOD+
tCAL -tMOD+
tCAL -nCK
Mode Register Set update delay in CAL
mode tMOD_tCAL tMOD+
tCAL -tMOD+
tCAL -tMOD+
tCAL -tMOD+
tCAL -tMOD+
tCAL -nCK
DRAM Data Timing
DQS_t,DQS_c to DQ skew, per group, per
access tDQSQ - 0.16 - 0.16 - 0.16 - 0.17 - 0.18 tCK(avg)/
2
13,18,3
9,49
DQ output hold time per group, per access
from DQS_t,DQS_c tQH 0.76 - 0.76 - 0.76 - 0.74 - 0.74 - tCK(avg)/
2
13,17,1
8,39,49
Data Valid Window per device per UI: (tQH
- tDQSQ) of each UI on a given DRAM tDVWd 0.63 - 0.63 - 0.64 - 0.64 - TBD - UI 17,18,3
9,49
Data Valid Window, per pin per UI: (tQH -
tDQSQ) each UI on a pin of a given DRAM tDVWp 0.66 - 0.66 - 0.69 - 0.72 - 0.72 - UI 17,18,3
9,49
DQ low impedance time from CK_t, CK_c tLZ(DQ) -450 225 -390 195 -390 180 -330 175 -310 170 ps 39
DQ high impedance time from CK_t, CK_c tHZ(DQ) -225-195-180-175 - 170 ps 39
Data Strobe Timing
DQS_t, DQS_c differential READ Pre-am-
ble (1 clock preamble) tRPRE 0.9 NOTE44 0.9 NOTE44 0.9 NOTE44 0.9 NOTE
44 0.9 NOTE
44 tCK 39,40
Speed DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666
Units NOTE
Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
- 40 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
DQS_t, DQS_c differential READ Pream-
ble (2 clock preamble) tRPRE2 NA NA NA NA NA NA 1.8 NOTE
44 1.8 NOTE
44 tCK 39,41
DQS_t, DQS_c differential READ Postam-
ble tRPST 0.33 NOTE 45 0.33 NOTE 45 0.33 NOTE
45 0.33 NOTE
45 0.33 NOTE
45 tCK 39
DQS_t,DQS_c differential output high time tQSH 0.4 - 0.4 - 0.4 - 0.4 - 0.4 - tCK 21,39
DQS_t,DQS_c differential output low time tQSL 0.4 - 0.4 - 0.4 - 0.4 - 0.4 - tCK 20,39
DQS_t, DQS_c differential WRITE Pream-
ble (1 clock preamble) tWPRE 0.9 - 0.9 - 0.9 - 0.9 - 0.9 - tCK 42
DQS_t, DQS_c differential WRITE Pream-
ble (2 clock preamble) tWPRE2 NA NA NA 1.8 - 1.8 - tCK 43
DQS_t, DQS_c differential WRITE
Postamble tWPST 0.33 - 0.33 - 0.33 - 0.33 - 0.33 - tCK
DQS_t and DQS_c low-impedance time
(Referenced from RL-1) tLZ(DQS) -450 225 -390 195 -360 180 -330 175 -310 170 ps 39
DQS_t and DQS_c high-impedance time
(Referenced from RL+BL/2) tHZ(DQS) - 225 - 195 - 180 - 175 - 170 ps 39
DQS_t, DQS_c differential input low pulse
width tDQSL 0.46 0.54 0.46 0.54 0.46 0.54 0.46 0.54 0.46 0.54 tCK
DQS_t, DQS_c differential input high pulse
width tDQSH 0.46 0.54 0.46 0.54 0.46 0.54 0.46 0.54 0.46 0.54 tCK
DQS_t, DQS_c rising edge to CK_t, CK_c
rising edge (1 clock preamble) tDQSS -0.27 0.27 -0.27 0.27 -0.27 0.27 -0.27 0.27 -0.27 0.27 tCK 42
DQS_t, DQS_c rising edge to CK_t, CK_c
rising edge (2 clock preamble) tDQSS2 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD tCK 43
DQS_t, DQS_c falling edge setup time to
CK_t, CK_c rising edge tDSS 0.18 - 0.18 - 0.18 - 0.18 - 0.18 - tCK
DQS_t, DQS_c falling edge hold time from
