PRODUCT
SELECTION
GUIDE
Displays, Memory and Storage
2H 2014
CONTaCTS DISPLayS STORaGE MCP FLaSh - SSD DRaM
To access our online sales portal, visit: https://smarttools.ssi.samsung.com
www.samsung.com/us/oem-solutions
MOBILE/WIRELESS
NOTEBOOK PCs/
ULTRABOOKS™
DESKTOP PCs/
WORKSTATIONS
NETWORKING/
COMMUNICATIONS
CONSUMER
ELECTRONICS
Markets DRAM SSD FLASH ASIC LOGIC TFT/LCD ODD
SERVERS
Samsung continues to lead the industry with the broadest portfolio of memory products and
display technology. Its display panels, DRAM, flash, mobile and graphics memory are found in many
computers – from ultrabooks to powerful servers – and in a wide range of handheld devices such
as smartphones and tablets. Samsung is also a leader in TV displays. In addition, Samsung provides
the industry’s widest line of storage products from the consumer to enterprise levels. These include
optical disc drives as well as flash storage, such as Solid State Drives, and a range of embedded flash
storage products.
Samsung Semiconductor, Inc.
TaBLE OF CONTENTS
//
DRaM PAGES 4–13
samsung.com/dram
• DDR4 SDRAM
• DDR3 SDRAM
• DDR2 SDRAM
• Graphics DRAM
• Mobile DRAM
• Ordering Info
ASH - SSD PAGES 14–15
samsung.com/flash
• eMMC • Solid State Drives (SSD)
MULTI-ChIP PaCKaGES PAGES 16–17
samsung.com/mcp
• eMMC + LPDDR2
• eMMC + LPDDR3
STORaGE PAGES 18–20
samsung.com/flash-ssd samsungodd.com
• Solid State Drives • Optical Disc Drives
DISPLayS PAGES 21–22
samsungdisplay.com
• Public Information Display
(PID) Product Classification
• SNB/UNB
• Indoor PID
• E-Board
• Outdoor PID
• Tablets
• Monitors
CONTaCTS PAGES 23–31
samsung.com/us/oem-solutions
• Sales Representatives and Distributors
• To access our online sales portal, visit: https://smarttools.ssi.samsung.com
DRaM
samsung.com/dram
42H 2014DDR4 SDRAM samsung.com/dram
DDR4 SDRAM REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
8GB 1.2V 1Gx 72 M393A1G40DB0-CPB/CRC 4Gb (1G x4) * 18 Lead Free & Halogen Free, Flip Chip 2133/2400 1 Now
M393A1G43DB0-CPB/CRC 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 2133/2400 2 Now
16GB 1.2V 2Gx 72
M393A2G40DB0-CPB/CRC 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 2133/2400 2 Now
M393A2K40BB0-CPB/CRC 8Gb (2G x4) * 18 Lead Free & Halogen Free 2133/2400 1 1Q'15
M393A2K43BB0-CPB/CRC 8Gb (1G x8) * 18 Lead Free & Halogen Free 2133/2400 1 1Q'15
32GB 1.2V 4Gx 72 M393A4K40BB0-CPB/CRC 8Gb (2G x4) * 36 Lead Free & Halogen Free 2133/2400 2 1Q'15
64GB TSV 1.2V 8Gx 72 M393A8G40D40-CRB 4Gb (4Gx4)*36 Lead Free & Halogen Free 2133 4 Now
Notes: DDR4 4Gb based 0=IDT 2 =Montage PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
DDR4 8Gb based 0=IDT 4 =Montage PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
DDR4 SDRAM COMPONENTS
Density Voltage Organization Part Number # Pins-Package Compliance Speed (Mbps) Dimensions Production
4Gb 1.2V
1G x 4 K4A4G045WD-BCRC/PB 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x11mm Now
512M x8 K4A4G085WD-BCRC/PB 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 2400/2133 7.5x11mm Now
256Mx16 K4A4G165WD-BCRC/PB 96 Ball -FBGA Lead Free & Halogen Free 2400/2133 7.5x13.3mm Now
8Gb 1.2V 2G x 4 K4A8G045WB-BCRC/PB 78 ball FBGA Lead Free & Halogen Free 2400/2133 2Q'15
1G x 8 K4A8G085WB-BCRC/PB 78 ball FBGA Lead Free & Halogen Free 2400/2133 2Q'15
DDR4 SDRAM LOAD REDUCED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
32GB 1.2V 4Gx 72 M386A4G40DM0-CPB/CRC 4Gb DDP (2Gx4) * 36 Lead Free & Halogen Free 2133/2400 4 Now
64GB 1.2V 8Gx 72 M386A8K40BM0-CPB/CRC 8Gb DDP (4Gx4) * 36 Lead Free & Halogen Free 2133/2400 4 1Q'15
Notes: DDR4 4Gb based 0=IDT 2 =Montage PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
DDR4 8Gb based 0=IDT 4 =Montage PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
DDR4 SDRAM UNBUFFERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
4GB 1.2V 512Mx 64 M378A5143DB0-CPB/CRC 4Gb (512M x8) *8 Lead Free & Halogen Free 2133/2400 1 Now
M378A5144BB0-CPB/CRC 8Gb (1G x16) * 4 Lead Free & Halogen Free 2133/2400 1 2Q'15
8GB 1.2V 1Gx 64 M378A1G43DB0-CPB/CRC 4Gb (512M x8) *16 Lead Free & Halogen Free 2133/2400 2 Now
M378A1K43BB0-CPB/CRC 8Gb (1G x8) * 8 Lead Free & Halogen Free 2133/2400 1 2Q'15
16GB 1.2V 2Gx 64 M378A2K43BB0-CPB/CRC 8Gb (1G x8) * 16 Lead Free & Halogen Free 2133/2400 2 2Q'15
Notes: PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
DDR4 SDRAM ECC UNBUFFERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
8GB 1.2V 1G x72 M391A1G43DB0-CPB/CRC 4Gb (512M x8) * 18 Lead Free & Halogen Free 2133/2400 2 Now
M391A1K43BB0-CPB/CRC 8Gb (1G x8) * 9 Lead Free & Halogen Free 2133/2400 1 2Q'15
16GB 1.2V 2G x72 M391A2G43BB0-CPB/CRC 8Gb (1G x8) * 18 Lead Free & Halogen Free 2133/2400 2 2Q'15
Notes: PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
DDR4 SDRAM SODIMM MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
4GB 1.2V 512Mx 64 M471A5143DB0-CPB/CRC 4Gb (512M x8) * 8 Lead Free & Halogen Free 2133/2400 1 Now
M471A5143BB0-CPB/CRC 8Gb (1G x16) * 4 Lead Free & Halogen Free 2133/2400 1 2Q'15
8GB 1.2V 1Gx 64 M471A1G43DB0-CPB/CRC 4Gb (512M x8) * 16 Lead Free & Halogen Free 2133/2400 2 Now
M471A1K43BB0-CPB/CRC 8Gb (1G x8) * 8 Lead Free & Halogen Free 2133/2400 1 2Q'15
16GB 1.2V 2Gx 64 M471A2K43BB0-CPB/CRC 8Gb (1G x8) * 16 Lead Free & Halogen Free 2133/2400 2 2Q'15
Notes: PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
samsung.com/dram 5
DRAM
2H 2014 DDR3 SDRAM
DDR3 SDRAM VLP REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed
(Mbps) Ranks Production
8GB
1.5V
1Gx72
M392B1G70DB0-CMA (03/04) 4Gb(1Gx4) * 18 Lead Free & Halogen Free, Flip Chip 1866 1 Now
1.35V M392B1G70DB0-YK0(03/04) 4Gb(1Gx4) * 18 Lead Free & Halogen Free, Flip Chip 1600 1 Now
1.5V M392B1G73DB0-CMA (03/04) 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 1866 2 Now
1.35V M392B1G73DB0-YK0 (03/04) 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip 1600 2 Now
16GB 1.5V 2Gx72 M392B2G70DM0-CMA (03/04) 4Gb DDP (2G DDP x4) * 18 Lead Free & Halogen Free, Flip Chip 1866 2 Now
1.35V M392B2G70DM0-YK0 (03/04) 4Gb DDP (2G DDP x4) * 18 Lead Free & Halogen Free, Flip Chip 1600 2 Now
32GB 1.35V 4Gx72 M392B4G70DE0-YH9 (03/04) 4Gb QDP (4G x4) * 18 Lead Free & Halogen Free, Flip Chip 1333 4 Now
Notes: 2 = IDT Alpine 3 = Inphi XV-GS02 K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)