CK_t, CK_c rising edge tDSH 0.18 - 0.18 - 0.18 - 0.18 - 0.18 - tCK
DQS_t, DQS_c rising edge output timing
locatino from rising CK_t, CK_c with DLL
On mode
tDQSCK
(DLL On) -225 225 -195 195 -180 180 -175 175 -170 170 ps 37,38,3
9
DQS_t, DQS_c rising edge output variance
window per DRAM
tDQSCKI
(DLL On) 370 330 310 290 270 ps 37,38,3
9
MPSM Timing
Command path disable delay upon MPSM
entry tMPED
tMOD(min
) +
tCP-
DED(min)
-
tMOD(min
) +
tCP-
DED(min)
-
tMOD(min
) +
tCP-
DED(min)
-
tMOD(min
) +
tCP-
DED(min)
-TBD-
Valid clock requirement after MPSM entry tCKMPE
tMOD(min
) +
tCP-
DED(min)
-
tMOD(min
) + tCP-
DED(min)
-
tMOD(min
) +
tCP-
DED(min)
-
tMOD(min
) +
tCP-
DED(min)
-TBD-
Valid clock requirement before MPSM exit tCKMPX tCKSRX(
min) -tCKSRX(
min) -tCKSRX(
min) -tCKSRX(
min) -TBD-
Exit MPSM to commands not requiring a
locked DLL tXMP tXS(min) - tXS(min) - tXS(min) - tXS(min) - TBD -
Exit MPSM to commands requiring a
locked DLL tXMPDLL
tXMP(min
) +
tXS-
DLL(min)
-
tXMP(min
) +
tXS-
DLL(min)
-
tXMP(min
) +
tXS-
DLL(min)
-
tXMP(min
) +
tXS-
DLL(min)
-TBD-
CS setup time to CKE tMPX_S tIS(min) +
tIHL(min) -tIS(min) +
tIHL(min) -tIS(min) +
tIHL(min) -tIS(min) +
tIHL(min) -TBD-
Calibration Timing
Power-up and RESET calibration time tZQinit 1024 - 1024 - 1024 - 1024 - 1024 - nCK
Normal operation Full calibration time tZQoper 512 - 512 - 512 - 512 - 512 - nCK
Normal operation Short calibration time tZQCS 128 - 128 - 128 - 128 - 128 - nCK
Reset/Self Refresh Timing
Exit Reset from CKE HIGH to a valid com-
mand tXPR
max
(5nCK,tR
FC(min)+
10ns)
-
max
(5nCK,tR
FC(min)+
10ns)
-
max
(5nCK,tR
FC(min)+
10ns)
-
max
(5nCK,tR
FC(min)+
10ns)
-
max
(5nCK,tR
FC(min)+
10ns)
-nCK
Exit Self Refresh to commands not requir-
ing a locked DLL tXS tRFC(min)
+10ns -tRFC(min)
+10ns -tRFC(min)
+10ns -tRFC(min)
+10ns -tRFC(min)
+10ns -nCK
SRX to commands not requiring a locked
DLL in Self Refresh ABORT
tX-
S_ABORT(mi
n)
tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -nCK
Exit Self Refresh to ZQCL,ZQCS and MRS
(CL,CWL,WR,RTP and Gear Down)
tXS_FAST
(min)
tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -tRFC4(mi
n)+10ns -nCK
Exit Self Refresh to commands requiring a
locked DLL tXSDLL tDLLK(mi
n) -tDLLK(mi
n) -tDLLK(mi
n) -tDLLK(mi
n) -tDLLK(mi
n) -nCK
Minimum CKE low width for Self refresh en-
try to exit timing tCKESR tCKE(min)
+1nCK -tCKE(min)
+1nCK -tCKE(min)
+1nCK -tCKE(min)
+1nCK -tCKE(min)
+1nCK -nCK
Speed DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666
Units NOTE
Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
- 41 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
Minimum CKE low width for Self refresh en-
try to exit timing with CA Parity enabled tCKESR_ PAR
tCKE(min)
+
1nCK+PL
-
tCKE(min)
+
1nCK+PL
-
tCKE(min)
+
1nCK+PL
-
tCKE(min)
+
1nCK+PL
-
tCKE(min)
+
1nCK+PL
-nCK
Valid Clock Requirement after Self Refresh
Entry (SRE) or Power-Down Entry (PDE) tCKSRE max(5nC
K,10ns) -max(5nC
K,10ns) -max(5nC
K,10ns) -
max
(5nCK,10
ns)
-
max
(5nCK,10
ns)
-nCK
Valid Clock Requirement after Self Refresh
Entry (SRE) or Power-Down when CA Par-
ity is enabled
tCKSRE_PAR
max
(5nCK,10
ns)+PL
-
max
(5nCK,10
ns)+PL
-
max
(5nCK,10
ns)+PL
-
max
(5nCK,10
ns)+PL
-
max
(5nCK,10
ns)+PL
-nCK
Valid Clock Requirement before Self Re-
fresh Exit (SRX) or Power-Down Exit
(PDX) or Reset Exit
tCKSRX max(5nC
K,10ns) -max(5nC
K,10ns) -max(5nC
K,10ns) -
max
(5nCK,10
ns)
-
max
(5nCK,10
ns)
-nCK
Power Down Timing
Exit Power Down with DLL on to any valid
command; Exit Precharge Power Down
with DLL frozen to commands not requiring
a locked DLL
tXP
max
(4nCK,6n
s)
-
max
(4nCK,6n
s)
-
max
(4nCK,6n
s)
-
max
(4nCK,6n
s)
-
max
(4nCK,6n
s)
-nCK
CKE minimum pulse width tCKE
max
(3nCK,
5ns)
-
max
(3nCK,
5ns)
-
max
(3nCK,
5ns)
-
max
(3nCK,
5ns)
-
max
(3nCK,
5ns)
- nCK 31,32
Command pass disable delay tCPDED 4 - 4 - 4 - 4 - 4 - nCK
Power Down Entry to Exit Timing tPD tCKE(min) 9*tREFI tCKE(min) 9*tREFI tCKE(min) 9*tREFI tCKE(min) 9*tREFI tCKE(min) 9*tREFI nCK 6
Timing of ACT command to Power Down
entry tACTPDEN 1 - 1 - 2 - 2 - 2 - nCK 7
Timing of PRE or PREA command to Pow-
er Down entry tPRPDEN1-1-2-2-2-nCK7
Timing of RD/RDA command to Power
Down entry tRDPDEN RL+4+1 - RL+4+1 - RL+4+1 - RL+4+1 - RL+4+1 - nCK
Timing of WR command to Power Down
entry (BL8OTF, BL8MRS, BC4OTF) tWRPDEN
WL+4+(t
WR/
tCK(avg))
-
WL+4+(t
WR/
tCK(avg))
-
WL+4+(t
WR/
tCK(avg))
-
WL+4+(t
WR/
tCK(avg))
-
WL+4+(t
WR/
tCK(avg))
-nCK4
Timing of WRA command to Power Down
entry (BL8OTF, BL8MRS, BC4OTF) tWRAPDEN WL+4+W
R+1 -WL+4+W
R+1 -WL+4+W
R+1 -WL+4+W
R+1 -WL+4+W
R+1 -nCK5
Timing of WR command to Power Down
entry (BC4MRS)
tWRP-
BC4DEN
WL+2+(t
WR/
tCK(avg))
-
WL+2+(t
WR/
tCK(avg))
-
WL+2+(t
WR/
tCK(avg))
-
WL+2+(t
WR/
tCK(avg))
-
WL+2+(t
WR/
tCK(avg))
-nCK4
Timing of WRA command to Power Down
entry (BC4MRS)
tWRAP-
BC4DEN
WL+2+W
R+1 -WL+2+W
R+1 -WL+2+W
R+1 -WL+2+W
R+1 -WL+2+W
R+1 -nCK5
Timing of REF command to Power Down
entry tREFPDEN 1 - 1 - 2 - 2 - 2 - nCK 7
Timing of MRS command to Power Down
entry tMRSPDEN tMOD(min
)-tMOD(min
)-tMOD(min
)-tMOD(min
)-tMOD(min
)-nCK
PDA Timing
Mode Register Set command cycle time in
PDA mode tMRD_PDA max(16nC
K,10ns) -max(16nC
K,10ns) -max(16nC
K,10ns) -max(16nC
K,10ns) -max(16nC
K,10ns) -nCK
Mode Register Set command update delay
in PDA mode tMOD_PDA tMOD tMOD tMOD tMOD tMOD nCK
ODT Timing
Asynchronous RTT turn-on delay (Power-
Down with DLL frozen) tAONAS 1.0 9.0 1.0 9.0 1.0 9.0 1.0 9.0 1.0 9.0 ns
Asynchronous RTT turn-off delay (Power-
Down with DLL frozen) tAOFAS 1.0 9.0 1.0 9.0 1.0 9.0 1.0 9.0 1.0 9.0 ns