DDR4 SDRAM ECC SODIMM MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
8GB 1.2V 1G x72 M474A1K43BB0-CPB/RC 8Gb (1G x8) * 9 Lead Free & Halogen Free 2133/2400 1 2Q'15
M474A1G43DB0-CPB/CRC 4Gb (512M x8) * 18 Lead Free & Halogen Free 2133/2400 2 Now
16GB 1.2V 2G x72 M474A2K43BB0-CPB/RC 8Gb (1G x8) * 18 Lead Free & Halogen Free 2133/2400 2 2Q'15
Notes: 0 =IDT 2 =Montage PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)
DDR3 SDRAM REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed
(Mbps) Ranks Production
8GB 1.5V 1Gx72
M393B1K70QB0-CMA (08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free, Flip Chip 1866 2 Now
M393B1G70QH0-CMA (08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1866 1 Now
M393B1G73QH0-CMA (08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1866 2 Now
16GB 1.5V 2Gx72 M393B2G70QH0-CM (08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1866 2 Now
M393B2G70DB0-CMA (02/03) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1866 2 Now
8GB 1.35V 1Gx72 M393B1K70QB0-YK0 (08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free, Flip Chip 1600 2 Now
M393B1G70QH0-YK0 (08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1600 1 Now
16GB 1.35V 2Gx72 M393B2G70QH0-YK0 (08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1600 2 Now
M393B2G70DB0-YK0 (02/03) 4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip 1600 2 Now
32GB 1.35V 4Gx72 M393B4G70DM0-YH9(02/03) 8Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1333 4 Now
Notes: 8 = IDT A1 Evergreen
9 = Inphi UVGS02
2 = IDT Alpine
3 = Inphi XV-GS02
F8 = DDR3-1066 (7-7-7)
H9 = DDR3-1333 (9-9-9)
K0 = DDR3-1600 (11-11-11)
MA = DDR3-1866 (13-13-13)
DDR3 SDRAM Load Reduced REGISTERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed
(Mbps) Ranks Production
32GB 1.35V 4Gx72 M386B4G70DM0-YK0(3/4) 8Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1600 4 Now
1.5V M386B4G70DM0-CMA(3/4) 8Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1866 4 Now
64GB 1.35V 8Gx72 M386B8G70DE0-YH9(4) 16Gb QDP (4G x4) * 36 Lead Free & Halogen Free 1333 8 Now
1.5V M386B8G70DE0-CK0(4) 16Gb QDP (4G x4) * 36 Lead Free & Halogen Free 1600 8 Now
Notes: 3 = Inphi iMB GS02B 4 = Montage C1
DDR3 SDRAM UNBUFFERED MODULES (ECC)
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
8GB 1.5V 1024Mx72 M391B1G73QH0-CMA 4Gb (512M x8) * 18 Lead Free & Halogen Free 1866 2 Now
1.35V M391B1G73QH0-YK0 4Gb (512M x8) * 18 Lead Free & Halogen Free 1600 2 Now
Notes: H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)
samsung.com/dram
62H 2014
DDR3 SDRAM COMPONENTS
Density Voltage Organization Part Number # Pins-
Package Compliance Speed
(Mbps) Dimensions Production
1Gb 1.5V
256M x4 K4B1G0446G-BC(H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600/1866 7.5x11mm Now
128M x8 K4B1G0846G-BC(H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600/1866 7.5x11mm Now
128M x16 K4B1G1646G-BC(H9/K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600/186/2133 7.5x13.3mm Now
2Gb 1.5V
512M x4 K4B2G0446Q-BC(K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x11mm Now
256M x8 K4B2G0846Q-BC(K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x11mm Now
128M x16 K4B2G1646Q-BC(K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x13.3mm Now
4Gb 1.5V
1G x4 K4B4G0446Q-HC(K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1600/1866 10x11mm Now
512M x8 K4B4G0846Q-HC(K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1600/1866 10x11mm Now
512M x8 K4B4G0846D-BC(K0/MA/NB) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x11mm Now
256Mx16 K4B4G1646Q-HC(K0/MA) 96 Ball -FBGA Lead Free & Halogen Free 1600/1866 10x13.3mm Now
1Gb 1.35V
256Mx16 K4B4G1646D-BC(K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866/2133 7.5x13.3mm Now
256M x4 K4B1G0446G-BY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600 7.5x11mm Now
128M x8 K4B1G0846G-BY(H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600 7.5x11mm Now
2Gb 1.35V
128M x16 K4B1G1646G-BY(H9/K0) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1333/1600 7.5x13.3mm Now
512M x4 K4B2G0446Q-BYK0 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600 7.5x11mm Now
256M x8 K4B2G0846Q-BYK0/MA 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x11mm Now
128M x16 K4B2G1646Q-BYK0/MA 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x13.3mm Now
4Gb 1.35V
1G x4 K4B4G0446Q-HYK0 78 Ball -FBGA Lead Free & Halogen Free 1600 10x11mm Now
512M x8 K4B4G0846Q-HYK0 78 Ball -FBGA Lead Free & Halogen Free 1600 10x11mm Now
512M x8 K4B4G0846D-BYK0 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600 7.5x11mm Now
256Mx16 K4B4G1646Q-HYK0 96 Ball -FBGA Lead Free & Halogen Free 1600 10x13.3mm Now
256Mx16 K4B4G1646D-BYK0/MA 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866 7.5x13.3mm Now
8Gb 1.35V 512Mx16 K4B8G1646Q-MYK0 96 Ball -FBGA Lead Free & Halogen Free 1600 11x13.3mm Now
Notes: H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) NB = DDR3-2133 (14-14-14)
DDR3 SDRAM & DDR2 SDRAM
DDR3 SDRAM ECC SODIMM MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
8GB 1.5V 1024Mx64 M474B1G73QH0-CMA 4Gb x8*18 Lead Free & Halogen Free 1866 2 Now
1.35V M474B1G73QH0-YK0 4Gb x8*18 Lead Free & Halogen Free 1600 2 Now
DDR3 SDRAM UNBUFFERED MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
2GB 1.5V 256Mx64 M378B5773QB0-CK0/MA 2Gb (256M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now
4GB
1.5V
512Mx64
M378B5173QH0-CK0/MA 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now
M378B5173DB0-CK0/MA 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now
M378B5173EB0-CK0/MA 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600/1866 1 Now
1.35V M378B5173QH0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 2Q'15
M378B5173EB0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 2Q'15
8GB
1.5V
1024Mx64
M378B1G73QH0-CK0/MA 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600/1866 2 Now
M378B1G73DB0-CK0/MA 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600/1866 2 Now
M378B1G73EB0-CK0/MA 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600/1866 2 Now
1.35V M378B1G73QH0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 2Q'15
M378B1G73EB0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 2Q'15
Notes: K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)