RTT dynamic change skew tADC 0.3 0.7 0.3 0.7 0.3 0.7 0.3 0.7 0.3 0.7 tCK(avg)
Write Leveling Timing
First DQS_t/DQS_n rising edge after write
leveling mode is programmed tWLMRD 40 - 40 - 40 - 40 - 40 - nCK 12
DQS_t/DQS_n delay after write leveling
mode is programmed tWLDQSEN 25 - 25 - 25 - 25 - 25 - nCK 12
Write leveling setup time from rising CK_t,
CK_c crossing to rising DQS_t/DQS_n
crossing
tWLS 0.13 - 0.13 - 0.13 - 0.13 - 0.13 - tCK(avg)
Write leveling hold time from rising DQS_t/
DQS_n crossing to rising CK_t, CK_ cross-
ing
tWLH 0.13 -0.13 -0.13 -0.13 -0.13-tCK(avg)
Write leveling output delay tWLO 09.5 09.5 09.5 09.5 0 9.5 ns
Write leveling output error tWLOE 0 2 0 2 0 2 0 2 0 2 ns
CA Parity Timing
Commands not guaranteed to be executed
during this time
tPAR_UN-
KNOWN -PL -PL -PL -PL -PLnCK
Delay from errant command to ALERT_n
assertion
tPAR_ALERT
_ON - PL+6ns - PL+6ns - PL+6ns - PL+6ns - PL+6ns nCK
Speed DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666
Units NOTE
Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
- 42 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
Pulse width of ALERT_n signal when as-
serted
tPAR_ALERT
_PW 48 96 56 112 64 128 72 144 80 160 nCK
Time from when Alert is asserted till con-
troller must start providing DES commands
in Persistent CA parity mode
tPAR_ALERT
_RSP -43 -50 -57 -64 71 nCK
Parity Latency PL 4 4 4 5 5 nCK
CRC Error Reporting
CRC error to ALERT_n latency tCRC_ALERT 313 313 313 313 3 13 ns
CRC ALERT_n pulse width CRC_ALERT_
PW 610 610 610 610 6 10 nCK
Geardown timing
Exit RESET from CKE HIGH to a valid
MRS geardown (T2/Reset) tXPR_GEAR - - - - - - - - TBD
CKE High Assert to Gear Down Enable
time(T2/CKE) tXS_GEAR - - - - - - - - TBD
MRS command to Sync pulse time(T3) tSYNC_GEA
R - - - - - - - - TBD -27
Sync pulse to First valid command(T4) tCMD_GEAR - - - - - - - - TBD 27
Geardown setup time tGEAR_setup - - - - - - - - 2 - nCK
Geardown hold time tGEAR_hold - - - - - - - - 2 - nCK
tREFI
tRFC1 (min)
2Gb 160-160-160-160-160-ns34
4Gb 260-260-260-260-260-ns34
8Gb 350-350-350-350-350-ns34
16Gb 550 - 550 - 550 - 550 - 550 -ns34
tRFC2 (min)
2Gb 110 - 110 - 110 - 110 - 110 -ns34
4Gb 160-160-160-160-160-ns34
8Gb 260-260-260-260-260-ns34
16Gb 350 - 350 - 350 - 350 - 350 -ns34
tRFC4 (min)
2Gb 90 - 90 - 90 - 90 - 90 -ns34
4Gb 110 - 110 - 110 - 110 - 110 -ns34
8Gb 160-160-160-160-160-ns34
16Gb 260 - 260 - 260 - 260 - 260 - ns 34
Speed DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 DDR4-2666
Units NOTE
Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
- 43 -
datasheet DDR4 SDRAM
Rev. 1.91
Registered DIMM
NOTE :
1. Start of internal write transaction is defined as follows :
For BL8 (Fixed by MRS and on-the-fly) : Rising clock edge 4 clock cycles after WL.
For BC4 (on-the-fly) : Rising clock edge 4 clock cycles after WL.
For BC4 (fixed by MRS) : Rising clock edge 2 clock cycles after WL.
2. A separate timing parameter will cover the delay from write to read when CRC and DM are simultaneously enabled
3. Commands requiring a locked DLL are: READ (and RAP) and synchronous ODT commands.
4. tWR is defined in ns, for calculation of tWRPDEN it is necessary to round up tWR/tCK following rounding algorithm defined in "13.5 Rounding Algorithms".
5. WR in clock cycles as programmed in MR0.
6. tREFI depends on TOPER.
7. CKE is allowed to be registered low while operations such as row activation, precharge, autoprecharge or refresh are in progress, but power-down IDD spec will not be
applied until finishing those operations.
8. For these parameters, the DDR4 SDRAM device supports tnPARAM[nCK]=RU{tPARAM[ns]/tCK(avg)[ns]}, which is in clock cycles assuming all input clock jitter
specifications are satisfied
9. When CRC and DM are both enabled, tWR_CRC_DM is used in place of tWR.
10. When CRC and DM are both enabled tWTR_S_CRC_DM is used in place of tWTR_S.
11. When CRC and DM are both enabled tWTR_L_CRC_DM is used in place of tWTR_L.
12. The max values are system dependent.
13. DQ to DQS total timing per group where the total includes the sum of deterministic and random timing terms for a specified BER. BER spec and measurement method are
tbd.
14. The deterministic component of the total timing. Measurement method tbd.
15. DQ to DQ static offset relative to strobe per group. Measurement method tbd.
16. This parameter will be characterized and guaranteed by design.
17. When the device is operated with the input clock jitter, this parameter needs to be derated by the actual tjit(per)_total of the input clock. (output deratings are relative to the
SDRAM input clock). Example tbd.
18. DRAM DBI mode is off.
19. DRAM DBI mode is enabled. Applicable to x8 and x16 DRAM only.
20. tQSL describes the instantaneous differential output low pulse width on DQS_t - DQS_c, as measured from on falling edge to the next consecutive rising edge
21. tQSH describes the instantaneous differential output high pulse width on DQS_t - DQS_c, as measured from on falling edge to the next consecutive rising edge
22. There is no maximum cycle time limit besides the need to satisfy the refresh interval tREFI
23. tCH(abs) is the absolute instantaneous clock high pulse width, as measured from one rising edge to the following falling edge
24. tCL(abs) is the absolute instantaneous clock low pulse width, as measured from one falling edge to the following rising edge
25. Total jitter includes the sum of deterministic and random jitter terms for a specified BER. BER target and measurement method are tbd.
26. The deterministic jitter component out of the total jitter. This parameter is characterized and gauranteed by design.
27. This parameter has to be even number of clocks
28. When CRC and DM are both enabled, tWR_CRC_DM is used in place of tWR.
29. When CRC and DM are both enabled tWTR_S_CRC_DM is used in place of tWTR_S.
30. When CRC and DM are both enabled tWTR_L_CRC_DM is used in place of tWTR_L.
31. After CKE is registered LOW, CKE signal level shall be maintained below VILDC for tCKE specification (Low pulse width).
32. After CKE is registered HIGH, CKE signal level shall be maintained above VIHDC for tCKE specification (HIGH pulse width).
33. Defined between end of MPR read burst and MRS which reloads MPR or disables MPR function.
34. Parameters apply from tCK(avg)min to tCK(avg)max at all standard JEDEC clock period values as stated in the Speed Bin Tables.