samsung.com/dram 7
DRAM
2H 2014
DDR2 SDRAM COMPONENTS
Density Organization Part Number # Pins-Package Dimensions Package Speed (Mbps) Production
512Mb 64M x8 K4T51083QQ-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now
32M x16 K4T51163QQ-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now
1Gb 128M x8 K4T1G084QG-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now
64M x16 K4T1G164QG-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free , Flip chip 667/800/1066 Now
Notes: E6 = DDR2-667 (5-5-5) E7 = DDR2-800 (5-5-5) F7 = DDR2-800 (6-6-6) F8 = DDR2-1066 (7-7-7)
Graphics DRAM
GRAPHICS DRAM COMPONENTS
Type Density Organization Part Number Package VDD/VDDQ Speed Bin (MHz) Production
GDDR5
8Gb 256Mx32
K4G80325FB-HC(04/03/28/25) 170-FCFBGA 1.5V/1.5V 5000/6000/7000/8000 CS: '15,1Q
K4G80325FB-HC(04/03/28/25) 170-FCFBGA 1.35V/1.35V 4000/5000/(6000)/
(7000) CS: '15,1Q
4Gb 128Mx32
K4G41325FC-HC(04/03/28) 170-FCFBGA 1.5V/1.5V 5000/6000/7000 Now
K4G41325FC-HC(04/03) 170-FCFBGA 1.35V/1.35V 4000/5000 Now
2Gb 64Mx32
K4G20325FS-HC(04/03) 170-FBGA 1.5V/1.5V 5000/6000 Now
K4G20325FS-HC(04/03) 170-FBGA 1.35V/1.35V 4000/5000 Now
K4G20325FD-FC(04/03/28) 170-FBGA 1.5V/1.5V 5000/6000/7000 Now
K4G20325FD-FC(04/03) 170-FBGA 1.35V/1.35V 4000/5000 Now
gDDR3
4Gb 256Mx16
K4W4G1646E-BC(1A/1B) 96-FCFBGA 1.5V/1.5V 2133/2400 CS: '14,Oct
K4W4G1646E-BC(1A/1B) 96-FCFBGA 1.35V/1.35V 1866/2133 CS: '14,Oct
K4W4G1646D-BC(12/11/1A) 96-FCFBGA 1.5V/1.5V 1600/1866/2133 Now
K4W4G1646D-BC(1A) 96-FCFBGA 1.35V/1.35V 1866 Now
K4W4G1646D-BY(12) 96-FCFBGA 1.35V/1.35V 1600 Now
2Gb 128Mx16
K4W2G1646Q-BC(12/11/1A) 96-FCFBGA 1.5V/1.5V 1600/1866/2133 Now
K4W2G1646Q-BC(1A) 96-FCFBGA 1.35V/1.35V 1866 Now
K4W2G1646Q-BY(12) 96-FCFBGA 1.35V/1.35V 1600 Now
Notes: Package
(1) Speeds (clock cycle - speed bin)
H: FBGA (Halogen Free & Lead Free) (DDR3)
B: FCFBGA (Halogen Free & Lead Free) (DDR3)
H: FCFBGA (Halogen Free & Lead Free) (GDDR5)
F: FBGA (Halogen Free & Lead Free) (GDDR5)
25: 0.25ns (8000Mbps)
28: 0.28ns (7000Mbps)
03: 0.3ns (6000Mbps)
04: 0.4ns (5000Mbps)
05: 0.5ns (4000Mbps)
1B: 8.3ns (2400Mbps gDDR3)
1A: 1.0ns (2133Mbps gDDR3)
11: 1.1ns (1866Mbps)
12: 1.25ns (1600Mbps)
DDR3 SDRAM SODIMM MODULES
Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production
2GB 1.35V 256Mx64 M471B5674QH0-YK0 4Gb (256M x16) * 4 Lead Free & Halogen Free 1600 1 Now
4GB 1.35V 512Mx64
M471B5173QH0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 Now
M471B5173DB0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 Now
M471B5173EB0-YK0 4Gb (512M x8) * 8 Lead Free & Halogen Free 1600 1 Now
8GB 1.35V 1024Mx64
M471B1G73QH0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 Now
M471B1G73DB0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 Now
M471B1G73EB0-YK0 4Gb (512M x8) * 16 Lead Free & Halogen Free 1600 2 Now
Notes: H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)
samsung.com/dram
82H 2014Mobile DRAM
MOBILE DRAM COMPONENTS
Type Density Organization Part Number Package Power Production
LPDDR2
4Gb
1CH x32 K4P4G324EQ-AGC2 168-FBGA, 12x12 PoP, SDP, 1066Mbps 1.8V/1.2V/1.2V Now
1CH x32 K4P4G324EQ-FGC2 134-FBGA, 11x11.5 , SDP, 1066Mbps 1.8V/1.2V/1.2V Now
8Gb
1CH x32 K4P8G304EQ-AGC2 168-FBGA, 12x12 PoP, DDP, 1066Mbps 1.8V/1.2V/1.2V Now
1CH x32 K4P8G304EQ-PGC2 216-FBGA, 12x12 PoP, DDP, 1066Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3PE7E70QM-BGC2 216-FBGA, 12x12 PoP, DDP, 1066Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3PE7E70QM-CGC2 220-FBGA, 14x14 PoP, DDP, 1066Mbps 1.8V/1.2V/1.2V Now
12Gb 1CH x32 K4P2E304EQ-AGC2 168-FBGA, 12x12 PoP, TDP, 1066Mbps 1.8V/1.2V/1.2V Now
16Gb
1CH x32 K4PAG304EQ-AGC2 168-FBGA, 12x12 PoP, QDP, 1066Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3PE0E00QM-BGC2 216-FBGA, 12x12 PoP, QDP, 1066Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3PE0E00QM-CGC2 220-FBGA, 14x14 PoP, QDP, 1066Mbps 1.8V/1.2V/1.2V Now
LPDDR3
4Gb 1CH x32 K4E4E324EE-EGCE 178-FBGA, 11x11.5, SDP, 1600Mbps 1.8V/1.2V/1.2V Now
8Gb
1CH x32 K4E8E304EE-EGCE 178-FBGA, 11x11.5, DDP, 1600Mbps 1.8V/1.2V/1.2V Now
1CH x32 K4E8E304EE-AGCE 168-FBGA, 12x12, DDP, 1600Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3QF1F10EM-AGCE 253-FBGA, 11x11.5, DDP, 1600Mbps 1.8V/1.2V/1.2V Now
12Gb 1CH x32 K4E2E304EE-AGCE 168-FBGA, 12x12, TDP, 1600Mbps 1.8V/1.2V/1.2V Now
16Gb
1CH x32 K4E6E304EE-EGCE 178-FBGA, 11x11.5, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
1CH x32 K4E6E304EE-AGCE 168-FBGA, 12x12, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3QF2F20EM-AGCE 253-FBGA, 11x11.5, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3QF2F20EM-FGCE 256-FBGA, 14x14 PoP, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3QF2F20EM-QGCE 216-FBGA, 15x15 PoP, QDP,1600Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3MF8F80DM-MGCE 504-FBGA, 15x15 PoP, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
24Gb
2CH x32 K3QF6F60MM-FGCE 256-FBGA, 14x14 PoP, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3QF6F60MM-QGCE 216-FBGA, 15x15 PoP, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
2CH x32 K3MF9F90MM-MGCE 504-FBGA, 15x15 PoP, QDP, 1600Mbps 1.8V/1.2V/1.2V Now
samsung.com/dram 9
DRAM
2H 2014 DRAM Ordering Information
1. Memory (K)
2. DRAM: 4
3. DRAM Type
B: DDR3 SDRAM
D: GDDR SDRAM
G: GDDR5 SDRAM
H: DDR SDRAM
J: GDDR3 SDRAM
M: Mobile SDRAM
N: SDDR2 SDRAM
S: SDRAM
T: DDR SDRAM
U: GDDR4 SDRAM
V: Mobile DDR SDRAM Power Efficient Address
W: SDDR3 SDRAM
X: Mobile DDR SDRAM
Y: XDR DRAM
Z: Value Added DRAM
4. Density
10: 1G, 8K/32ms
16: 16M, 4K/64ms
26: 128M, 4K/32ms
28: 128M, 4K/64ms
32: 32M, 2K/32ms
50: 512M, 32K/16ms
51: 512M, 8K/64ms
52: 512M, 8K/32ms
54: 256M, 16K/16ms
55: 256M, 4K/32ms
56: 256M, 8K/64ms
62: 64M, 2K/16ms
64: 64M, 4K/64ms
68: 768M, 8K/64ms
1G: 1G, 8K/64ms
2G: 2G, 8K/64ms
4G: 4G, 8K/64ms
5. Bit Organization
02: x2
04: x4
06: x4 Stack (Flexframe)
07: x8 Stack (Flexframe)
08: x8
15: x16 (2CS)
16: x16
26: x4 Stack (JEDEC Standard)
27: x8 Stack (JEDEC Standard)
30: x32 (2CS, 2CKE)
31: x32 (2CS)
32: x32
6. # of Internal Banks
2: 2 Banks
3: 4 Banks
4: 8 Banks
5: 16 Banks
7. Interface ( VDD, VDDQ)
2: LVTTL, 3.3V, 3.3V
4: LVTTL, 2.5V, 2.5V
5: SSTL-2 1.8V, 1.8V
6: SSTL-15 1.5V, 1.5V
8: SSTL-2, 2.5V, 2.5V
A: SSTL, 2.5V, 1.8V
F: POD-15 (1.5V,1.5V)
H: SSTL_2 DLL, 3.3V, 2.5V
M: LVTTL, 1.8V, 1.5V
N: LVTTL, 1.5V, 1.5V
P: LVTTL, 1.8V, 1.8V
Q: SSTL-2 1.8V, 1.8V
R: SSTL-2, 2.8V, 2.8V
U: DRSL, 1.8V, 1.2V
8. Generation
A: 2nd Generation
B: 3rd Generation
C: 4th Generation
D: 5th Generation
E: 6th Generation
F: 7th Generation
G: 8th Generation
H: 9th Generation
I: 10th Generation
J: 11th Generation
K: 12th Generation
M: 1st Generation
N: 14th Generation
Q: 17th Generation
9. Package Type
DDR2 DRAM
L: TSOP II (Lead-free & Halogen-free)
H: FBGA (Lead-free & Halogen-free)
F: FBGA for 64Mb DDR (Lead-free & Halogen-free)
6: sTSOP II (Lead-free & Halogen-free)
T: TSOP II
N: sTSOP II
G: FBGA
U: TSOP II (Lead-free)
V: sTSOP II (Lead-free)
Z: FBGA (Lead-free)
DDR2 SDRAM
Z: FBGA (Lead-free)
J: FBGA DDP (Lead-free)
Q: FBGA QDP (Lead-free)
H: FBGA (Lead-free & Halogen-free)
M: FBGA DDP (Lead-free & Halogen-free)
E: FBGA QDP (Lead-free & Halogen-free)
T: FBGA DSP (Lead-free & Halogen-free, Thin)
DDR3 SDRAM
Z: FBGA (Lead-free)
H: FBGA (Halogen-free & Lead-free)
Graphics Memory
Q: TQFP
U: TQFP (Lead Free)
G: 84/144 FBGA
V: 144 FBGA (Lead Free)
Z: 84 FBGA (Lead Free)
T: TSOP
L: TSOP (Lead Free)
A: 136 FBGA
B: 136 FBGA (Lead Free)
H: FBGA (Hologen Free & Lead Free)
E: 100 FBGA (Hologen Free & Lead Free)
SDRAM
L TSOP II (Lead-free & Halogen-free)
N: STSOP II
T: TSOP II
U: TSOP II (Lead-free)
V: sTSOP II (Lead-free)
COMPONENT DRAM ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11
K 4 T XX XX X X X X X XX
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Generation
Interface (VDD, VDDQ)
Number of Internal Banks
samsung.com/dram
10 2H 2014DRAM Ordering Information
COMPONENT DRAM ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11
K 4 T XX XX X X X X X XX
XDR DRAM
J: BOC(LF) P: BOC
Mobile DRAM
Leaded/Lead Free
G/A: 52balls FBGA Mono
R/B: 54balls FBGA Mono
X/Z: 54balls BOC Mono
J/V: 60(72)balls FBGA Mono 0.5pitch
L /F: 60balls FBGA Mono 0.8pitch
S/D: 90balls FBGA
Monolithic (11mm x 13mm)
F/H: Smaller 90balls FBGA Mono
Y/P: 54balls CSP DDP
M/E: 90balls FBGA DDP
10. Temp & Power - COMMON
(Temp, Power)
C: Commercial, Normal (0’C – 95’C) & Normal
Power
C: (Mobile Only) Commercial (-25 ~ 70’C), Normal
Power
J: Commercial, Medium
L: Commercial, Low (0’C – 95’C) & Low Power
L: (Mobile Only) Commercial, Low, i-TCSR
F: Commercial, Low, i-TCSR & PASR & DS
E: Extended (-25~85’C), Normal
N: Extended, Low, i-TCSR
G: Extended, Low, i-TCSR & PASR & DS
I: Industrial, Normal (-40’C – 85’C) & Normal
Power
P: Industrial, Low (-40’C – 85’C) & Low Power
H: Industrial, Low, i-TCSR & PASR & DS
11. Speed (Wafer/Chip Biz/BGD: 00)
DDR SDRAM
CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3)
B3: DDR333 (166MHz @ CL=2.5, tRCD=3,
tRP=3) *1
A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3)
B0: DDR266 (133MHz @ CL=2.5, tRCD=3,
tRP=3)
Note 1: "B3" has compatibility with "A2" and "B0"
DDR2 SDRAM
CC: DDR2-400 (200MHz @ CL=3, tRCD=3,
tRP=3)
D5: DDR2-533 (266MHz @ CL=4, tRCD=4,
tRP=4)
E6: DDR2-667 (333MHz @ CL=5, tRCD=5,
tRP=5)
F7: DDR2-800 (400MHz @ CL=6, tRCD=6,
tRP=6)
E7: DDR2-800 (400MHz @ CL=5, tRCD=5,
tRP=5)
DDR3 SDRAM
F7: DDR3-800 (400MHz @ CL=6, tRCD=6,
tRP=6)
F8: DDR3-1066 (533MHz @ CL=7, tRCD=7,
tRP=7)
G8: DDR3-1066 (533MHz @ CL=8, tRCD=8,
tRP=8)
H9: DDR3-1333 (667MHz @ CL=9, tRCD=9,
tRP=9)
K0: DDR3-1600 (800MHz @ CL=11, tRCD=11,
tRP=11)
MA: DDR3-1866 (933MHz @ CL=13, tRCD=13,
tRP=13)
NB: DDR3-2133 (1067MHz @ CL=14, tRCD=14,
tRP=14)
Graphics Memory
18: 1.8ns (550MHz)
04: 0.4ns (2500MHz)
20: 2.0ns (500MHz)
05: 0.5ns (2000MHz)
22: 2.2ns (450MHz)
5C: 0.56ns (1800MHz)
25: 2.5ns (400MHz)
06: 0.62ns (1600MHz)
2C: 2.66ns (375MHz)
6A: 0.66ns (1500MHz)
2A: 2.86ns (350MHz)
07: 0.71ns (1400MHz)
33: 3.3ns (300MHz)
7A: 0.77ns (1300MHz)
36: 3.6ns (275MHz)
08: 0.8ns (1200MHz)
40: 4.0ns (250MHz)
09: 0.9ns (1100MHz)
45: 4.5ns (222MHz)
1 : 1.0ns (1000MHz)
50/5A: 5.0ns (200MHz)
1 : 1.1ns (900MHz)
55: 5.5ns (183MHz)
12: 1.25ns (800MHz)
60: 6.0ns (166MHz)
14: 1.4ns (700MHz)
16: 1.6ns (600MHz)
SDRAM (Default CL=3)
50: 5.0ns (200MHz CL=3)
60: 6.0ns (166MHz CL=3)
67: 6.7ns
75: 7.5ns PC133 (133MHz CL=3)
XDR DRAM
A2: 2.4Gbps, 36ns, 16Cycles
B3: 3.2Gbps, 35ns, 20Cycles
C3: 3.2Gbps, 35ns, 24Cycles
C4: 4.0Gbps, 28ns, 24Cycles
DS: Daisychain Sample
Mobile-SDRAM
60: 166MHz, CL 3
75: 133MHz, CL 3
80: 125MHz, CL 3
1H: 105MHz, CL 2
1L: 105MHz, CL 3
15: 66MHz, CL 2 & 3
Mobile-DDR
C3: 133MHz, CL 3
C2: 100MHz, CL 3
C0: 66MHz, CL 3
Note: All Lead-free and Halogen-free products are in
compliance with RoHS
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Generation
Interface (VDD, VDDQ)
Number of Internal Banks
samsung.com/dram 11
DRAM
2H 2014 DRAM Ordering Information
MODULE DRAM ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11 12 13
M X XX T XX X X X X X X XX X
1. Memory Module: M
2. DIMM Type
3: DIMM
4: SODIMM
3. Data bits
12: x72 184pin Low Profile Registered DIMM
63: x63 PC100/PC133 μSODIMM with SPD for
144pin
64: x64 PC100/PC133 SODIMM with SPD for
144pin (Intel/JEDEC)
66: x64 Unbuffered DIMM with SPD for
144pin/168pin (Intel/JEDEC)
68: x64 184pin Unbuffered DIMM
70: x64 200pin Unbuffered SODIMM
71: x64 204pin Unbuffered SODIMM
74: x72/ECC Unbuffered DIMM with SPD for 168pin
(Intel/JEDEC)
77: x72/ECC PLL + Register DIMM with SPD for
168pin (Intel PC100)
78: x64 240pin Unbuffered DIMM
81: x72 184pin ECC unbuffered DIMM
83: x72 184pin Registered DIMM
90: x72/ECC PLL + Register DIMM
91: x72 240pin ECC unbuffered DIMM
92: x72 240pin VLP Registered DIMM
93: x72 240pin Registered DIMM
95: x72 240pin Fully Buffered DIMM with SPD for
168pin (JEDEC PC133)
4. DRAM Component Type
B: DDR3 SDRAM (1.5V VDD)
L: DDR SDRAM (2.5V VDD)
S: SDRAM
T: DDR2 SDRAM (1.8V VDD)
5. Depth
09: 8M (for 128Mb/512Mb)
17: 16M (for 128Mb/512Mb)
16: 16M
28: 128M
29: 128M (for 128Mb/512Mb)
32: 32M
33: 32M (for 128Mb/512Mb)
51: 512M
52: 512M (for 512Mb/2Gb)
56: 256M
57: 256M (for 512Mb/2Gb)
59: 256M (for 128Mb/512Mb)
64: 64M
65: 64M (for 128Mb/512Mb)
1G: 1G
1K: 1G (for 2Gb)
6. # of Banks in Comp. & Interface
1: 4K/64mxRef., 4Banks & SSTL-2
2 : 8K/64ms Ref., 4Banks & SSTL-2
2: 4K/64ms Ref., 4Banks & LVTTL (SDR Only)
5: 8K/64ms Ref., 4Banks & LVTTL (SDR Only)
5: 4Banks & SSTL-1.8V
6: 8Banks & SSTL-1.8V
7. Bit Organization
0: x 4
3: x 8
4: x16
6: x 4 Stack (JEDEC Standard)
7: x 8 Stack (JEDEC Standard)
8: x 4 Stack
9: x 8 Stack
8. Generation
A: 2nd Gen.