35. This parameter must keep consistency with Speed-Bin Tables shown in section 10.
36. DDR4-1600 AC timing apply if DRAM operates at lower than 1600 MT/s data rate.
UI=tCK(avg).min/2
37. applied when DRAM is in DLL ON mode.
38. Assume no jitter on input clock signals to the DRAM
39. Value is only valid for RZQ/7 RONNOM = 34 ohms
40. 1tCK toggle mode with setting MR4:A11 to 0
41. 2tCK toggle mode with setting MR4:A11 to 1, which is valid for DDR4-2400/2666 speed grade.
42. 1tCK mode with setting MR4:A12 to 0
43. 2tCK mode with setting MR4:A12 to 1, which is valid for DDR4-2400/2666 speed grade.
44. The maximum read preamble is bounded by tLZ(DQS)min on the left side and tDQSCK(max) on the right side. Relationship”. Boundary of DQS Low-Z occur one cycle
earlier in 2tCK toggle mode which is illustrated.
45. DQ falling signal middle-point of transferring from High to Low to first rising edge of DQS diff-signal cross-point
46. last falling edge of DQS diff-signal cross-point to DQ rising signal middle-point of transferring from Low to High
47. VrefDQ value must be set to either its midpoint or Vcent_DQ(midpoint) in order to capture DQ0 or DQL0 low level for entering PDA mode.
48. The maximum read postamble is bound by tDQSCK(min) plus tQSH(min) on the left side and tHZ(DQS)max on the right side.
49. Reference level of DQ output signal is specified with a midpoint as a widest part of Output signal eye which should be approximately 0.7 * VDDQ as a center level of the
static single-ended output peak-to-peak swing with a driver impedance of 34 ohms and an effective test load of 50 ohms to VTT = VDDQ.
50. For MR7 commands, the minimum delay to a subsequent non-MRS command is 5nCK.
- 43 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
18. Physical Dimensions
18.1 1Gx8 based 1Gx72 Module (1 Rank) - M393A1K43BB0
133.35
Units : Millimeters
31.25
30.75
17.60
126.65
56.1064.60
A
CEDB
3.35
Detail A
1.50 ± 0.05
4.30
3.85 ± 0.10
0.85
0.25
E : 2.6
Detail B,E
0.6 ± 0.03
B : 2.1
Detail C
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
1.4 ± 0.10
Max 1.4
Max 1.4
18.1.1 x72 DIMM, populated as one physical rank of x8 DDR4 SDRAMs
The used device is 1G x8 DDR4 SDRAM, Flip-Chip.
DDR4 SDRAM Part NO : K4A8G085WB-BC**
* NOTE : Tolerances on all dimensions ±0.15 unless otherwise specified.
Address, Command and Control lines
D8 D5 D4 D0
D1 D2 D3 D6 D7
- 44 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
18.2 1Gx8 based 1Gx72 Module (1 Rank) -
133.35
Units : Millimeters
31.25
30.75
17.60
126.65
56.1064.60 3.35
Detail A
1.50 ± 0.05
4.30
3.85 ± 0.10
0.85
0.25
E : 2.6
Detail B,E
B : 2.1
Detail C
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
1.4 ± 0.10
Max 1.4
Max 1.4
AC E
0.6 ± 0.03
D B
M393A1K43BB1
18.2.1 x72 DIMM, populated as one physical rank of x8 DDR4 SDRAMs
The used device is 1G x8 DDR4 SDRAM, Flip-Chip.
DDR4 SDRAM Part NO : K4A8G085WB-BC**
* NOTE : Tolerances on all dimensions ±0.15 unless otherwise specified.
Address, Command and Control lines
D7 D5 D4 D0D2
D1 D3 D6 D8
- 45 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
18.3 2Gx4 based 2Gx72 Module (1 Rank) - M393A2K40BB0
133.35
Units : Millimeters
0.85
0.25
E : 2.6
Detail B,E
Detail A
1.50 ± 0.05
Detail C
31.25
30.75
17.60
126.65
4.30
B : 2.1
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
56.1064.60 3.35
3.85 ± 0.10
1.4 ± 0.10
Max 1.4
Max 1.4
0.6 ± 0.03
AC EDB
/M393A2K40BB1/M393A2K40BB2
18.3.1 2Gx72 DIMM, populated as one physical rank of x4 DDR4 SDRAMs
The used device is 2G x4 DDR4 SDRAM, Flip-Chip.