B: 3rd Gen.
C: 4th Gen.
D: 5th Gen.
E: 6th Gen.
F: 7th Gen.
G: 8th Gen.
M: 1st Gen.
Q: 17th Gen.
9. Package
E: FBGA QDP (Lead-free & Halogen-free)
G: FBGA
H: FBGA (Lead-free & Halogen-free)
J: FBGA DDP (Lead-free)
M: FBGA DDP (Lead-free & Halogen-free)
N: sTSOP
Q: FBGA QDP (Lead-free)
T: TSOP II (400mil)
U: TSOP II (Lead-Free)
V: sTSOP II (Lead-Free)
Z: FBGA (Lead-free)
10. PCB Revision
0: Mother PCB
1: 1st Rev
2: 2nd Rev.
3: 3rd Rev.
4: 4th Rev.
A: Parity DIMM
S: Reduced PCB
U: Low Profile DIMM
11. Temp & Power
C: Commercial Temp. (0°C ~ 95°C) & Normal
Power
L: Commercial Temp. (0°C ~ 95°C) & Low Power
12. Speed
CC: (200MHz @ CL=3, tRCD=3, tRP=3)
D5: (266MHz @ CL=4, tRCD=4, tRP=4)
E6: (333MHz @ CL=5, tRCD=5, tRP=5)
F7: (400MHz @ CL=6, tRCD=6, tRP=6)
E7: (400MHz @ CL=5, tRCD=5, tRP=5)
F8: (533MHz @ CL=7, tRCD=7, tRP=7)
G8: (533MHz @ CL=8, tRCD=8, tRP=8)
H9: (667MHz @ CL=9, tRCD=9, tRP=9)
K0: (800MHz @ CL=10, tRCD=10, tRP=10)
7A: (133MHz CL=3/PC100 CL2)
13. AMB Vendor for FBDIMM
0, 5: Intel
1, 6, 8: IDT
9: Montage
Note: All Lead-free and Halogen-free products are in
compliance with RoHS
SAMSUNG Memory
DIMM
Data bits
DRAM Component Type
Depth
Number of Banks
Bit Organization
AMB Vendor
Speed
Temp & Power
PCB Revision
Package
Generation
samsung.com/dram
12 2H 2014
1. Memory Module: M
2. DIMM Type
3: R/LRDIMM
4: SODIMM
3. Data bits
74: x72 260pin SODIMM
86: x72 288pin Load Reduced DIMM
93: x72 288pin Registered DIMM
4. DRAM Component Type
A: DDR4 SDRAM (1.2V VDD)
5. Depth
1G: 1G
2G: 2G
4G: 4G
8G: 8G
1K: 1G (for 8Gb)
2K: 2G (for 8Gb)
6. # of Banks in Comp. & Interface
4: 16Banks & POD-1.2V
7. Bit Organization
0: x 4
3: x 8
8. Component Revision
M: 1st Gen.
A: 2nd Gen.
B: 3rd Gen.
C: 4th Gen.
D: 5th Gen.
E: 6th Gen.
F: 7th Gen.
G: 8th Gen.
9. Package
B: FBGA (Halogen-free & Lead-free, Flip Chip)
M: FBGA (Halogen-free & Lead-free, DDP)
10. PCB Revision
0: None
1: 1st Rev.
2: 2nd Rev.
3: 3rd Rev.
4: 4th Rev.
11. Temp & Power
C: Commercial Temp. (0°C ~ 85°C) &
Normal Power
12. Speed
PB: DDR4-2133
(1066MHz @ CL=15, tRCD=15, tRP=15)
DDR4 SDRAM MODULE ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11 12
M X XX A XX X X X X X X XX
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
# of Banks in Comp. & Interface
Bit Organization
Speed
Temp & Power
PCB Revision
Package
Component Revision
DDR4 SDRAM Module Ordering Information
samsung.com/dram 13
DRAM
2H 2014
1. Samsung Memory: K
2. DRAM: 4
3. DRAM Type
A: DDR4 SDRAM
4. Density
4G: 4Gb
8G: 8Gb
5. Bit Organization
04: x4
08: x8
6. # of Internal Banks
5: 16Banks
7. Interface (Vdd, Vddq)
W: POD (1.2V, 1.2V)
8. Revision
M: 1st Gen.
A: 2nd Gen.
B: 3rd Gen.
C: 4th Gen.
D: 5th Gen.
E: 6th Gen.
F: 7th Gen.
G: 8th Gen.
H: 9th Gen.
9. Package Type
B: FBGA (Halogen-free & Lead-free, Flip Chip)
M: FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C: Commercial Temp. (0°C ~ 85°C) &
Normal Power
11. Speed
PB: DDR4-2133
(1066MHz @ CL=15, tRCD=15, tRP=15)
RC: DDR4-2400
(1200MHz @ CL=17, tRCD=17, tRP=17)
DDR4 SDRAM MEMORY ORDERING INFORMATION
1 2 3 4 5 6 7 8 9 10 11
K 4 A XX XX X X X X X XX
Samsung Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Revision
Interface (Vdd, Vddq)
#of Internal Banks
DDR4 SDRAM Memory Ordering Information
2H 2014 samsung.com/flash
14 Mainstream eMMC & High-Performance eMMC
MAINSTREAM eMMC
Density Flash MMC* Class Part Number Seq R/W Perf (MB/s) Random R/W IOPS Package Size (mm) Status
8GB 64Gb*1 5 200 KLM8G1WEPD-B0310** 130/7 5000/600 11.5 x 13.0 x 0.8 MP
16GB 64Gb*2 5 700 KLMAG2WEPD-B0310** 150/12 5000/1200 11.5 x 13.0 x 0.8 MP
32GB 64Gb*4 5 1500 KLMBG4WEBD-B0310** 250/45 TBD 11.5 x 13.0 x 1.0 Sampling Q1'15
64GB 64Gb*8 5 1500 KLMCG8WEBD-B0310** 250/45 TBD 11.5 x 13.0 x 1.0 Sampling Q1'15
128GB 64Gb*16 5 TBD TBD TBD TBD 11.5 x 13.0 x 1.4 Sampling Q1'15
*MMC5.0 is backwards compatible with 4.51 & 4.4 eMMC EVO > 1000 RW IOPS, eMMC PRO > 1000 RW IOPS
HIGH-PERFORMANCE eMMC
Density Flash MMC* Class Part Number Seq R/W Perf (MB/s) Random R/W IOPS Package Size (mm) Status
4GB 32Gb*1 5 700 KLM4G1FEPD-B0310** TBD TBD 11.0 x 10.0 x 0.8 Sampling Q1'15
8GB 64Gb*1 5 700 KLM8G1GEND-B0310** 160/25 5000/2500 11.5 x 13.0 x 1.0 MP
16GB 64Gb*2 5 2000 KLMAG2GEND-B0310** 230/50 6000/6000 11.5 x 13.0 x 1.0 MP
32GB 64Gb*4 5 2000 KLMBG4GEND-B0310** 250/100 6000/12000 11.5 x 13.0 x 1.0 MP
64GB 64Gb*8 5 2000 KLMCG8GEND-B0310** 250/100 6000/12000 11.5 x 13.0 x 1.0 MP
*MMC5.0 is backwards compatible with 4.51 & 4.41 ***Denotes bucket code for latest firmware patch
Specications
• Density: 4GB to 128GB
• Class: 200/700/1500/2000*
• Flash: 32Gb/64Gb
• Package Type: FBGA
• Package Size: 11x10mm, 11.5x13mm
• eMMC: 4.5/5.0
* Class = Random Write IOPS
Simple Block Diagram
LTE
Modem
uSD
Slot
AP +
DRAM
(POP)
Samsung
eMMC
Industry-Leading Smartphone and Tablet Design
• Industry’s fastest eMMC
• Fully-managed NAND
• Low active & standby power
• High density in small form factor
(11.5x13mm pkg)
• 4GB to 128GB capacities
• JEDEC standard MMC 4.51/5.0
• Leading edge 10nm-class NAND Flash
Performance Specs
32GB, 64GB eMMC 4.5 eMMC 5.0
Interface Speed 200MB/s 400MB/s
Random R/W 3500/2000 IOPS 6000/12000 IOPS
Sequential R/W 150/50 MB/s 250/100 MB/s
* Device performance condition: x8 Bus, Cache-On mode, without host overhead.
eMMC Key Features
Applications
Samsung offers a compact eMMC solution to fit the needs of any
mobile application category, ranging from high-end tablets and
smartphones to 4K gaming devices , set-top boxes, and Internet
of Things (iOT) devices.
New 10nm-class eMMC
2H 2014
samsung.com/flash 15
FLASH - SSD
Solid State Drives
SOLID STATE DRIVES (SSD)
Drive Type Drive
Name Interface Form Factor Connector Power-loss
Protection
Write
Endurance Density Part Number
Client PC/
Embedded
CM851 SATA III - 6Gb/s mSATA (MZM)
M.2 (MZA)
Mini PCIe
M.2 No PC Workload
16GB MZAPF016HCDD-00000
32GB
MZMPF032HCFV-00000
MZAPF032HCFV-00000
64GB MZMPF032HCFV-00000
PM851 SATA III - 6Gb/s
mSATA (MZM)
M.2 (MZN)
2.5" (MZ7)
Mini PCIe
M.2
SFF-8223
No PC Workload
128GB
MZMTE128HMGR-00000
MZNTE128HMGR-00000
MZ7TE128HMGR-00000
256GB
MZMTE256HMHP-00000
MZNTE256HMHP-00000
MZ7TE256HMHP-00000
512GB
MZMTE512HMHP-00000
MZNTE512HMJH-00000
MZ7TE512HMHP-00000
1024GB MZMTE1T0HMJH-00000
XP941 PCIe - SATAe M.2 M.2 No PC Workload
128GB MZHPU128HCGM-00004
256GB MZHPU256HCGL-00004
512GB MZHPU512HCGL-00004
Data Center
PM853T SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 0.3 DWPD
240GB MZ7GE240HMGR-00003
480GB MZ7GE480HMHP-00003
960GB MZ7GE960HMHP-00003
SM843Tn SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 1.8 DWPD
120GB MZ7WD120HCFV-00003
240GB MZ7WD240HCFV-00003
480GB MZ7WD480HCGM-00003
SV843 SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 3.6 DWPD
480GB MZ7WD480HMHP-00003
960GB MZ7WD960HMHP-00003
Enterprise
SM1635 SAS - 12Gb/s 2.5" 15mmT SFF-8680 Yes 10 DWPD
400GB MZIES400HMGR-00003
800GB MZIES800HMHP-00003
1600GB MZIES1T6HMJH-00003
XS1715 PCIe - NVMe 2.5" 15mmT SFF-8639 Yes
7.0 DWPD 400GB MZWEI400HAGM-00003
5.4 DWPD
800GB MZWEI800HAGM-00003
1600GB MZWEI1T6HAGP-00003
samsung.com/mcp
16 2H 2014Multi-Chip Packages
Samsung has a portfolio of eMCP products for a variety of devices, such as mobile
phones and tablets. The following illustration shows Samsung’s lineup of eMCP
memory solutions, which can be deployed in almost any application.
eMCP = eMMC + LPDDR2 or LPDDR3
Samsung eMCP product suite with dierent densities and types
of Mobile DRAM and eMMC
64GB
32GB
8GB
4GB
2GB
4G 6G 8G 12G 16G 24G
16GB
ROM
RAM
MCPs
samsung.com/mcp 17
2H 2014 Multi-Chip Packages
eMCP: eMMC + LPDDR2
Memory eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package
eMMC & MDRAM 4GB 4Gb (x32) 3.3V/1.8V - 1.8V/1.2V 162FBGA 11.5x13mm
eMCP: eMMC + LPDDR3
Memory eMMC Density DRAM Density/Organization Voltage (eMMC-DRAM) Package
eMMC & MDRAM
4GB 4Gb (x32) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
6Gb (x32) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
8GB
4Gb*2 (x32, 1CH, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
6Gb*2 (x32, 1CH, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
16GB
4Gb*2 (x32, 1CH, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
4Gb*4 (x32, 1CH, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
6Gb*4 (x32, 1CH, 2CS) 3.3V/1.8V - 1.8V/1.2V 221FBGA 11.5x13mm
18 samsung.com/flash-ssd samsungodd.com
2H 2014Solid State Drives
Samsung Solid State Drives
SATA SAS PCIe
STANDARD
DATA CENTER
SERIES
Read-Intensive
Environments
DELUXE
ENTERPRISE
SERIES
High-Write
Environments
ENTERPRISE
STORAGE
SERIES
High Redundancy
Environments
EXTREME
PERFORMANCE
SERIES
Data Cache
Environments
Samsung PM853T Samsung SV843 Samsung SM1635 Samsung XS1715
Form Factor 2.5 inches 2.5 inches 2.5 inches 2.5 inches
Capacity (GB) 240/480/960 480/960 400/800/1600 400/800/1600
Host Interface Serial ATA 3 (6 Gb/s) Serial ATA 3 (6 Gb/s) SAS 3 (12 Gb/s) PCIe Gen3 x4
MTBF 1.5 Million Hours 2.0 Million Hours 2.0 Million Hours 2.0 Million Hours
Uncorrectable
Bit Error Rate
(UBER)
1x1016 1x1017 1x1017 1x1017
Power
Consumption
(Active)
3.4W 2.9W 11.0W 25.0W
Power
Consumption
(Idle)
1.1W 1.0W 4.0W 8.0W
Random Read Up to 87,000 IOPS Up to 88,000 IOPS Up to 215,000 IOPS Up to 750,000 IOPS
Random Write
Up to 15,000 IOPS
(28% O/P: up to 35,000
IOPS)
Up to 14,000 IOPS
(28% O/P: up to 35,000
IOPS)
Up to 47,000 IOPS Up to 115,000 IOPS
Sequential Read Up to 530 MB/s Up to 530 MB/s Up to 1380 MB/s Up to 3000 MB/s
Sequential Write Up to 410 MB/s Up to 430 MB/s Up to 1300 MB/s Up to 1400 MB/s
Terabytes Written
(TBW)
Up to 665 TBW
Up to 0.3 DWPD
Up to 6,728 TBW
Up to 3.6 DWPD
Up to 29,200 TBW
Up to 10 DWPD
Up to 16,700 TBW
Up to 7 DWPD
Physical
Dimensions 100 x 70 x 7mm 100 x 70 x 7mm 100 x 70 x 15mm 100 x 70 x 15mm
Weight 63g 62g 140g 210g
Which SSD is right for you?