DDR4 SDRAM Part NO : K4A8G045WB-BC**
* NOTE : Tolerances on all dimensions ±0.15 unless otherwise specified.
Address, Command and Control lines
D18 D17 D16 D15 D10 D9 D8 D7 D6
D1 D2 D3 D4 D5 D11 D12 D13 D14
- 46 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
18.4 2Gx4 based 4Gx72 Module (2 Ranks) - M393A4K40BB0
133.35
Units : Millimeters
0.85
0.25
E : 2.6
Detail B,E Detail C
31.25
30.75
17.60
126.65
B : 2.1
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
56.1064.60 3.35
Detail A
1.50 ± 0.05
4.30
3.85 ± 0.10
1.4 ± 0.10
Max 1.4
Max 1.4
0.6 ± 0.03
A
CD
E B
18.4.1 4Gx72 DIMM, populated as two physical ranks of x4 DDR4 SDRAMs
The used device is 2G x4 DDR4 SDRAM, Flip-Chip.
DDR4 SDRAM Part NO : K4A8G045WB-BC**
* NOTE : Tolerances on all dimensions ±0.15 unless otherwise specified.
Address, Command and Control lines
D1 D2 D4 D5 D21 D22 D23 D24
D6 D7 D8 D9 D10 D25 D26 D27 D28
D32 D31 D30 D29 D15 D14 D13 D12 D11
D36 D35 D34 D33 D20 D19 D18 D17 D16
D3
- 47 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
18.5 2Gx4 based 4Gx72 Module (2 Ranks) -
133.35
Units : Millimeters
0.85
0.25
E : 2.6
Detail B,E
0.6 ± 0.03
Detail C
31.25
30.75
17.60
126.65
B : 2.1
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
56.1064.60 3.35
Detail A
1.50 ± 0.05
4.30
3.85 ± 0.10
1.4 ± 0.10
Max 1.4
Max 1.4
AD
E B
C
M393A4K40BB1
18.5.1 4Gx72 DIMM, populated as two physical ranks of x4 DDR4 SDRAMs
The used device is 2G x4 DDR4 SDRAM, Flip-Chip.
DDR4 SDRAM Part NO : K4A8G045WB-BC**
* NOTE : Tolerances on all dimensions ±0.15 unless otherwise specified.
Address, Command and Control lines
D1 D2 D4 D5
D21 D22 D23 D24
D6 D7 D8 D9 D10
D25 D26 D27 D28
D32 D31 D30 D29
D15 D14 D13 D12 D11
D36 D35 D34 D33
D20 D19 D18 D17 D16
D3
- 48 -
datasheet DDR4 SDRAMRegistered DIMM
Rev. 1.91
18.6 2Gx4 based 4Gx72 Module (2 Ranks) -
133.35
Units : Millimeters
0.85
0.25
E : 2.6
Detail B,E Detail C
31.25
30.75
17.60
126.65
B : 2.1
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
56.1064.60 3.35
Detail A
1.50 ± 0.05
4.30
3.85 ± 0.10
1.4 ± 0.10
Max 1.4
Max 1.4
0.6 ± 0.03
CDBA E
M393A4K40BB2
18.6.1 4Gx72 DIMM, populated as two physical ranks of x4 DDR4 SDRAMs
The used device is 2G x4 DDR4 SDRAM, Flip-Chip.
DDR4 SDRAM Part NO : K4A8G045WB-BC**
* NOTE : Tolerances on all dimensions ±0.15 unless otherwise specified.
Address, Command and Control lines
D1 D2 D3 D4 D5
D6 D7 D8 D9 D10
D21 D22 D23 D24
D25 D26 D27 D28
D15 D14 D13 D12 D11
D20 D19 D18 D17 D16
D32 D31 D30 D29
D36 D35 D34 D33