For more information, email: SSD@ssi.samsung.com
19
STORAGE
samsung.com/flash-ssd samsungodd.com 2H 2014 Solid State Drives
SOLID STATE DRIVES (SSD)
Drive Type Drive
Name Interface Form Factor Connector Power-loss
Protection
Write
Endurance Density Part Number
Client PC/
Embedded
CM851 SATA III - 6Gb/s mSATA (MZM)
M.2 (MZA) Mini PCIe - M.2 No PC Workload
16GB MZAPF016HCDD-00000
32GB
MZMPF032HCFV-00000
MZAPF032HCFV-00000
64GB MZMPF032HCFV-00000
PM851 SATA III - 6Gb/s
mSATA (MZM)
M.2 (MZN)
2.5" (MZ7)
Mini PCIe
M.2
SFF-8223
No PC Workload
128GB
MZMTE128HMGR-00000
MZNTE128HMGR-00000
MZ7TE128HMGR-00000
256GB
MZMTE256HMHP-00000
MZNTE256HMHP-00000
MZ7TE256HMHP-00000
512GB
MZMTE512HMHP-00000
MZNTE512HMJH-00000
MZ7TE512HMHP-00000
1024GB MZMTE1T0HMJH-00000
XP941 PCIe - SATAe M.2 M.2 No PC Workload
128GB MZHPU128HCGM-00004
256GB MZHPU256HCGL-00004
512GB MZHPU512HCGL-00004
Data Center
PM853T SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 0.3 DWPD
240GB MZ7GE240HMGR-00003
480GB MZ7GE480HMHP-00003
960GB MZ7GE960HMHP-00003
SM843Tn SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 1.8 DWPD
120GB MZ7WD120HCFV-00003
240GB MZ7WD240HCFV-00003
480GB MZ7WD480HCGM-00003
SV843 SATA III - 6Gb/s 2.5" 7mmT SFF-8223 Yes 3.6 DWPD
480GB MZ7WD480HMHP-00003
960GB MZ7WD960HMHP-00003
Enterprise
SM1635 SAS - 12Gb/s 2.5" 15mmT SFF-8680 Yes 10 DWPD
400GB MZIES400HMGR-00003
800GB MZIES800HMHP-00003
1600GB MZIES1T6HMJH-00003
XS1715 PCIe - NVMe 2.5" 15mmT SFF-8639 Yes
7.0 DWPD 400GB MZWEI400HAGM-00003
5.4 DWPD
800GB MZWEI800HAGM-00003
1600GB MZWEI1T6HAGP-00003
20 samsung.com/flash-ssd samsungodd.com
2H 2014Optical Disc Drives
Blu-ray SLIM
Interface Speed Type Loading Model
SATA BD Writer 6X Slim Tray SN-506BB
Blu-ray Writer SLIM EXTERNAL
Interface Speed Type Loading Model
USB 2.0 BD Writer 6X Slim Tray SE-506CB
DVD-W H/H
Interface Speed Type Loading Model
SATA DVD Write 24X H/H Tray SH-224FB
DVD-ROM H/H
Interface Speed Type Loading Model
SATA DVD Read 18X H/H Tray SH-118CB
DVD-W SLIM
Interface Speed Type Loading Model
SATA
DVD Write 8X Slim (12.7mm) Tray SN-208FB
DVD Write 8X Slim (9.5mm) Tray SU-208GB
DVD Write 8X Slim (9.0mm) Tray SU-228GB
DVD-W SLIM EXTERNAL
Interface Speed Type Loading Model
USB 2.0 DVD Write 8X Ultra Slim Tray
SE-218GN
SE-208GB
DISPLAYS
samsungdisplay.com 21
2H 2014 DID Panel Lineup, Tablets & Monitors
Public Information Display (PID) Product Classication
Why PID instead of TV?
COMMERCIAL (PID) CONSUMER (TV)
WARRANTY 18 months to 2 years 90 days to 1 year
RELIABILITY
Public environments
20+ hours daily duty cycle
Variety of temperatures & location
5-8 hour daily duty cycle
Designed for in-home use in controlled environment
In-home living room
PRODUCTION LIFECYCLE 24-36 months 12-15 months
PICTURE QUALITY
Designed to resist image retention
LCD backlight covers a wider color spectrum necessary for
PC source integration, giving better picture quality
AGAR coating for public viewing
120Hz / 240Hz for full-motion video
Designed for TV signals
Gloss surface treatment
LOCATION Most models portrait capable Can only be oriented in landscape mode
Product Segmentation
Type Class Warranty Bezel Suggested
Run Time Brightness Usage Applications Value Tier
Outdoor PID High Bright, Wide Temp 2 years Normal 20+ hours 2500-5000 nits Heavy Outdoor Premium commercial range
SNB / UNB Super / Ultra Narrow Bezel 2 years 3.9mm - 5.9mm
A-to-A 20+ hours 500-700 nits Heavy Video Walls Premium commercial range
Indoor PID Indoor Commercial Panels 2 years Narrow 20+ hours 600/700 nits Medium Semi-Outdoor Mid-price range
E-Board Value, Large Format 18 months Normal 12 hours 450 nits Daily Indoor, e-Board High-value commercial range
Super Narrow Bezel (SNB)/
Ultra Narrow Bezel (UNB)
» 500 - 700 nits Brightness
» AGAR Surface Treatment
» UNB: 3.9mm A-to-A
» SNB: 5.9mm A-to-A
» Video Wall
» Narrow Bezel
Indoor PID » 700 nits Brightness» 40"/46"/55"/75"
» Landscape Orientation
E-Board PID » AGAR Surface Treatment» 55"/70"/82" Edge LED
» High Brightness
Outdoor PID » 110°C Clearing Point» Full High Definition
Product Segmentation
HEAVY USE
LIGHT USE
Outdoor PID Restaurant Retail Digital Signage
• QSR Menu Boards
• Outdoor TV
• Wayfinding
• Outdoor Mall
• Street Furniture
• Mobile Signage
SNB / UNB Professional Indoor Events Billboard
• Control Room
• Simulation
• Scoreboard
• Sports Broadcasting
• Dynamic Signage
• Flagship Retail
Indoor PID Entertainment Transportation Communication Rental
• Casino
• Theatre
• Airport
• Train/Bus Station
• Conference Room • Rental
• Staging
E-Board PID Commercial Education Hospitality
• Kiosk
• Conference Systems
• Interactive FPD • Hotel Signage
samsungdisplay.com
22 2H 2014DID Panel Lineup, Tablets & Monitors
SAMSUNG PUBLIC INFORMATION DISPLAY (PID) PANEL LINEUP
Type Model Size Model
Resolution Bezel Backlight Brightness
(typical)
Contrast
Ratio
Response
Time Frequency MP* Comment
Outdoor
PID
LTI460HZ01 46" FHD Narrow D-LED 5,000 nits 4,000:1 8ms 60Hz Now High Bright, Hi Temp LC, 1/4λ Pol.
LTI460HF01 46" FHD Narrow D-LED 2,500 nits 5,000:1 8ms 60Hz Q4, '14 High Bright, Hi Temp LC, 1/4λ Pol.
LTI550HF04 55" FHD Narrow D-LED 2,500 nits 5,000:1 8ms 60Hz Q4, '14 High Bright, Hi Temp LC, 1/4λ Pol.
LTI750HF01 75" FHD Narrow D-LED 2,500 nits 5,000:1 8ms 60Hz Q4, '14 High Bright, Hi Temp LC, 1/4λ Pol.
SNB / UNB
LTI460HN01 46" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.9mm Active to Active, LED
LTI460HN09 46" FHD Super narrow D-LED 500 nits 3,000:1 8ms 60Hz Now 5.9mm Active to Active, LED
LTI460HN10 46" FHD Ultra narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 3.9mm Active to Active, LED
LTI460HN12 46" FHD Ultra narrow D-LED 500 nits 3,000:1 8ms 60Hz Q4, '14 3.9mm Active to Active, LED
LTI550HN01 55" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.9mm Active to Active, LED
LTI550HN08 55" FHD Super narrow D-LED 500 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active, LED
LTI550HN09 55" FHD Ultra narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 3.9mm Active to Active, LED
LTI550HN10 55" FHD Ultra narrow D-LED 500 nits 3,000:1 8ms 60Hz Q4, '14 3.9mm Active to Active, LED
Indoor PID
LTI400HA10 40" FHD Narrow eLED 700 nits 3,000:1 8ms 60Hz Now eLED, Landscape / Portrait
LTI460HN08 46" FHD Narrow eLED 700 nits 4,000:1 8ms 60Hz Now eLED, Landscape / Portrait
LTI550HN06 55" FHD Narrow eLED 700 nits 4,000:1 8ms 60Hz Now eLED, Landscape / Portrait
LTI550HN07 55" FHD Narrow eLED 450 nits 4,000:1 8ms 60Hz Now E-Board; Landscape/Portrait
NEW 75" FHD Normal D-LED 500 nits 3,500:1 8 ms 120Hz Q4, '14 120Hz, Landscape / Portrait
NEW 75" UHD Normal D-LED 500 nits 3,500:1 8 ms 240Hz Q4, '14 240Hz, Landscape / Portrait
E-Board
LTI700HA02 70" FHD Normal eLED 400 nits 4,000:1 8ms 60Hz Now E-Board; Landscape/Portrait
LTI820HA01 82" FHD Normal eLED 450 nits 3,000:1 8ms 60Hz Now E-Board; Landscape mode only
TABLETS
Size PN Mode Resolution H(RGB) V Aspect
Ratio PPI Brightness
(nits) MP
7" LTN070AL01 PLS WXGA 1280 800 16:10 216 400 EOL
LTL070NL01 PLS WSVGA 1024 600 16:9 170 400 Now
8.0" Open Cell LTL080AL01 PLS WXGA 1280 800 16:9 189 Open Cell Now
10.1" LTL101AL06 PLS WXGA 1280 800 16:10 149 400 Now
LTL101DL03 PLS WQXGA 2560 1600 16:10 300 370 Now
MONITORS
Size PN Mode Resolution H(RGB) V Aspect
Ratio PPI Brightness
(nits) MP
23" LTM230HL07 PLS FHD 1920 1080 16:9 96 300 Now
27"
LTM270HT03 TN FHD 1920 1080 16:9 82 300 Now
LTM270DL02 PLS QHD 2560 1440 16:9 109 300 Now
LTM270HL02 PLS FHD 1920 1080 16:9 82 350 Now
31.5" LTM315FL01 PLS UHD 3840 2160 16:9 140 350 Now
samsung.com/us/oem-solutions 23
CONTACTS
2H 2014
Adelsa | www.adetronics.com.mx
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Mexico
Guadalajara
Monterrey
Cd. Juarez
Reynosa
MEXICO
Hacienda Corralejo #80
Bosque de Echegaray
Naucalpan, Mexico 53310
52-555-560-5002 52-555-363-1010
GUADALAJARA
El Rosario #643
Jardines de Los Arcos
Guadalajara, Jal, CP 44500
52-333-122-3054 52-333-647-9611
MONTERREY
Lince #113
Cumbre Elite 8vo. Sector
Monterrey, NL. CP 64349
52-818-214-0011 52-818-214-0012
CD. JUAREZ
Rio Magdalena #4425
Fovissste Chamizal
Cd. Juarez, CH, CP 32310
52-656-613-3517
REYNOSA
Bravo #1040
Centro
Reynosa, Tam, CP 88500
52-899-922-5540
ATMI Sales | www.atmisales.com
PRODUCTS MAIN PHONE ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
British Columbia
Washington
Oregon
OREGON
4900 S.W. Griffith Drive
Suite 253
Beaverton, OR 97005
1-800-898-2446
503-643-8307
503-643-4364
WASHINGTON
8581 154th Ave. NE
Redmond WA 98052
425-869-7636 425-869-9841
Contacts
Feel free to contact your local distributor or sales representative with any Samsung sales inquiries.
Contacts
samsung.com/us/oem-solutions
24 2H 2014Contacts
Bear VAI Technology | www.bearvai.com
PRODUCTS TERRITORY ADRRESS MAIN PHONE FAX
Memory
SLSI
LCD
Michigan
Ohio
Western Pennsylvania
Kentucky
MAIN OFFICE - BRECKSVILLE, OHIO
6910 Treeline Drive
Unit H
Brecksville, OH 44141
440-526-1991 440-526-5426
MAIN OFFICE - INDIANA
11451 Overlook Drive
Fishers, IN 46037
440-832-7637 317-845-8650
SOUTHERN OHIO OFFICES
2676 Longwood Dr.
Beavercreek, OH 45431
440-526-1991 440-526-5426
58 E California Ave
Columbus, OH 43202
440-526-1991 440-526-5426
PITTSBURGH OFFICE
1975 Menold Dr.
Allison Park, PA 15101
440-526-1991 412-364-8776
MICHIGAN OFFICES
5506 Alpine Ridge
Stevensville, MI 49127
440-526-1991 440-526-5426
17426 Willow Ridge
Northville, MI 48168
312 Woodward Ave
Rochester, MI 48307
600 Broadway Ave NW #617
Grand Rapids, MI 49504
3120 Edgewood Park Dr.
Commerce Twp, MI 48382
Core Sales, Inc. | www.coresales.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Chicago
Milwaukee
901 Warrenville Road
Suite 211
Lisle, IL 60532
847-843-8888
Crestone Technology Group | www.crestonegroup.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Idaho
Montana
Wyoming
Utah
Colorado
COLORADO
7108 S. Alton Way
Building L
Centennial, CO 80112
303-280-7202 720-482-2220
UTAH
(home office based)
Customer 1st | www.customer1st.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
North Dakota
South Dakota
Nebraska
Kansas
Minnesota
Iowa
Missouri
Wisconsin (exclude Milwaukee)
Illinois (exclude Chicago)
MINNESOTA
2950 Metro Drive
Suite 101
Bloomington, MN 55425
952-851-7909 952-851-7907
KANSAS
2111 E. Crossroad Lane
#202
Olathe, KS 66062
samsung.com/us/oem-solutions 25
CONTACTS
2H 2014 Contacts
InTELaTECH | www.intelatech.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
Canada (exclude BC) ONTARIO - CANADA
5225 Orbitor Drive
Suite 2
905-629-0082 905-624-6909
905-629-1795
905-629-8910
21 Concourse Gate
Suite 12
Ottawa, ONT K2E 7S4
905-629-0082 613-221-9160
ALBERTA - CANADA
1925-18th Ave NE
Suite #115
Calgary, Alberta T2E 7T8
905-629-0082 403-686-6926
QUEBEC - CANADA
620 St-Jean Blvd
Suite 202
Pointe Claire Quebec H9R 3K2
905-629-0082 905-629-0082
BRITISH COLUMBIA - CANADA
5811 Cooney Road
Suite 305, South Tower
Vancouver, BC V5X 3M1
905-629-0082 905-629-1795
I-Squared Incorporated | www.isquared.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Northern California
Nevada
2635 N. 1st Street
Suite 128
San Jose, CA 95134
408-988-3400 408-988-2079
1250 B Street
Petaluma, CA 94952
Neptune Electronics (necco) | www.neccoelect.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Southern New York
Eastern Pennsylvania
West Virginia
Virginia
Maryland
Delaware
New Jersey
Washington D.C.
11 Oval Drive
Suite 169
Islandia, NY 11749
631-234-2525 631-234-2707
New Elpis, Inc. | www.newelpis.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
LCD Canada (exclude BC) 2550 Matheson Blvd.
E. Unit 129
Mississauga, ONT
Canada L4W 4Z1
905-275-4109
samsung.com/us/oem-solutions
26 2H 2014
New Tech Solutions
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Maine
New Hampshire
Vermont
Massachusetts
Rhode Island
Connecticut
26 Ray Avenue
Burlington, MA 01803
781-229-8888
585-204-2183
781-229-1614
Rep One Associates, Inc. | www.repone.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
North Carolina
South Carolina
Georgia
Alabama
MIssissippi
Florida
ALABAMA
303 Williams Ave
Suite 1011
Huntsville, AL 35801
GEORGIA
3000 Langford Rd
Bldg 300
Norcross, GA 30071
770-209-9242
678-591-6753
770-209-9245
NORTH CAROLINA
5540 Centerview Dr
Suite 200
Raleigh, NC 27606
919-424-3866
10800 Sikes Place
Suite 300
Charlotte, NC 28277
704-846-5744
FLORIDA
(home office based)
Tech Coast Sales | www.tc-sales.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Arizona/New Mexico
Los Angeles, CA
Orange County Area, CA
San Diego, CA
Southern Nevada
MAIN OFFICE
23121 Verdugo Drive
Suite 101
Laguna Hills, CA 92653
949-305-6869 949-305-4073
818-715-1012
818-597-1770
West Associates | www.westassociates.com
PRODUCTS TERRITORY ADDRESS MAIN PHONE FAX
Memory
SLSI
LCD
Oklahoma
Texas
Louisiana
Arkansas
AUSTIN / SAN ANTONIO
4100 Duval Rd
Bld 1, Ste 102
Austin, TX 78759
512-343-1199 512-343-1922
DALLAS / OKLAHOMA / ARKANSAS
2745 Dallas Pkwy
Ste 460
Plano, TX 75093
972-680-2800 972-699-0330
HOUSTON / VALLEY / LOUISIANA
24624 Interstate 45 North
Ste 200
Spring, TX 77386
512-343-1199 512-343-1922
Contacts
For all product information please visit:
samsung.com/us/oem-solutions
To access our online sales portal, visit: https://smarttools.ssi.samsung.com
samsung.com/us/oem-solutions 27
CONTACTS
2H 2014 Contacts
Notes
Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible
errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specications
with the intent to improve function or design at any time and without notice and is not required to update this documentation to reect such changes. This publication does not convey to
a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specically disclaims any and all
liability, including without limitation any consequential or incidental damages.
Copyright 2014. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. Ultrabooks is a trademark of Intel Corporation. All other names and
brands may be claimed as the property of others. The appearance of all products, dates, gures, diagrams and tables are subject to change at any time, without notice.
BR-14-ALL-001 | Printed 10/14
Samsung Semiconductor, Inc.
601 McCarthy Boulevard
Milpitas, CA 95035
samsung.com/us/oem-solutions
PRODUCT
SELECTION
GUIDE
Displays, Memory and Storage
2H 2014
CONTaCTS DISPLayS STORaGE MCP FLaSh - SSD